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TIBPAL22V10ACNT

Texas Instruments

TIBPAL22V10ACNT by Texas Instruments

TIBPAL22V10ACNT by Texas Instruments is a TTL technology PAL-type PLD with 22 inputs, 10 I/O lines, and 10 outputs. It has a propagation delay of 25 ns, operates at a max clock frequency of 28.5 MHz, and is commonly used in commercial extended temperature applications.

Median Price

$10.000

Lifecycle Status

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AZTECH Wire

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One Stop Electronics

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Component Stockers USA

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Overview

Unlock the power of advanced technology with the TIBPAL22V10ACNT by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality and reliability. The Programmable Logic Devices (PLD) category offers endless possibilities for customization and optimization for your specific needs. With a maximum clock frequency of 28.5 MHz and a propagation delay of just 25 ns, this product provides lightning-fast performance. Whether you're designing circuits for industrial automation or consumer electronics, the TIBPAL22V10ACNT offers unmatched value, efficiency, and versatility to meet all your project requirements. Experience the difference today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material is commonly used for electronic components as it provides good insulation and protection for the internal circuitry.

Propagation Delay: 25 ns

The low propagation delay ensures fast processing of signals, making this PLD suitable for high-speed applications.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with other components.

Technology Used: TTL

TTL technology is known for its high speed and low power consumption, making this PLD efficient in performance.

No. of Inputs: 22

With a high number of inputs, this PLD can accommodate complex logic functions and process multiple signals simultaneously.

Package Shape: RECTANGULAR

The rectangular shape is commonly used for easy integration into electronic circuits and PCB designs.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide strong mechanical support and solder connections, ensuring reliable operation in various environments.

Architecture: PAL-TYPE

PAL-type architecture offers flexibility in programmability and customization for specific logic functions.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V is standard in many electronic systems, making this PLD compatible with a wide range of applications.

Power Supplies (V): 5

Consistent power supply at 5V ensures stable operation and performance of the PLD.

No. of Terminals: 24

Having a sufficient number of terminals allows for easy connectivity and integration within a larger system.

Programmable IC Type: OT PLD

The programmable nature of this PLD allows for dynamic reconfiguration and adaptability to changing logic requirements.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient and suitable for applications with limited board space.

Output Function: MACROCELL

Macrocell functionality provides reconfigurable logic elements that can adapt to different output requirements.

No. of Product Terms: 132

A high number of product terms allows for complex logic operations and versatile programming options.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage ensures compatibility with a wide range of power sources and operational stability.

Maximum Operating Temperature: 75 °C

With a high maximum operating temperature, this PLD can withstand elevated temperatures and harsh environmental conditions.

Pitch Of Terminal: 2.54 mm

The standard pitch of 2.54mm enables easy soldering and connection to other components on a PCB.

Organization: 11 DEDICATED INPUTS, 10 I/O

This organization structure allows for separate dedicated inputs and flexible I/O options for versatile logic configurations.

No. of Dedicated Inputs: 11

Having dedicated inputs allows for specific signal handling and processing, enhancing the efficiency of the PLD.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature ensures reliable performance in a variety of environmental conditions.

Finishing Of Terminal Used: NICKEL PALLADIUM GOLD

The use of nickel palladium gold finishing on terminals provides excellent conductivity and corrosion resistance for long-lasting performance.

Position Of Terminal: DUAL

Dual terminal positioning offers redundancy and improved electrical connections for increased reliability.

Maximum Seated Height: 5.08 mm

The low maximum seated height makes this PLD suitable for compact electronic designs and space-constrained applications.

Width: 7.62 mm

The compact width of 7.62mm allows for easy integration into PCB layouts and efficient use of board space.

Maximum Clock Frequency: 28.5 MHz

With a high maximum clock frequency, this PLD can process logic operations at high speeds, making it ideal for real-time applications.

No. of Outputs: 10

With 10 output options, this PLD can drive multiple external devices and provide a variety of logic signals.

Length: 31.64 mm

The moderate length of 31.64mm allows for easy placement and routing of connections in electronic systems.

No. of I/O Lines: 10

Having 10 I/O lines allows for versatile input/output configurations and connectivity to external devices.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures reliable operation over a wide range of temperature conditions, making this PLD suitable for industrial applications.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL22V10ACNT attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

11 Dedicated Inputs, 10 I/O

No. of Outputs:

10

Output Function:

Macrocell

No. of Inputs:

22

No. of Product Terms:

132

No. of Dedicated Inputs:

11

No. of I/O Lines:

10

Maximum Clock Frequency:

28.5 MHz

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

PAL with Macrocells; 10 Macrocells; 1 External Clock; Shared Input/Clock

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Width:

7.62 mm

Length:

31.64 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL22V10ACNT Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

NSN

5962-01-382-7249, 5962013827249

NIIN

013827249

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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