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TIB82S105BCN

Texas Instruments

TIB82S105BCN by Texas Instruments

TIB82S105BCN by Texas Instruments is a TTL technology Programmable Logic Device with 16 inputs, 8 outputs, and 48 product terms. It has a propagation delay of 20 ns and operates at a max clock frequency of 30 MHz. Ideal for applications requiring fast signal processing in commercial extended temperature environments.

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Vyrian

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PC Components Company LLC

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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MRC Electronics

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Mentor Electronics Marketing, LLC

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First Choice Components Inc.

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J & M Industries LLC

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AZTECH Wire

Italy . 377 parts In-Stock

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

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ChromeModa Solutions

Germany . 2,327 parts In-Stock

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IDEA Electronic Components Group

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Overview

Unleash the power of innovation with the TIB82S105BCN by Texas Instruments, a top-tier player in the realm of Programmable Logic Devices. Designed with precision and unmatched quality, this PLD offers lightning-fast Propagation Delay, maximum Supply Voltage of 5.25 V, and a versatile Architecture suitable for a range of applications. Elevate your projects with this high-performance IC boasting 48 Product Terms and 8 Outputs, all housed in a durable PLASTIC/EPOXY package body. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy package body material provides durability and protection for the internal components of the PLD, ensuring long-term reliability.

Propagation Delay: 20 ns

With a low propagation delay of 20 ns, this PLD ensures fast signal processing, making it suitable for applications requiring quick response times.

Maximum Supply Voltage: 5.25 V

The maximum supply voltage of 5.25 V allows for flexibility in power supply options and compatibility with a wide range of systems.

Technology Used: TTL

The use of TTL technology in this PLD ensures reliable and compatible operation with other TTL-based components in the system.

No. of Inputs: 16

With 16 inputs, this PLD can handle a significant amount of data input, making it suitable for complex logic operations.

Package Shape: RECTANGULAR

The rectangular package shape offers ease of handling and installation in various electronic systems and equipment.

Form Of Terminal: THROUGH-HOLE

The through-hole terminal design provides secure connections and simplifies the soldering process during assembly.

Architecture: PLS-TYPE

The PLS-type architecture offers efficient logic implementation and flexible programming options for custom applications.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V ensures compatibility with standard power sources and makes integration into existing systems easier.

Power Supplies (V): 5

Having power supplies at 5 V ensures stable and consistent operation, reducing the risk of errors or malfunctions.

No. of Terminals: 28

With 28 terminals, this PLD offers ample connectivity options for interfacing with other components and peripherals in a system.

Programmable IC Type: OT PLD

The OT PLD type allows for field programmability, enabling users to customize the logic functions and adapt the device to specific requirements.

Package Style (Meter): IN-LINE

The in-line package style offers compact and space-saving dimensions, making it suitable for applications with limited space constraints.

Output Function: REGISTERED

The registered output function provides enhanced signal stability and reliability, important for critical applications that require accurate output timing.

No. of Product Terms: 48

With 48 product terms, this PLD can implement complex logic functions and support a wide range of applications and functions.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage of 4.75 V ensures efficient power consumption while maintaining stable operation across varying voltage levels.

Maximum Operating Temperature: 75 °C

The high maximum operating temperature of 75°C allows this PLD to withstand elevated temperatures in industrial or harsh environments.

Pitch Of Terminal: 2.54 mm

The 2.54 mm terminal pitch offers compatibility with standard spacing requirements for easy integration into various electronic systems.

Organization: 16 DEDICATED INPUTS, 0 I/O

The organization of 16 dedicated inputs allows for efficient data handling and logic processing, optimizing the performance of the PLD.

No. of Dedicated Inputs: 16

The 16 dedicated inputs provide dedicated channels for specific data sources, enhancing the efficiency and reliability of the PLD.

Minimum Operating Temperature: 0 °C

The low minimum operating temperature of 0°C ensures reliable performance in cold environments or during startup conditions.

Position Of Terminal: DUAL

The dual terminal position offers flexibility in installation and connection options, catering to different system layouts and design requirements.

Maximum Seated Height: 5.08 mm

The maximum seated height of 5.08 mm allows for slim and compact device designs, suitable for applications with space constraints.

Width: 15.24 mm

The width of 15.24 mm provides a compact form factor for easy integration into electronic systems with limited space availability.

Maximum Clock Frequency: 30 MHz

With a maximum clock frequency of 30 MHz, this PLD can support high-speed operations and real-time processing tasks effectively.

No. of Outputs: 8

The 8 outputs provide ample options for delivering processed data and control signals to external components, enhancing the functionality of the PLD.

Length: 36.32 mm

The length of 36.32 mm offers a balanced form factor for accommodating the necessary circuitry and components, suitable for various applications.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures reliability and performance across extended temperature ranges, making this PLD suitable for diverse operating environments.

Technical Specifications

Programmable Logic Devices (PLD) TIB82S105BCN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

16 Dedicated Inputs, 0 I/O

No. of Outputs:

8

Output Function:

Registered

No. of Inputs:

16

No. of Product Terms:

48

No. of Dedicated Inputs:

16

No. of I/O Lines:

0

Maximum Clock Frequency:

30 MHz

Propagation Delay:

20 ns

Technology:

TTL

Architecture:

PLS-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Programmable Logic Sequencer

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP28,.6

Width:

15.24 mm

Length:

36.32 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-PDIP-T28

Qualified:

No

Trade Compliance

TIB82S105BCN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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