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TIB82S167BMJT

Texas Instruments

TIB82S167BMJT by Texas Instruments

TIB82S167BMJT by Texas Instruments is a TTL technology PLD with 25 ns propagation delay and 5.5 V max supply voltage. It features 14 inputs, 6 outputs, and operates at -55 to 125 °C. Ideal for military applications requiring high-speed data processing in harsh environments.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,215 parts In-Stock

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Vyrian

USA . 2,561 parts In-Stock

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2,561

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Semicontronic

India . 1,166 parts In-Stock

1+ parts

$5.000

100+ parts

$4.875

1k+ parts

$4.850

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1,166

$5.000

$4.875

$4.850

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AZTECH Wire

Italy . 843 parts In-Stock

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$12.260

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843

$12.260

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Ampacity Inc.

Singapore . 459 parts In-Stock

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$33.000

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459

$33.000

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One Stop Electronics

USA . 483 parts In-Stock

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$35.000

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483

$35.000

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Parana Technologies

USA . 156 parts In-Stock

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$136.307

100+ parts

$12,658.178

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$122.676

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156

$136.307

$12,658.178

$122.676

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DigiPath Technology Company

USA . 1,317 parts In-Stock

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$150.091

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ChromeModa Solutions

Germany . 4,590 parts In-Stock

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$153.154

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$125.586

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$153.154

$125.586

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IDEA Electronic Components Group

UK . 2,061 parts In-Stock

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$153.154

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$145.496

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$137.839

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2,061

$153.154

$145.496

$137.839

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Corohmni

South Africa . 245 parts In-Stock

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Corphita

USA . 67 parts In-Stock

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Overview

Unlock the power of programmable logic with the TIB82S167BMJT by Texas Instruments. Crafted with precision and expertise, this PLD offers unmatched reliability and performance for a wide range of applications. From aerospace to industrial automation, this versatile device provides seamless integration and efficient operation. With a robust design and advanced technology, customers can trust in the quality and innovation that Texas Instruments delivers. Experience the value and benefits of this top-tier product and elevate your projects to new heights with the TIB82S167BMJT.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and protection for the internal components of the PLD, ensuring long-term reliability.

Propagation Delay: 25 ns

With a fast propagation delay of 25 ns, this PLD is suitable for applications that require quick response times and high-speed processing.

Maximum Supply Voltage: 5.5 V

The high maximum supply voltage of 5.5 V allows for flexibility in the power supply requirements of the PLD, making it suitable for a wide range of applications.

Technology Used: TTL

The use of TTL technology ensures compatibility with other TTL-based devices, simplifying integration into existing systems.

No. of Inputs: 14

With 14 inputs, this PLD can accommodate a variety of input signals, making it versatile for different types of applications.

Package Shape: RECTANGULAR

The rectangular package shape is compact and space-efficient, allowing for easy installation and integration into different circuit designs.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, reducing the risk of signal loss or interference in the PLD.

Architecture: PLS-TYPE

The PLS-type architecture offers flexibility in programming options and customization, making it suitable for a range of complex logic functions.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V ensures compatibility with standard power sources, simplifying the power supply design for the PLD.

Power Supplies (V): 5

Consistent power supplies of 5 V ensure stable and reliable operation of the PLD, reducing the risk of voltage fluctuations affecting performance.

No. of Terminals: 24

With 24 terminals, this PLD offers sufficient input and output connections for complex logic functions and data processing.

Programmable IC Type: OT PLD

The OT PLD type allows for reprogramming and customization of logic functions, providing versatility and adaptability in different applications.

Package Style (Meter): IN-LINE

The in-line package style is compact and space-efficient, suitable for applications where space is limited or where multiple devices need to be installed in a row.

Output Function: REGISTERED

The registered output function ensures stable and reliable output signals, reducing the risk of signal errors or timing issues in the PLD.

No. of Product Terms: 48

With 48 product terms, this PLD offers flexibility in logic functions and processing capabilities, allowing for complex operations and data manipulation.

Minimum Supply Voltage: 4.5 V

The low minimum supply voltage of 4.5 V ensures efficient power usage and compatibility with lower voltage power sources, reducing power consumption in the PLD.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this PLD can withstand harsh environmental conditions and extended use without overheating.

Pitch Of Terminal: 2.54 mm

The standard pitch of 2.54 mm for terminals allows for easy connection and compatibility with standard PCB designs and components.

Organization: 14 DEDICATED INPUTS, 0 I/O

The dedicated inputs and lack of I/O ports provide a focused and specialized configuration for specific logic functions and data processing tasks.

No. of Dedicated Inputs: 14

With 14 dedicated inputs, this PLD offers a dedicated channel for each input signal, reducing the risk of signal interference or crosstalk.

Minimum Operating Temperature: -55 °C

The low minimum operating temperature of -55°C allows for reliable operation in cold environments or where temperature fluctuations may occur.

Position Of Terminal: DUAL

The dual position of terminals provides redundancy and multiple connection options, ensuring secure and reliable connections in the PLD.

Maximum Clock Frequency: 25 MHz

With a high maximum clock frequency of 25 MHz, this PLD can handle high-speed data processing and logic operations, suitable for real-time applications.

No. of Outputs: 6

With 6 output channels, this PLD can generate multiple output signals simultaneously, allowing for parallel processing and data manipulation.

Grading Of Temperature: MILITARY

The military-grade temperature rating ensures reliability and durability in extreme temperature conditions or harsh environments, making it suitable for military applications.

Technical Specifications

Programmable Logic Devices (PLD) TIB82S167BMJT attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Registered

No. of Inputs:

14

No. of Product Terms:

48

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Maximum Clock Frequency:

25 MHz

Propagation Delay:

25 ns

Technology:

TTL

Architecture:

PLS-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Field-Programmable Logic Sequencer

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.5 V

Maximum Supply Voltage:

5.5 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

125 °C (257 °F)

Minimum Operating Temperature:

-55 °C (-67 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic, Glass-Sealed

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-GDIP-T24

Qualified:

No

Trade Compliance

TIB82S167BMJT Programmable ICs trade compliance attributes, and parameters.

ECCN

3A001.A.2.C

ECCN Governance

EAR

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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