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TIB82S105BCFN

Texas Instruments

TIB82S105BCFN by Texas Instruments

TIB82S105BCFN by Texas Instruments is a TTL technology PLD with 16 dedicated inputs, 8 outputs, and 48 product terms. It has a propagation delay of 20 ns and operates at a max clock frequency of 30 MHz. This programmable IC in chip carrier package is ideal for applications requiring fast signal processing and logic operations.

Median Price

$8.600

Lifecycle Status

Suppliers In-Stock

12

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 629 parts In-Stock

1+ parts

-

100+ parts

$6.880

1k+ parts

$6.150

10k+ parts

$5.790

629

-

$6.880

$6.150

$5.790

DigiKey

USA . 629 parts In-Stock

1+ parts

-

100+ parts

$9.050

1k+ parts

-

10k+ parts

-

629

-

$9.050

-

-

Verical

USA . 629 parts In-Stock

1+ parts

-

100+ parts

$8.600

1k+ parts

$7.688

10k+ parts

$7.237

629

-

$8.600

$7.688

$7.237

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 415 parts In-Stock

1+ parts

$7.258

100+ parts

-

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415

$7.258

-

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Vyrian

USA . 8,998 parts In-Stock

1+ parts

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8,998

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A2Z Electronics, Inc.

USA . 7,526 parts In-Stock

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7,526

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DigiKey Marketplace

USA . 632 parts In-Stock

1+ parts

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632

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PC Components Company LLC

USA . 24 parts In-Stock

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24

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Electronic Expediters

USA . 9 parts In-Stock

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9

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Bristol Electronics

USA . 9 parts In-Stock

1+ parts

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9

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Digital Electronic Gebert Verwaltungs UG

Germany . 8 parts In-Stock

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8

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Beltway Electronics Company

USA . 6 parts In-Stock

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6

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corphita

USA . 717 parts In-Stock

1+ parts

$6.876

100+ parts

-

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717

$6.876

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Parana Technologies

USA . 248 parts In-Stock

1+ parts

$49.497

100+ parts

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248

$49.497

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DigiPath Technology Company

USA . 1,489 parts In-Stock

1+ parts

$54.503

100+ parts

$50.142

1k+ parts

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1,489

$54.503

$50.142

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ChromeModa Solutions

Germany . 1,693 parts In-Stock

1+ parts

$55.615

100+ parts

$45.604

1k+ parts

-

10k+ parts

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1,693

$55.615

$45.604

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IDEA Electronic Components Group

UK . 580 parts In-Stock

1+ parts

$55.615

100+ parts

$52.834

1k+ parts

$50.054

10k+ parts

-

580

$55.615

$52.834

$50.054

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Perfect Parts

USA . 228 parts In-Stock

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228

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Overview

Unlock the potential of your electronic projects with the TIB82S105BCFN by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Programmable Logic Devices (PLDs) that offer unmatched performance and reliability. Whether you're designing industrial automation systems or consumer electronics, this PLD is perfect for various applications. With a focus on innovation and customer satisfaction, Texas Instruments provides value and benefits that set them apart from the competition. Upgrade your designs today with the TIB82S105BCFN and experience the advantages of cutting-edge technology at your fingertips.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components of the device, ensuring longevity and reliability.

Propagation Delay: 20 ns

Fast propagation delay allows for quick processing of input signals, making the device suitable for time-sensitive applications.

Surface Mount: YES

Ease of installation and space-saving design, making it ideal for compact circuit layouts.

Maximum Supply Voltage: 5.25 V

Can handle higher supply voltages, providing flexibility in different voltage environments.

Technology Used: TTL

Utilizes TTL technology for reliable digital signal processing and compatibility with other TTL devices.

No. of Inputs: 16

Provides ample input channels for versatile input configurations in complex logic functions.

Package Shape: SQUARE

Compact square shape for efficient use of space on circuit boards.

Form Of Terminal: J BEND

J bend terminals for easy soldering and secure connection to the circuit board.

Architecture: PLS-TYPE

PLS-type architecture offering programmable logic solutions for customizing circuits as per specific requirements.

Nominal Supply Voltage (V): 5

Stable supply voltage for consistent operation of the device within specified parameters.

Power Supplies (V): 5

Dual power supplies at 5V for efficient power distribution and signal processing.

No. of Terminals: 28

Sufficient terminals for connecting to external components and peripherals.

Programmable IC Type: OT PLD

OTP PLD technology for one-time programmable logic customizations.

Package Style (Meter): CHIP CARRIER

Chip carrier package style for compact size and easy integration into circuit designs.

Output Function: REGISTERED

Registered output function for synchronized output signals and enhanced reliability.

No. of Product Terms: 48

Large number of product terms for creating intricate logic functions and configurations.

Minimum Supply Voltage: 4.75 V

Lowest allowable supply voltage for efficient power consumption and device operation.

Maximum Operating Temperature: 75 °C

High maximum operating temperature range for reliable operation in diverse environmental conditions.

Pitch Of Terminal: 1.27 mm

Standard terminal pitch for compatibility with common PCB layouts and manufacturing processes.

Organization: 16 DEDICATED INPUTS, 0 I/O

Dedicated inputs for specific functions and no general-purpose I/O for streamlined circuit design.

No. of Dedicated Inputs: 16

Allots dedicated inputs for specific task handling, improving overall efficiency and performance.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensuring functionality even in colder environments.

Position Of Terminal: QUAD

Quad position terminals for easy identification and organization during installation.

Maximum Seated Height: 4.57 mm

Low profile design for efficient space utilization in circuit board layouts.

Width: 11.5062 mm

Compact width for fitting into tight spaces or crowded PCB layouts.

Maximum Clock Frequency: 30 MHz

High clock frequency capability for rapid signal processing and real-time applications.

No. of Outputs: 8

Multiple output channels for connecting to various external devices and components.

Length: 11.5062 mm

Optimal length for easy integration into circuit designs without occupying excessive space.

Grading Of Temperature: COMMERCIAL EXTENDED

Commercial extended temperature grading for wider operating temperature range and industrial applications.

Technical Specifications

Programmable Logic Devices (PLD) TIB82S105BCFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

16 Dedicated Inputs, 0 I/O

No. of Outputs:

8

Output Function:

Registered

No. of Inputs:

16

No. of Product Terms:

48

No. of Dedicated Inputs:

16

No. of I/O Lines:

0

Maximum Clock Frequency:

30 MHz

Propagation Delay:

20 ns

Technology:

TTL

Architecture:

PLS-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Programmable Logic Sequencer

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Width:

11.5062 mm

Length:

11.5062 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

TIB82S105BCFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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