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TIBPAL20R6-15CNT

Texas Instruments

TIBPAL20R6-15CNT by Texas Instruments

TIBPAL20R6-15CNT by Texas Instruments is a TTL technology PAL-type PLD with 18ns propagation delay, 5.25V max supply voltage, and 37MHz clock frequency. Ideal for applications requiring mixed output functions, it features 12 dedicated inputs and 2 I/O lines in a rectangular package with through-hole terminals.

Median Price

$1.872

Lifecycle Status

Suppliers In-Stock

24

In-Stock Inventory

1k+

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Rochester

USA . 1,002 parts In-Stock

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-

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$1.770

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$1.580

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$1.490

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$1.490

Verical

USA . 533 parts In-Stock

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$1.975

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$1.863

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Digiode

USA . 3,701 parts In-Stock

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$1.957

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American Microsemiconductor Inc.

USA . 75 parts In-Stock

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Vyrian

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Prism Electronics

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Resion

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DigiKey Marketplace

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Electronic Expediters

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LWI Electronics Inc

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EMSNET

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Bristol Electronics

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Flex Direct, LLC

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Inland Empire Components Inc.

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ComSIT Distribution GmbH

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Mentor Electronics Marketing, LLC

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A2Z Electronics, Inc.

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Elcom Components

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Atlantic Semiconductor

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J & M Industries LLC

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MRC Electronics

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Microfarads

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Pegasus Components GmbH

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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Distributors (Availability)

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Corphita

USA . 304 parts In-Stock

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$1.854

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Component Stockers USA

USA . 1,605 parts In-Stock

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$2.030

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$1.910

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$1.730

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AZTECH Wire

Italy . 672 parts In-Stock

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$17.840

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Parana Technologies

USA . 1,497 parts In-Stock

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$122.751

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DigiPath Technology Company

USA . 1,886 parts In-Stock

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$135.164

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$124.350

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ChromeModa Solutions

Germany . 6,503 parts In-Stock

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$137.922

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$113.096

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IDEA Electronic Components Group

UK . 349 parts In-Stock

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$131.026

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$124.130

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A-Z Elektronik GmbH

Germany . 6,933 parts In-Stock

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Microchip USA

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Overview

Unlock endless possibilities with the TIBPAL20R6-15CNT by Texas Instruments. As a leader in the industry, Texas Instruments delivers top-notch quality programmable logic devices that cater to various applications. From enhancing circuit designs to optimizing system performance, this product offers unmatched value and benefits to our customers. With its advanced technology and reliable performance, the TIBPAL20R6-15CNT is a game-changer in the world of programmable logic devices. Experience innovation like never before with Texas Instruments.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, suitable for various applications.

Propagation Delay: 18 ns

The low propagation delay ensures quick processing of signals, making the device suitable for high-speed applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage provides flexibility in power supply options for the device.

Technology Used: TTL

The use of TTL technology ensures compatibility with TTL logic levels, making it easy to integrate into existing systems.

No. of Inputs: 14

With 14 inputs, the device can handle multiple input signals, increasing its versatility in different applications.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement on circuit boards.

Form Of Terminal: THROUGH-HOLE

The through-hole form of terminal provides secure connections and easy soldering on PCBs.

Architecture: PAL-TYPE

The PAL-type architecture offers configurable logic functions, giving flexibility in designing custom logic circuits.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5V ensures compatibility with standard power supplies and ease of integration.

Power Supplies (V): 5

The device operates efficiently with a 5V power supply, making it suitable for a wide range of applications.

No. of Terminals: 24

With 24 terminals, the device can accommodate multiple connections, providing versatility in circuit design.

Programmable IC Type: OT PLD

Being an OT PLD, the device offers reprogrammable logic functions, allowing for flexibility in modifying logic configurations.

Package Style (Meter): IN-LINE

The in-line package style offers a compact form factor, suitable for space-constrained applications.

Output Function: MIXED

The mixed output function allows for a combination of different output types, increasing the device's versatility.

No. of Product Terms: 64

With 64 product terms, the device can implement complex logic functions, suitable for advanced applications.

Minimum Supply Voltage: 4.75 V

The low minimum supply voltage of 4.75V ensures efficient operation even under varying power supply conditions.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature of 75°C allows the device to operate reliably in various environmental conditions.

Pitch Of Terminal: 2.54 mm

The 2.54mm pitch of terminals allows for easy connections and compatibility with standard spacing on PCBs.

Organization: 12 DEDICATED INPUTS, 2 I/O

The organization of 12 dedicated inputs and 2 I/O lines provides a balanced input/output configuration for diverse applications.

No. of Dedicated Inputs: 12

With 12 dedicated inputs, the device can handle specific input signals efficiently, catering to specialized applications.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable operation even in colder environments.

Finishing Of Terminal Used: NICKEL PALLADIUM GOLD

The use of nickel-palladium-gold finishing on terminals ensures reliable and corrosion-resistant connections, enhancing overall device durability.

Position Of Terminal: DUAL

The dual position of terminals allows for flexibility in mounting and integration on PCBs, accommodating different layout requirements.

Maximum Seated Height: 5.08 mm

The maximum seated height of 5.08mm provides a low-profile design, suitable for compact electronic devices.

Width: 7.62 mm

The width of 7.62mm offers a compact form factor, ideal for space-constrained applications.

Maximum Clock Frequency: 37 MHz

The high maximum clock frequency of 37MHz enables fast processing and response times, making the device suitable for high-speed applications.

No. of Outputs: 8

With 8 outputs, the device can drive multiple output signals, providing flexibility in connecting to external components.

Length: 31.64 mm

The length of 31.64mm offers a balanced size for the device, ensuring compatibility with standard mounting configurations.

No. of I/O Lines: 2

With 2 I/O lines, the device can handle input and output signals efficiently, suitable for a wide range of applications.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures reliable operation over a wide temperature range, making the device suitable for commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL20R6-15CNT attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

12 Dedicated Inputs, 2 I/O

No. of Outputs:

8

Output Function:

Mixed

No. of Inputs:

14

No. of Product Terms:

64

No. of Dedicated Inputs:

12

No. of I/O Lines:

2

Maximum Clock Frequency:

37 MHz

Propagation Delay:

18 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Register Preload; Power-Up Reset

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Width:

7.62 mm

Length:

31.64 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T24

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL20R6-15CNT Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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