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TIBPAL16R6-10CFN

Texas Instruments

TIBPAL16R6-10CFN by Texas Instruments

TIBPAL16R6-10CFN by Texas Instruments is a TTL technology PAL-type PLD with 10ns propagation delay, 64 product terms, and 55.5MHz max clock frequency. Ideal for applications requiring mixed output functions, it features 8 dedicated inputs and 2 I/O lines in a square chip carrier package.

Median Price

$1.863

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 751 parts In-Stock

1+ parts

-

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$1.660

1k+ parts

$1.490

10k+ parts

$1.400

751

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$1.660

$1.490

$1.400

DigiKey

USA . 751 parts In-Stock

1+ parts

-

100+ parts

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$1.910

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751

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$1.910

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Verical

USA . 322 parts In-Stock

1+ parts

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-

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$1.863

10k+ parts

$1.750

322

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-

$1.863

$1.750

Distributors (In-Stock)

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Digiode

USA . 573 parts In-Stock

1+ parts

$1.748

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$1.748

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Vyrian

USA . 5,317 parts In-Stock

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Corel Iberica Componentes, S.L.

Spain . 188 parts In-Stock

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Bristol Electronics

USA . 135 parts In-Stock

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Prism Electronics

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Electro Mavin

USA . 10 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 3,186 parts In-Stock

1+ parts

$1.656

100+ parts

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$1.656

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Parana Technologies

USA . 1,878 parts In-Stock

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$62.027

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$62.027

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DigiPath Technology Company

USA . 1,101 parts In-Stock

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$68.299

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$62.835

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1,101

$68.299

$62.835

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IDEA Electronic Components Group

UK . 1,541 parts In-Stock

1+ parts

$69.693

100+ parts

$66.208

1k+ parts

$62.724

10k+ parts

-

1,541

$69.693

$66.208

$62.724

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ChromeModa Solutions

Germany . 625 parts In-Stock

1+ parts

$69.693

100+ parts

$57.148

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$69.693

$57.148

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Assy Fe

Spain . 688 parts In-Stock

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Microchip USA

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Perfect Parts

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Overview

Unlock the power of advanced technology with the TIBPAL16R6-10CFN by Texas Instruments. Designed to deliver top-notch performance in Programmable Logic Devices, this versatile product offers a wide range of applications and benefits for customers. With a reputation for quality and reliability, Texas Instruments ensures that you get the best value for your investment. Whether you need fast propagation delay, mixed output functions, or dedicated inputs, this PAL-type IC has got you covered. Experience seamless integration and superior functionality with the TIBPAL16R6-10CFN - your go-to solution for cutting-edge electronic systems.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides good insulation and protection for the internal components of the PLD.

Propagation Delay: 10 ns

Quick response time ensures efficient operation of the PLD.

Maximum Supply Voltage: 5.25 V

Allows for a wide range of voltage inputs for compatibility with various systems.

No. of Inputs: 10

Provides flexibility for connecting multiple input signals to the PLD.

Technology Used: TTL

TTL technology offers high speed and low power consumption for improved performance.

No. of Outputs: 6

Offers multiple output options for connecting to different components in the system.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R6-10CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 2 I/O

No. of Outputs:

6

Output Function:

Mixed

No. of Inputs:

10

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

2

Maximum Clock Frequency:

55.5 MHz

Propagation Delay:

10 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset; Register Preload

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Width:

8.9662 mm

Length:

8.9662 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16R6-10CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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