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TIB82S167BCFN3

Texas Instruments

TIB82S167BCFN3 by Texas Instruments

TIB82S167BCFN3 by Texas Instruments is a TTL technology-based PLD with 14 inputs, 6 outputs, and 48 product terms. It operates at a max clock frequency of 30 MHz and has a temperature range of 0-70°C. This programmable IC in chip carrier package is ideal for commercial applications requiring high-speed logic functions.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 6,629 parts In-Stock

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Digiode

USA . 4,279 parts In-Stock

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4,279

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Distributors (Availability)

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AZTECH Wire

Italy . 858 parts In-Stock

1+ parts

$9.108

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858

$9.108

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One Stop Electronics

USA . 979 parts In-Stock

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$24.000

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979

$24.000

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Parana Technologies

USA . 107 parts In-Stock

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$26.957

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$30.516

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107

$26.957

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$30.516

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DigiPath Technology Company

USA . 1,768 parts In-Stock

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$29.683

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$27.309

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1,768

$29.683

$27.309

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ChromeModa Solutions

Germany . 5,903 parts In-Stock

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$30.289

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$24.837

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5,903

$30.289

$24.837

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IDEA Electronic Components Group

UK . 1,099 parts In-Stock

1+ parts

$30.289

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$28.775

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$27.260

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1,099

$30.289

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$27.260

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Corphita

USA . 1,144 parts In-Stock

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Overview

Unlock the power of cutting-edge technology with the TIB82S167BCFN3 by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-quality Programmable Logic Devices that are versatile, reliable, and efficient. Ideal for a wide range of applications, this PLD offers unparalleled value and benefits to customers seeking high-performance solutions. Experience seamless integration, superior performance, and unmatched precision with the TIB82S167BCFN3. Trust Texas Instruments to elevate your projects to new heights.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material makes the device lightweight and durable, making it easier to handle and less prone to damage during installation and handling.

Surface Mount: YES

Surface mount technology allows for easy and efficient installation on PCBs, saving space and making the device suitable for compact electronic designs.

Technology Used: TTL

TTL technology offers reliable and fast operation, making the device suitable for applications requiring high-speed digital processing.

No. of Inputs: 14

With 14 inputs, the device can handle a variety of input signals, making it versatile for different types of electronic circuits and logic functions.

Nominal Supply Voltage (V): 5

Operating at a nominal supply voltage of 5V, the device is compatible with standard power sources and ensures reliable performance.

Maximum Operating Temperature: 70 °C

The device can operate efficiently in a wide temperature range up to 70°C, suitable for industrial applications where temperature fluctuations are common.

Maximum Clock Frequency: 30 MHz

With a maximum clock frequency of 30 MHz, the device can achieve high-speed operation, making it suitable for applications requiring fast data processing.

No. of Outputs: 6

Having 6 outputs allows the device to drive multiple components or signals, increasing its flexibility in controlling different aspects of a circuit.

Grading Of Temperature: COMMERCIAL

Being graded for commercial temperature ranges ensures that the device can perform reliably in typical operating conditions found in commercial electronic products.

Technical Specifications

Programmable Logic Devices (PLD) TIB82S167BCFN3 attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

6

No. of Inputs:

14

No. of Product Terms:

48

Maximum Clock Frequency:

30 MHz

Technology:

TTL

Architecture:

PLS-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J28

Trade Compliance

TIB82S167BCFN3 Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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