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TIB82S167BCJT

Texas Instruments

TIB82S167BCJT by Texas Instruments

TIB82S167BCJT by Texas Instruments is a TTL technology-based Programmable Logic Device with 14 inputs and 6 outputs. It operates at a max clock frequency of 30 MHz, making it suitable for commercial applications requiring high-speed processing in a ceramic package.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

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Vyrian

USA . 6,129 parts In-Stock

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Digiode

USA . 3,578 parts In-Stock

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AZTECH Wire

Italy . 526 parts In-Stock

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$9.979

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526

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One Stop Electronics

USA . 360 parts In-Stock

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$24.000

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360

$24.000

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Parana Technologies

USA . 773 parts In-Stock

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$125.945

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DigiPath Technology Company

USA . 1,515 parts In-Stock

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$138.681

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$127.586

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$127.586

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IDEA Electronic Components Group

UK . 1,962 parts In-Stock

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$141.511

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$134.435

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$127.360

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1,962

$141.511

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$127.360

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ChromeModa Solutions

Germany . 796 parts In-Stock

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$141.511

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$116.039

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Corphita

USA . 4,351 parts In-Stock

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Overview

Upgrade your electronic designs with the TIB82S167BCJT by Texas Instruments, a high-quality Programmable Logic Device that offers unmatched versatility and reliability. Manufactured by industry leader Texas Instruments, this PLD is perfect for a wide range of applications in industries such as telecommunications, automotive, and consumer electronics. With its advanced technology and durable ceramic package body, this TTL device provides customers with superior performance and value. Trust Texas Instruments to deliver cutting-edge solutions for all your design needs.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages offer better thermal conductivity and durability, making the device more reliable in various operating conditions.

Technology Used: TTL

TTL technology ensures high speed and reliable performance, making this device suitable for applications where speed is crucial.

No. of Inputs: 14

Having 14 inputs allows for more complex logic operations to be implemented, making this device versatile for different applications.

Package Shape: RECTANGULAR

Rectangular package shape is easy to handle and integrate into circuit designs, simplifying the overall system layout.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide strong mechanical connections, enhancing the reliability of the device in industrial environments.

Nominal Supply Voltage (V): 5

Operating at a low nominal supply voltage of 5V makes this device suitable for power-efficient applications.

Architecture: PLS-TYPE

PLS-type architecture offers flexibility in programming and configuring the device for specific logic functions, enhancing its versatility.

No. of Terminals: 24

Having 24 terminals allows for easy interfacing with external components, enabling seamless integration into larger systems.

Programmable IC Type: OT PLD

Being an OT PLD (One-Time Programmable Programmable Logic Device) offers reliability and security in programming the device for specific applications.

Package Style (Meter): IN-LINE

In-line package style simplifies the placement and routing of the device on a circuit board, optimizing space utilization.

No. of Product Terms: 48

Having 48 product terms provides ample resources for implementing complex logic functions, making this device suitable for diverse applications.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this device can withstand high-temperature environments and operate reliably under stress.

Pitch Of Terminal: 2.54 mm

Having a terminal pitch of 2.54mm allows for easy connection and soldering, simplifying the manufacturing and assembly process.

Minimum Operating Temperature: 0 °C

Operating at a minimum temperature of 0°C ensures reliability and performance even in cold environments, making this device versatile for various applications.

Position Of Terminal: DUAL

Dual terminal positioning offers redundancy and flexibility in connection options, enhancing the reliability and ease of integration of the device.

Maximum Clock Frequency: 30 MHz

With a maximum clock frequency of 30 MHz, this device can handle high-speed operations efficiently, making it suitable for real-time applications.

No. of Outputs: 6

Having 6 outputs allows for multiple logic responses to be generated, enabling complex control and processing capabilities in the device.

Grading Of Temperature: COMMERCIAL

Commercial temperature grading ensures compatibility with standard operating environments, making this device suitable for a wide range of commercial applications.

Technical Specifications

Programmable Logic Devices (PLD) TIB82S167BCJT attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

No. of Outputs:

6

No. of Inputs:

14

No. of Product Terms:

48

Maximum Clock Frequency:

30 MHz

Technology:

TTL

Architecture:

PLS-TYPE

Sub-Category:

Programmable Logic Devices

Power Characteristics

Nominal Supply Voltage:

5

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

70 °C (158 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Ceramic

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP24,.3

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

24

Terminal Pitch:

2.54 mm

Standards

JESD-30 Code:

R-XDIP-T24

Qualified:

No

Trade Compliance

TIB82S167BCJT Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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