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TIB82S105BCN3

Texas Instruments

TIB82S105BCN3 by Texas Instruments

TIB82S105BCN3 by Texas Instruments is a TTL technology-based PLD with 16 inputs, 8 outputs, and 48 product terms. It operates at a max clock frequency of 30 MHz and has a nominal voltage of 5V. This programmable IC in an IN-LINE package is ideal for commercial applications requiring PLS-type architecture and a temperature range of 0-70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 2,847 parts In-Stock

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2,847

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Digiode

USA . 2,643 parts In-Stock

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2,643

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Distributors (Availability)

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AZTECH Wire

Italy . 708 parts In-Stock

1+ parts

$5.405

100+ parts

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708

$5.405

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One Stop Electronics

USA . 1,358 parts In-Stock

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$18.000

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1,358

$18.000

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Parana Technologies

USA . 2,323 parts In-Stock

1+ parts

$42.171

100+ parts

$3,916.205

1k+ parts

$37.954

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2,323

$42.171

$3,916.205

$37.954

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DigiPath Technology Company

USA . 787 parts In-Stock

1+ parts

$46.435

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787

$46.435

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ChromeModa Solutions

Germany . 4,658 parts In-Stock

1+ parts

$47.383

100+ parts

$38.854

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4,658

$47.383

$38.854

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IDEA Electronic Components Group

UK . 1,766 parts In-Stock

1+ parts

$47.383

100+ parts

$45.014

1k+ parts

$42.645

10k+ parts

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1,766

$47.383

$45.014

$42.645

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Corphita

USA . 2,875 parts In-Stock

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2,875

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Overview

Unlock the power of programmable logic devices with the TIB82S105BCN3 by Texas Instruments. Crafted with precision and expertise, this PLD offers unparalleled quality and reliability. Whether you're designing industrial control systems, telecommunications equipment, or consumer electronics, this versatile device delivers exceptional performance and efficiency. With 16 inputs, 8 outputs, and 48 product terms, it provides endless possibilities for customization. Trust Texas Instruments to bring innovation to your projects and elevate your designs to the next level.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

PLASTIC/EPOXY material makes the package durable and resistant to damage, ensuring that the device is long-lasting and reliable.

Technology Used: TTL

TTL technology provides high-speed performance and low power consumption, making this device suitable for applications requiring fast data processing.

No. of Inputs: 16

With 16 inputs, this PLD offers flexibility in input options and can support a variety of input signals for versatile use.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration into circuit designs and provides efficient use of PCB space.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals offer secure connections and easy soldering, ensuring stable electrical connections in electronic circuits.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V, this PLD is compatible with standard power supply configurations, making it easy to integrate into existing systems.

No. of Terminals: 28

With 28 terminals, this PLD offers ample connectivity options for interfacing with other components in a circuit design.

Programmable IC Type: OT PLD

Being an OT PLD (Output programmable logic device), this device allows for dynamic reconfiguration of logic functions, enabling versatile applications and design flexibility.

Maximum Operating Temperature: 70 °C

Operating at a maximum temperature of 70°C ensures reliable performance even in challenging thermal conditions.

Pitch Of Terminal: 2.54 mm

The 2.54mm pitch of terminals allows for standard spacing, making it compatible with commonly used connectors and facilitating easy PCB layout.

Minimum Operating Temperature: 0 °C

With a minimum operating temperature of 0°C, this PLD can function reliably in a wide range of temperature environments.

Position Of Terminal: DUAL

Dual position terminals offer redundancy and improved signal integrity, enhancing the overall reliability of the PLD.

Maximum Clock Frequency: 30 MHz

Operating at a clock frequency of up to 30 MHz, this PLD can handle high-speed data processing tasks efficiently.

No. of Outputs: 8

With 8 outputs, this PLD can drive multiple external devices simultaneously, making it suitable for complex logic functions and control applications.

Grading Of Temperature: COMMERCIAL

Designed for commercial-grade applications, this PLD meets industry standards for performance and reliability in everyday use cases.

Technical Specifications

Programmable Logic Devices (PLD) TIB82S105BCN3 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

8

No. of Inputs:

16

No. of Product Terms:

48

Maximum Clock Frequency:

30 MHz

Technology:

TTL

Architecture:

PLS-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP28,.6

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T28

Trade Compliance

TIB82S105BCN3 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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