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TIBPAL16L8-15CN

Texas Instruments

TIBPAL16L8-15CN by Texas Instruments

TIBPAL16L8-15CN by Texas Instruments is a TTL technology PAL-type PLD with 15ns propagation delay, 5.25V max supply voltage, and 64 product terms. It features 10 dedicated inputs, 6 I/O lines, and operates at up to 50MHz clock frequency. Ideal for applications requiring combinatorial output functions in commercial extended temperature environments.

Median Price

$5.950

Lifecycle Status

Suppliers In-Stock

41

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1k+

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American Microsemiconductor Inc.

USA . 142 parts In-Stock

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Prism Electronics

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MRC Electronics

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Electronic Expediters

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Quantum Digital Technology

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Beltway Electronics Company

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ECAB

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Corel Iberica Componentes, S.L.

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Global Solutions Electronics Company

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EMSNET

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J & M Industries LLC

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Semtec, LLC

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ComSIT Distribution GmbH

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Manoshevitz Elec. Sales

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Mentor Electronics Marketing, LLC

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Florida Circuit

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LWI Electronics Inc

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Carlin Systems, Inc.

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Connector Distribution Corp

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Right Parts Inc.

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Pegasus Components GmbH

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North Shore Components

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LittleDiode

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Mil-Aero Solutions, Inc.

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Rotakorn

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Zilex Electronics Inc.

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Fibra_Brandt Electronic GMBH

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One Stop Electronics

USA . 1,414 parts In-Stock

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AZTECH Wire

Italy . 539 parts In-Stock

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 4,092 parts In-Stock

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IDEA Electronic Components Group

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Lixinc

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A-Z Elektronik GmbH

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Corphita

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Futuretech Components

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Microchip USA

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Assy Fe

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Cyclops Electronics Ltd (Excess)

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Giza Technologies, Inc.

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iodParts Technologies Inc.

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Speed Components Ltd (Excess)

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A-Plus Industry Inc.

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Overview

Unlock the potential of your electronic designs with the TIBPAL16L8-15CN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments guarantees top-quality programmable logic devices like this one for various applications. With its fast propagation delay and versatile architecture, this PLD offers unmatched performance and reliability. Trust in Texas Instruments to deliver cutting-edge technology that meets your design needs and exceeds your expectations every time. Elevate your projects with the TIBPAL16L8-15CN and experience the difference today.

Feature Benefit Bullets

Propagation Delay: 15 ns

Low propagation delay ensures fast processing speed, making this PLD suitable for time-critical applications.

Maximum Supply Voltage: 5.25 V

Higher maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

No. of Inputs: 16

Having 16 inputs provides ample connectivity options, allowing for versatile input configurations.

Output Function: COMBINATORIAL

Combinatorial output function enables the generation of complex logic functions, increasing the capability of the PLD.

Maximum Clock Frequency: 50 MHz

High maximum clock frequency allows for rapid processing of signals and data, suitable for high-speed applications.

No. of Outputs: 8

Having 8 outputs provides flexibility in routing signals and controlling multiple devices, enhancing the versatility of the PLD.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-15CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

50 MHz

Propagation Delay:

15 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

25.4 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16L8-15CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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