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TIBPAL16R8-15CFN

Texas Instruments

TIBPAL16R8-15CFN by Texas Instruments

TIBPAL16R8-15CFN by Texas Instruments is a TTL technology PAL-type PLD with 12ns propagation delay, 64 product terms, and 50MHz max clock frequency. Ideal for applications requiring fast logic operations in programmable logic devices.

Median Price

$1.480

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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Rochester

USA . 53 parts In-Stock

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-

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$1.480

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$1.230

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$1.100

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$1.100

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Digiode

USA . 1,862 parts In-Stock

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Freelance Electronics

USA . 15 parts In-Stock

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$5.779

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$6.067

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$5.721

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15

$5.779

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$5.721

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Vyrian

USA . 4,543 parts In-Stock

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Cyclops Electronics Ltd

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ComSIT Distribution GmbH

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Q Components

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Beltway Electronics Company

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A&K Electronics

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Rotakorn

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Bristol Electronics

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Semi Source

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Prism Electronics

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Resion

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Corphita

USA . 1,058 parts In-Stock

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$1.089

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AZTECH Wire

Italy . 705 parts In-Stock

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$8.600

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Parana Technologies

USA . 1,304 parts In-Stock

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$64.243

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DigiPath Technology Company

USA . 756 parts In-Stock

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$70.739

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$65.080

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ChromeModa Solutions

Germany . 2,866 parts In-Stock

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$72.183

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$59.190

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IDEA Electronic Components Group

UK . 1,031 parts In-Stock

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$68.574

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$64.965

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A-Z Elektronik GmbH

Germany . 7,065 parts In-Stock

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Microchip USA

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Assy Fe

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Perfect Parts

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Overview

Upgrade your electronic projects with the TIBPAL16R8-15CFN by Texas Instruments, a top-quality Programmable Logic Device that offers unmatched performance and reliability. Manufactured by industry leader Texas Instruments, this PLD is perfect for a wide range of applications. With a fast propagation delay of 12 ns and a maximum clock frequency of 50 MHz, this chip provides lightning-fast response times. The TIBPAL16R8-15CFN also boasts a wide range of inputs and outputs, making it ideal for complex digital designs. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection to the internal components, making the product suitable for various environments.

Propagation Delay: 12 ns

Low propagation delay ensures fast data processing and high performance of the device.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage tolerance allows for flexibility in power supply options.

Technology Used: TTL

TTL technology provides reliable and efficient logic operations, ensuring accurate output results.

No. of Inputs: 8

Having 8 inputs allows for multiple data inputs, increasing the versatility and functionality of the device.

Nominal Supply Voltage (V): 5

Stable nominal supply voltage of 5V ensures consistent and reliable operation of the device.

Output Function: REGISTERED

Registered outputs help in reducing output skew and improving signal integrity, making the product suitable for high-speed applications.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency enables fast data processing and real-time operations in time-sensitive applications.

No. of Outputs: 8

Having 8 outputs allows for multiple data outputs, enhancing the flexibility and usability of the device.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R8-15CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 0 I/O

No. of Outputs:

8

Output Function:

Registered

No. of Inputs:

8

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

0

Maximum Clock Frequency:

50 MHz

Propagation Delay:

12 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Width:

8.965 mm

Length:

8.965 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16R8-15CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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