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TIBPAL16R6-30MJ

Texas Instruments

TIBPAL16R6-30MJ by Texas Instruments

TIBPAL16R6-30MJ by Texas Instruments is a TTL technology PAL-type PLD with 30 ns propagation delay and 5.5 V max supply voltage. Ideal for military applications, it features 10 inputs, 64 product terms, and mixed output function in a ceramic package with MIL-STD-883 screening.

Median Price

$26.750

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 8 parts In-Stock

1+ parts

-

100+ parts

$26.750

1k+ parts

$23.940

10k+ parts

$22.530

8

-

$26.750

$23.940

$22.530

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,613 parts In-Stock

1+ parts

$24.558

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2,613

$24.558

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Vyrian

USA . 4,548 parts In-Stock

1+ parts

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4,548

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ECAB

Sweden . 35 parts In-Stock

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35

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Distributors (Availability)

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AZTECH Wire

Italy . 191 parts In-Stock

1+ parts

$10.800

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191

$10.800

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Corphita

USA . 4,935 parts In-Stock

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$23.265

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4,935

$23.265

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Component Stockers USA

USA . 7 parts In-Stock

1+ parts

$28.150

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7

$28.150

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Microchip USA

USA . 2,414 parts In-Stock

1+ parts

$60.630

100+ parts

$59.570

1k+ parts

$59.050

10k+ parts

$58.520

2,414

$60.630

$59.570

$59.050

$58.520

Parana Technologies

USA . 99 parts In-Stock

1+ parts

$119.127

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99

$119.127

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DigiPath Technology Company

USA . 525 parts In-Stock

1+ parts

$131.174

100+ parts

$120.680

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525

$131.174

$120.680

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ChromeModa Solutions

Germany . 5,020 parts In-Stock

1+ parts

$133.851

100+ parts

$109.758

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5,020

$133.851

$109.758

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IDEA Electronic Components Group

UK . 1,697 parts In-Stock

1+ parts

$133.851

100+ parts

$127.158

1k+ parts

$120.466

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1,697

$133.851

$127.158

$120.466

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Authorized Procurement Solutions

USA . 10,000 parts In-Stock

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Perfect Parts

USA . 25 parts In-Stock

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Overview

Unlock endless possibilities with the TIBPAL16R6-30MJ from Texas Instruments, a top-tier manufacturer of cutting-edge Programmable Logic Devices (PLDs). This versatile device boasts a ceramic, glass-sealed package body material and a lightning-fast 30 ns propagation delay, making it ideal for a wide range of applications. Whether you're designing high-performance electronics or tackling complex projects, this PAL-type PLD offers unmatched reliability and efficiency. Experience seamless integration, superior performance, and unparalleled value with the TIBPAL16R6-30MJ. Elevate your designs to new heights with Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package provides durability and protection for the PLD, making it suitable for various operating environments.

Propagation Delay: 30 ns

The low propagation delay ensures fast processing and response times in the circuit, enhancing the overall performance of the PLD.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature, this PLD can withstand and function reliably in harsh thermal conditions without compromising its performance.

Technology Used: TTL

The TTL technology ensures compatibility with a wide range of existing systems and devices, making integration seamless and straightforward.

No. of Outputs: 6

Having 6 outputs allows for versatility in programming and controlling different external devices or components, expanding the functionality of the PLD.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R6-30MJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

8 Dedicated Inputs, 2 I/O

No. of Outputs:

6

Output Function:

Mixed

No. of Inputs:

10

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

2

Maximum Clock Frequency:

25 MHz

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.195 mm

Maximum Seated Height:

5.08 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Tin/Lead

Standards

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16R6-30MJ Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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