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TIBPAL16L8-7CN

Texas Instruments

TIBPAL16L8-7CN by Texas Instruments

TIBPAL16L8-7CN by Texas Instruments is a TTL technology PAL-type PLD with 9ns propagation delay, 5.25V max supply voltage, and 64 product terms. Ideal for applications requiring combinatorial output functions, it features 10 dedicated inputs and 6 I/O lines in a rectangular package with through-hole terminals.

Median Price

$15.685

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Component Electronics Inc.

Canada . 6 parts In-Stock

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$5.380

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$4.040

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NAC Semi

USA . 9 parts In-Stock

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Digiode

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MRC Electronics

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Vyrian

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J & M Industries LLC

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A2Z Electronics, Inc.

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Bristol Electronics

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Speed Components Ltd

Israel . 48 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 45 parts In-Stock

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Q Components

USA . 33 parts In-Stock

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ACDS - Activité Composants Distribution Service

France . 19 parts In-Stock

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Holdelec - ElecDif-Pro

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Sensible Micro Corp

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QIE Inc.

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ECAB

Sweden . 17 parts In-Stock

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EPE Components Inc.

USA . 13 parts In-Stock

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Whistler Technology

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Corel Iberica Componentes, S.L.

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Classic Components Corporation

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Semtec, LLC

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A&K Electronics

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Inland Empire Components Inc.

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Sogenti Electronics

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Distributors (Availability)

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AZTECH Wire

Italy . 461 parts In-Stock

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$9.034

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One Stop Electronics

USA . 230 parts In-Stock

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$24.000

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Component Stockers USA

USA . 6 parts In-Stock

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$25.060

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Parana Technologies

USA . 401 parts In-Stock

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$132.568

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DigiPath Technology Company

USA . 1,497 parts In-Stock

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$145.974

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$134.296

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ChromeModa Solutions

Germany . 2,067 parts In-Stock

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$148.953

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$122.141

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IDEA Electronic Components Group

UK . 1,040 parts In-Stock

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$148.953

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$141.505

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$134.058

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Corphita

USA . 768 parts In-Stock

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Assy Fe

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GreenTree Electronics

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Overview

Unlock the power of programmable logic with the TIBPAL16L8-7CN by Texas Instruments! Crafted with precision and expertise, this PAL-type device offers unparalleled performance and reliability in a variety of applications. From industrial automation to consumer electronics, this PLD can handle it all with ease. Experience lightning-fast processing speeds and seamless integration thanks to its innovative TTL technology. Trust in Texas Instruments for quality you can count on. Elevate your projects and streamline your workflow with the TIBPAL16L8-7CN today!

Feature Benefit Bullets

Propagation Delay: 9 ns

The low propagation delay of 9 ns ensures high-speed performance and quick response times, making this product ideal for applications requiring fast processing.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage of 5.25V allows for a wider operating range and flexibility in power supply options, making this product versatile for different power requirements.

No. of Inputs: 16

With a high number of inputs (16), this product offers ample connectivity options and can accommodate complex logic designs, making it suitable for advanced programmable logic applications.

Technology Used: TTL

The use of TTL technology ensures compatibility with TTL logic levels, making integration with existing systems seamless and enhancing reliability.

Maximum Clock Frequency: 74 MHz

The high maximum clock frequency of 74 MHz enables efficient operation at high speeds, making this product suitable for applications requiring rapid data processing and real-time operation.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-7CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

74 MHz

Propagation Delay:

9 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.325 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16L8-7CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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