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TIBPAL16R4-10CN

Texas Instruments

TIBPAL16R4-10CN by Texas Instruments

TIBPAL16R4-10CN by Texas Instruments is a TTL technology PAL-type PLD with 10ns propagation delay and 5.25V max supply voltage. It features 12 inputs, 8 dedicated inputs, and 8 outputs in a rectangular package for applications requiring mixed output functions at up to 55.5MHz clock frequency.

Median Price

$0.830

Lifecycle Status

Suppliers In-Stock

29

In-Stock Inventory

1k+

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Rochester

USA . 11 parts In-Stock

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$0.830

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$0.810

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$0.800

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American Microsemiconductor Inc.

USA . 100 parts In-Stock

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Digiode

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Freelance Electronics

USA . 40 parts In-Stock

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Ace Electronics

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Vyrian

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Electronic Expediters

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Cyclops Electronics Ltd

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Bristol Electronics

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Dan-Mar Components

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Prism Electronics

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LWI Electronics Inc

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A2Z Electronics, Inc.

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ECAB

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Q Components

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Corel Iberica Componentes, S.L.

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Semi Source

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Sea View Technologies

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Microfarads

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Resion

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Mentor Electronics Marketing, LLC

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Electronics Depot

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Sinequanon

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Sunrise Surplus Inc.

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Pegasus Components GmbH

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ABC Electronics Ltd.

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Elcom Components

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LittleDiode

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Corphita

USA . 3,044 parts In-Stock

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AZTECH Wire

Italy . 449 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

USA . 1,882 parts In-Stock

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IDEA Electronic Components Group

UK . 1,289 parts In-Stock

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$132.159

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ChromeModa Solutions

Germany . 624 parts In-Stock

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Perfect Parts

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Microchip USA

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Overview

Unlock the power of cutting-edge technology with the TIBPAL16R4-10CN by Texas Instruments, a top-tier manufacturer known for quality and innovation. This Programmable Logic Device offers unmatched versatility and reliability in a wide range of applications. With lightning-fast propagation delay of just 10 ns and a maximum supply voltage of 5.25 V, this PLD is designed to deliver superior performance. Whether you're looking to streamline your data processing or enhance your automation systems, the TIBPAL16R4-10CN is the solution you need. Experience the value and benefits of this exceptional product today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material ensures that the package is durable and able to withstand various environmental conditions.

Propagation Delay: 10 ns

Low propagation delay of 10 ns enables fast signal processing and high-speed performance.

Maximum Supply Voltage: 5.25 V

High maximum supply voltage of 5.25 V allows for flexibility in power input.

Technology Used: TTL

TTL technology is known for its low power consumption and compatibility with a wide range of systems.

No. of Inputs: 12

Having 12 inputs provides ample connectivity options for integration with other devices.

Package Shape: RECTANGULAR

Rectangular shape allows for efficient placement and layout within electronic systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections for long-term performance.

Architecture: PAL-TYPE

PAL-type architecture offers programmability and customization for specific application requirements.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power sources.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation of the device.

No. of Terminals: 20

Having 20 terminals provides adequate connectivity for input and output signals.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R4-10CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 4 I/O

No. of Outputs:

8

Output Function:

Mixed

No. of Inputs:

12

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

4

Maximum Clock Frequency:

55.5 MHz

Propagation Delay:

10 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset; Register Preload

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.325 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16R4-10CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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