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TIBPAL16L8-30MJ

Texas Instruments

TIBPAL16L8-30MJ by Texas Instruments

TIBPAL16L8-30MJ by Texas Instruments is a PAL-TYPE PLD with 30ns propagation delay, 5.5V max supply voltage, and 25MHz clock frequency. Ideal for MILITARY applications requiring COMBINATORIAL output function in TTL technology with 10 dedicated inputs and 6 I/O lines.

Median Price

$43.444

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

AE Petsche

USA . 1 parts In-Stock

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$55.630

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1

$55.630

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Chip1Stop

Japan . 31 parts In-Stock

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$31.257

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$31.257

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Digiode

USA . 3,594 parts In-Stock

1+ parts

$52.848

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3,594

$52.848

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Vyrian

USA . 6,942 parts In-Stock

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Resion

USA . 6 parts In-Stock

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AZTECH Wire

Italy . 1,184 parts In-Stock

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$10.040

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$10.040

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Corphita

USA . 3,893 parts In-Stock

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$50.067

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Parana Technologies

USA . 483 parts In-Stock

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$117.212

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483

$117.212

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DigiPath Technology Company

USA . 1,590 parts In-Stock

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$129.065

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$118.740

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$129.065

$118.740

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IDEA Electronic Components Group

UK . 2,274 parts In-Stock

1+ parts

$131.699

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$125.114

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$118.529

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2,274

$131.699

$125.114

$118.529

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ChromeModa Solutions

Germany . 981 parts In-Stock

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$131.699

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$107.993

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981

$131.699

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Microchip USA

USA . 1,187 parts In-Stock

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Perfect Parts

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Overview

Discover the ultimate solution for your programmable logic device needs with the TIBPAL16L8-30MJ by Texas Instruments. Crafted with precision and reliability in mind, this PLD offers unparalleled performance and versatility for a wide range of applications. Whether you're designing industrial automation systems or telecommunications equipment, this PAL-type architecture delivers the power and efficiency you need to succeed. Trust in Texas Instruments to provide top-quality products that exceed expectations, and unlock endless possibilities with the TIBPAL16L8-30MJ.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This package material ensures durability and reliability in a variety of environments, making the product suitable for rugged applications.

Propagation Delay: 30 ns

The low propagation delay ensures fast processing speed and real-time operation, making it ideal for time-sensitive applications.

Maximum Supply Voltage: 5.5 V

With a high maximum supply voltage, the product can handle voltage fluctuations and provide stable performance under varying conditions.

Screening Level: MIL-STD-883

The MIL-STD-883 screening level ensures high reliability and quality, meeting strict military standards for performance and durability.

Technology Used: TTL

The TTL technology offers low power consumption and high noise immunity, making the product energy-efficient and reliable for critical applications.

No. of Inputs: 16

Having a high number of inputs allows for greater flexibility in designing complex logic circuits, providing versatility in application usage.

Package Shape: RECTANGULAR

The rectangular package shape allows for efficient use of space on a circuit board, enabling compact designs and efficient layouts.

Form Of Terminal: THROUGH-HOLE

The through-hole terminals provide strong mechanical connections and easy soldering, ensuring secure attachment to the circuit board for reliable performance.

Architecture: PAL-TYPE

The PAL-type architecture offers programmable logic with a wide range of product terms, providing flexibility in logic design for custom applications.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V is commonly used in many electronic systems, ensuring compatibility and ease of integration with existing circuits.

Packing Method: TUBE

The tube packing method offers protection during transportation and storage, preventing damage to the product and ensuring its integrity upon arrival.

Power Supplies (V): 5

With a matching power supply voltage of 5V, the product operates efficiently within the specified voltage range, optimizing performance and reliability.

No. of Terminals: 20

The high number of terminals allows for versatile connections and interfaces, enabling complex circuit configurations and integration with other components.

Programmable IC Type: OT PLD

Being an OT PLD programmable IC type, the product offers flexible programmability and customization, allowing for tailored logic implementations based on specific requirements.

Package Style (Meter): IN-LINE

The in-line package style provides a streamlined form factor and layout compatibility, facilitating easy installation and integration within circuit board assemblies.

Output Function: COMBINATORIAL

The combinatorial output function enables logical operations without memory elements, simplifying circuit design and improving performance in real-time processing applications.

No. of Product Terms: 64

Having a high number of product terms allows for complex logic operations and versatile configurations, offering advanced capabilities for custom logic design.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage ensures flexibility in power requirements and compatibility with a wide range of systems, extending the product's usability.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature range allows for reliable performance in extreme conditions, making the product suitable for demanding environments.

Pitch Of Terminal: 2.54 mm

The standard pitch of terminals enables easy connections and compatibility with common electronic components, simplifying integration and assembly processes.

Organization: 10 DEDICATED INPUTS, 6 I/O

The organizational structure with dedicated inputs and I/O lines offers clear signal routing and efficient logic control, enhancing the product's performance and functionality.

No. of Dedicated Inputs: 10

Having dedicated inputs allows for specialized signal processing and efficient logic operations, optimizing the product's performance for specific tasks.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature range ensures reliable performance in cold environments, making the product suitable for a wide range of operating conditions.

Finishing Of Terminal Used: Tin/Lead (Sn/Pb)

The tin/lead finishing of terminals provides solderability and conductivity, ensuring secure connections and reliable performance in various circuit configurations.

Position Of Terminal: DUAL

The dual position of terminals offers flexibility in circuit board layouts and connections, enabling versatile mounting options for efficient system integration.

Maximum Seated Height: 5.08 mm

The low maximum seated height allows for compact designs and space-efficient installations, making the product suitable for constrained environments.

Width: 7.62 mm

The moderate width of the product provides a balance between space efficiency and component layout, enabling versatile integration within different system configurations.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency, the product can support fast data processing and real-time operations, making it suitable for high-speed applications.

No. of Outputs: 8

Having multiple outputs allows for diverse signal routing and logic control, enabling complex logic operations and versatile system designs.

Length: 24.195 mm

The specific length of the product offers compatibility with standard board sizes and layouts, facilitating easy integration and installation within electronic systems.

No. of I/O Lines: 6

The number of I/O lines provides sufficient connectivity options for diverse interfaces and signal routing, enabling versatile communication and control capabilities.

Grading Of Temperature: MILITARY

The military-grade temperature grading ensures high reliability and performance in extreme conditions, making the product suitable for mission-critical applications and harsh environments.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16L8-30MJ attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

In-System Programmable:

No

Organization:

10 Dedicated Inputs, 6 I/O

No. of Outputs:

8

Output Function:

Combinatorial

No. of Inputs:

16

No. of Product Terms:

64

No. of Dedicated Inputs:

10

No. of I/O Lines:

6

Maximum Clock Frequency:

25 MHz

Propagation Delay:

30 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

24.195 mm

Maximum Seated Height:

5.08 mm

Packing Method:

Tube

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Tin/Lead

Standards

JESD-30 Code:

R-GDIP-T20

JESD-609 Code:

e0

JTAG Boundary Scan Test:

No

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16L8-30MJ Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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