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TIB82S167BMJTB

Texas Instruments

TIB82S167BMJTB by Texas Instruments

TIB82S167BMJTB by Texas Instruments is a TTL technology-based PLD with 14 inputs, 6 outputs, and 48 product terms. It operates at temperatures ranging from -55°C to 125°C and has a max clock frequency of 25 MHz. Ideal for military applications due to its MIL-graded temperature range and PLS-type architecture.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 8,571 parts In-Stock

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Digiode

USA . 3,629 parts In-Stock

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Distributors (Availability)

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AZTECH Wire

Italy . 802 parts In-Stock

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$6.679

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802

$6.679

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One Stop Electronics

USA . 1,115 parts In-Stock

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$10.000

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Parana Technologies

USA . 2,042 parts In-Stock

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$48.110

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DigiPath Technology Company

USA . 564 parts In-Stock

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$52.975

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$48.737

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564

$52.975

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ChromeModa Solutions

Germany . 6,273 parts In-Stock

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$54.056

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$44.326

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IDEA Electronic Components Group

UK . 243 parts In-Stock

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$54.056

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$51.353

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$48.650

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Corphita

USA . 3,367 parts In-Stock

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Overview

Experience the next level of performance and reliability with the TIB82S167BMJTB by Texas Instruments. As a leading manufacturer in the industry, Texas Instruments delivers top-notch quality in Programmable Logic Devices (PLD). With its advanced technology and robust design, this PLD provides unmatched versatility for a wide range of applications. From aerospace to telecommunications, this product offers customers exceptional value, efficiency, and flexibility. Upgrade your systems today with the TIB82S167BMJTB and experience the difference that Texas Instruments brings to the table.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent thermal properties and high reliability, making them suitable for military and industrial applications where durability is essential.

Screening Level: 38535Q/M;38534H;883B

This high screening level ensures that the device meets strict quality and reliability standards, making it suitable for mission-critical applications.

Technology Used: TTL

TTL technology offers fast switching speeds and low power consumption, making this PLD efficient and reliable for various digital logic applications.

No. of Inputs: 14

With 14 inputs, this PLD can accommodate complex logic functions and provide flexibility in designing custom digital circuits.

Nominal Supply Voltage (V): 5

Operating at a 5V supply voltage makes this PLD compatible with standard logic levels and power sources, simplifying integration into existing systems.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature of 125°C ensures reliable performance in harsh environments or applications that require extended temperature ranges.

Technical Specifications

Programmable Logic Devices (PLD) TIB82S167BMJTB attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

6

No. of Inputs:

14

No. of Product Terms:

48

Maximum Clock Frequency:

25 MHz

Technology:

TTL

Architecture:

PLS-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T24

Qualified:

No

Screening Level:

38535Q/M;38534H;883B

Trade Compliance

TIB82S167BMJTB Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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