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TIBPAL16R4-25CFN

Texas Instruments

TIBPAL16R4-25CFN by Texas Instruments

TIBPAL16R4-25CFN by Texas Instruments is a TTL technology PAL-type PLD with 12 inputs, 8 dedicated inputs, and 8 outputs. It has a propagation delay of 25 ns, operates at a max clock frequency of 30 MHz, and can handle supply voltages from 4.75V to 5.25V. Ideal for applications requiring mixed output functions in commercial extended temperature environments.

Median Price

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Lifecycle Status

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10

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1k+

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Vyrian

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Prism Electronics

USA . 1,373 parts In-Stock

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Digiode

USA . 864 parts In-Stock

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Bristol Electronics

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Electronic Expediters

USA . 461 parts In-Stock

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Mentor Electronics Marketing, LLC

USA . 408 parts In-Stock

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Resion

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Inland Empire Components Inc.

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MISTER SPROCKETS

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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AZTECH Wire

Italy . 860 parts In-Stock

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One Stop Electronics

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Parana Technologies

USA . 13 parts In-Stock

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DigiPath Technology Company

USA . 395 parts In-Stock

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ChromeModa Solutions

Germany . 3,639 parts In-Stock

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IDEA Electronic Components Group

UK . 1,824 parts In-Stock

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Corphita

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Overview

Experience the exceptional quality and reliability of Texas Instruments with the TIBPAL16R4-25CFN Programmable Logic Device. Ideal for a wide range of applications, this PAL-type device offers unmatched performance with a maximum clock frequency of 30 MHz and 64 product terms. With a package style of chip carrier and powerful mixed output function, this PLD provides customers with a versatile and efficient solution. Trust in Texas Instruments to deliver cutting-edge technology and superior value with the TIBPAL16R4-25CFN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

This material provides durability and protection for the internal components of the PLD, making it suitable for various operating conditions.

Propagation Delay: 25 ns

The low propagation delay of 25 ns ensures fast processing and response times, making this PLD ideal for time-sensitive applications.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for flexibility in power input, accommodating a wide range of voltage levels.

Technology Used: TTL

TTL technology provides compatibility with other TTL-based devices, enhancing the interoperability and integration of this PLD in existing systems.

No. of Inputs: 12

With 12 inputs, this PLD can support a larger number of input signals, enabling more complex logic functions and operations.

No. of Outputs: 8

The 8 outputs allow for multiple output signals to be generated simultaneously, increasing the versatility and functionality of this PLD.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R4-25CFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 4 I/O

No. of Outputs:

8

Output Function:

Mixed

No. of Inputs:

12

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

4

Maximum Clock Frequency:

30 MHz

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Peak Reflow Temperature:

245 °C (473 °F)

Moisture Sensitivity Level (MSL):

3

Maximum Time At Peak Reflow Temperature:

30 s

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC20,.4SQ

Width:

8.965 mm

Length:

8.965 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

1.27 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

S-PQCC-J20

JESD-609 Code:

e4

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16R4-25CFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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