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TIBPAL16R6-10CN

Texas Instruments

TIBPAL16R6-10CN by Texas Instruments

TIBPAL16R6-10CN by Texas Instruments is a TTL technology PAL-type PLD with 10ns propagation delay and 5.25V max supply voltage. It has 64 product terms, 8 dedicated inputs, and 2 I/O lines, making it ideal for applications requiring mixed output functions at up to 55.5MHz clock frequency.

Median Price

$1.863

Lifecycle Status

Suppliers In-Stock

31

In-Stock Inventory

1k+

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DigiKey

USA . 928 parts In-Stock

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Rochester

USA . 805 parts In-Stock

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$1.660

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$1.490

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$1.400

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$1.400

Verical

USA . 679 parts In-Stock

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$1.863

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$1.750

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$1.750

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Digiode

USA . 4,332 parts In-Stock

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$1.748

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American Microsemiconductor Inc.

USA . 42 parts In-Stock

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$1.860

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Forefront Electronics and Design

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Vyrian

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Bristol Electronics

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Corel Iberica Componentes, S.L.

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Dan-Mar Components

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DF Sales Co.

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A&K Electronics

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Rotakorn

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Microfarads

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Mentor Electronics Marketing, LLC

USA . 73 parts In-Stock

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Sea View Technologies

USA . 56 parts In-Stock

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Inland Empire Components Inc.

USA . 26 parts In-Stock

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Sunrise Surplus Inc.

USA . 24 parts In-Stock

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Resion

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J & M Industries LLC

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ECAB

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Electronics Depot

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Zilex Electronics Inc.

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LWI Electronics Inc

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Distributors (Availability)

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Corphita

USA . 3,111 parts In-Stock

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$1.656

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Component Stockers USA

USA . 2,571 parts In-Stock

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$1.870

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$1.760

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Parana Technologies

USA . 2,235 parts In-Stock

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$149.868

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$13,917.516

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$134.881

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DigiPath Technology Company

USA . 647 parts In-Stock

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$165.023

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ChromeModa Solutions

Germany . 1,720 parts In-Stock

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$168.391

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$138.081

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IDEA Electronic Components Group

UK . 1,390 parts In-Stock

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$159.971

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$151.552

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GreenTree Electronics

Israel . 3,795 parts In-Stock

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Assy Fe

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Perfect Parts

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock the power of programmable logic with the TIBPAL16R6-10CN by Texas Instruments. Designed with precision and reliability in mind, this PAL-type device offers blazing-fast 10 ns propagation delay and a wide operating temperature range, making it ideal for a variety of applications. With 64 product terms and 6 outputs, this PLD provides unmatched flexibility and performance. Trust in Texas Instruments to deliver quality and innovation that exceeds expectations. Elevate your projects with the TIBPAL16R6-10CN and experience the difference today.

Feature Benefit Bullets

Propagation Delay: 10 ns

The low propagation delay of 10ns ensures fast processing and response time, making this PLD suitable for high-speed applications.

Maximum Supply Voltage: 5.25 V

The higher maximum supply voltage allows for flexibility in power supply options and compatibility with various systems.

No. of Inputs: 10

Having 10 inputs provides ample connectivity options and versatility for input signal processing.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V ensures stable and efficient operation of the PLD.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75°C, this PLD can withstand higher temperatures without compromising performance.

Maximum Clock Frequency: 55.5 MHz

The high maximum clock frequency of 55.5MHz allows for quick processing of data and efficient operation in demanding applications.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R6-10CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 2 I/O

No. of Outputs:

6

Output Function:

Mixed

No. of Inputs:

10

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

2

Maximum Clock Frequency:

55.5 MHz

Propagation Delay:

10 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset; Register Preload

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.325 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16R6-10CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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