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TIBPAL16R6-7CFN

Texas Instruments

TIBPAL16R6-7CFN by Texas Instruments

TIBPAL16R6-7CFN by Texas Instruments is a TTL technology-based PAL-type PLD with 10 inputs, 64 product terms, and 6 outputs. It operates at a max clock frequency of 74 MHz and has a propagation delay of 9 ns. This programmable IC in chip carrier package is ideal for applications requiring mixed output functions and commercial extended temperature grading.

Median Price

$5.350

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 794 parts In-Stock

1+ parts

-

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$4.630

1k+ parts

$4.140

10k+ parts

$3.900

794

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$4.630

$4.140

$3.900

DigiKey

USA . 794 parts In-Stock

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$5.350

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$5.350

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Verical

USA . 260 parts In-Stock

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$5.787

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$5.175

10k+ parts

$4.875

260

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$5.787

$5.175

$4.875

Distributors (In-Stock)

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Digiode

USA . 3,461 parts In-Stock

1+ parts

$4.883

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3,461

$4.883

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Vyrian

USA . 8,852 parts In-Stock

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DigiKey Marketplace

USA . 794 parts In-Stock

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794

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Inland Empire Components Inc.

USA . 414 parts In-Stock

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Resion

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Mentor Electronics Marketing, LLC

USA . 346 parts In-Stock

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Distributors (Availability)

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Corphita

USA . 2,378 parts In-Stock

1+ parts

$4.626

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2,378

$4.626

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Parana Technologies

USA . 785 parts In-Stock

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$122.466

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785

$122.466

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DigiPath Technology Company

USA . 1,264 parts In-Stock

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$134.850

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$124.062

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1,264

$134.850

$124.062

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ChromeModa Solutions

Germany . 1,424 parts In-Stock

1+ parts

$137.602

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$112.834

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1,424

$137.602

$112.834

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IDEA Electronic Components Group

UK . 1,406 parts In-Stock

1+ parts

$137.602

100+ parts

$130.722

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$123.842

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1,406

$137.602

$130.722

$123.842

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A-Z Elektronik GmbH

Germany . 6,684 parts In-Stock

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6,684

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Microchip USA

USA . 338 parts In-Stock

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Kepictronics

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Overview

Unlock unlimited possibilities with the TIBPAL16R6-7CFN by Texas Instruments, a top-tier manufacturer known for its high-quality programmable logic devices. This versatile PLD offers lightning-fast propagation delay of 9 ns and operates at a nominal supply voltage of 5V, making it perfect for a wide range of applications. With 64 product terms and mixed output function, this PAL-type device allows for efficient customization and flexibility in your designs. Discover the value and benefits of this innovative technology today!

Feature Benefit Bullets

Propagation Delay: 9 ns

Low propagation delay ensures fast operation and high performance of the device.

Maximum Supply Voltage: 5.25 V

Allows for a higher supply voltage which can be beneficial for certain applications.

No. of Inputs: 10

Having a higher number of inputs allows for more complex logic functions to be implemented.

Output Function: MIXED

Provides flexibility in the type of outputs the device can generate.

Maximum Clock Frequency: 74 MHz

High clock frequency allows for fast operation and efficient processing of signals.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R6-7CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 2 I/O

No. of Outputs:

6

Output Function:

Mixed

No. of Inputs:

10

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

2

Maximum Clock Frequency:

74 MHz

Propagation Delay:

9 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset; Register Preload

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Moisture Sensitivity Level (MSL):

1

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Width:

8.9662 mm

Length:

8.9662 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Tin Lead

Standards

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e0

Qualified:

No

Trade Compliance

TIBPAL16R6-7CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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