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TIBPAL16L8-7CFN

Texas Instruments

TIBPAL16L8-7CFN by Texas Instruments

TIBPAL16L8-7CFN by Texas Instruments is a TTL technology PAL-type PLD with 9ns propagation delay, 64 product terms, and 74MHz clock frequency. Ideal for applications requiring combinatorial output functions, it features 10 dedicated inputs and 6 I/O lines in a square chip carrier package.

Median Price

$11.230

Lifecycle Status

Suppliers In-Stock

17

In-Stock Inventory

1k+

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American Microsemiconductor Inc.

USA . 10 parts In-Stock

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$11.230

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Vyrian

USA . 8,782 parts In-Stock

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MRC Electronics

USA . 1,086 parts In-Stock

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Microfarads

USA . 780 parts In-Stock

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780

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Prism Electronics

USA . 747 parts In-Stock

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747

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Resion

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Elcom Components

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Inland Empire Components Inc.

USA . 130 parts In-Stock

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Semi Source

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Electronics Depot

USA . 119 parts In-Stock

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Digiode

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ACDS - Activité Composants Distribution Service

France . 70 parts In-Stock

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Inventory MP

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Bristol Electronics

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ComSIT Distribution GmbH

Germany . 54 parts In-Stock

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Sunrise Surplus Inc.

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Atlantic Semiconductor

USA . 5 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 550 parts In-Stock

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$18.482

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Parana Technologies

USA . 2,314 parts In-Stock

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$24.421

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$25.094

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DigiPath Technology Company

USA . 271 parts In-Stock

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$26.890

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$24.739

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ChromeModa Solutions

Germany . 1,419 parts In-Stock

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$27.439

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$22.500

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IDEA Electronic Components Group

UK . 1,247 parts In-Stock

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$26.067

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$24.695

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One Stop Electronics

USA . 1,259 parts In-Stock

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Corphita

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Assy Fe

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Speed Components Ltd (Excess)

Israel . 108 parts In-Stock

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Cyclops Electronics Ltd (Excess)

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Kepictronics

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Overview

Unlock the power of innovative technology with the TIBPAL16L8-7CFN by Texas Instruments, a high-quality Programmable Logic Device designed to revolutionize your electronic projects. With a fast propagation delay of 9ns and versatile PAL-type architecture, this PLD offers unmatched performance and reliability. Ideal for applications requiring combinatorial output functions, this chip carrier package boasts 64 product terms and 8 outputs to meet all your customization needs. Trust in Texas Instruments to deliver cutting-edge solutions that elevate your designs to new heights.

Feature Benefit Bullets

Propagation Delay: 9 ns

Low propagation delay enables fast data processing and reduces signal latency.

Maximum Supply Voltage: 5.25 V

Wide range of supply voltage allows for flexibility in different power supply configurations.

No. of Inputs: 16

High number of inputs allows for complex logic functions to be implemented.

Output Function: COMBINATORIAL

Combinatorial output function allows for simple logic operations without a clock signal.

Maximum Clock Frequency: 74 MHz

High clock frequency capability enables rapid data processing and high-speed operation.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-7CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

74 MHz

Propagation Delay:

9 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Width:

8.9662 mm

Length:

8.9662 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16L8-7CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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