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TIB82S167BCFN

Texas Instruments

TIB82S167BCFN by Texas Instruments

TIB82S167BCFN by Texas Instruments is a TTL technology Programmable Logic Device with 14 inputs, 6 outputs, and 48 product terms. It has a propagation delay of 20 ns and operates at a max clock frequency of 30 MHz. Ideal for applications requiring fast processing speeds in commercial extended temperature environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 3,751 parts In-Stock

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3,751

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Vyrian

USA . 1,224 parts In-Stock

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1,224

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

One Stop Electronics

USA . 1,406 parts In-Stock

1+ parts

$9.000

100+ parts

-

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1,406

$9.000

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AZTECH Wire

Italy . 872 parts In-Stock

1+ parts

$14.486

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872

$14.486

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Parana Technologies

USA . 497 parts In-Stock

1+ parts

$100.924

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497

$100.924

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DigiPath Technology Company

USA . 940 parts In-Stock

1+ parts

$111.130

100+ parts

$102.240

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940

$111.130

$102.240

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ChromeModa Solutions

Germany . 1,749 parts In-Stock

1+ parts

$113.398

100+ parts

$92.986

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1,749

$113.398

$92.986

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IDEA Electronic Components Group

UK . 1,018 parts In-Stock

1+ parts

$113.398

100+ parts

$107.728

1k+ parts

$102.058

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1,018

$113.398

$107.728

$102.058

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Corphita

USA . 755 parts In-Stock

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755

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Overview

Unlock the power of advanced technology with the TIB82S167BCFN by Texas Instruments. Crafted with precision and expertise, this Programmable Logic Device offers unmatched performance and reliability for a wide range of applications. From enhancing automation systems to optimizing communication networks, this PLD is designed to deliver seamless operation and efficiency. Experience the value of cutting-edge technology with Texas Instruments and revolutionize your projects with the TIB82S167BCFN.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of plastic/epoxy material provides a cost-effective and lightweight solution for the packaging of the PLD.

Propagation Delay: 20 ns

The low propagation delay ensures fast signal processing, making this PLD suitable for applications that require quick response times.

Maximum Supply Voltage: 5.25 V

The high maximum supply voltage allows for compatibility with a wide range of systems and voltage levels.

Technology Used: TTL

The TTL technology used in this PLD ensures high-speed and reliable operation, making it suitable for demanding applications.

No. of Inputs: 14

With 14 inputs, this PLD can accommodate a variety of input signals, providing flexibility in design and functionality.

Package Shape: SQUARE

The square package shape allows for easy integration into circuit board layouts, optimizing space utilization.

Maximum Clock Frequency: 30 MHz

The high maximum clock frequency enables efficient operation at high speeds, making this PLD suitable for applications that require rapid processing.

Technical Specifications

Programmable Logic Devices (PLD) TIB82S167BCFN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

14 Dedicated Inputs, 0 I/O

No. of Outputs:

6

Output Function:

Registered

No. of Inputs:

14

No. of Product Terms:

48

No. of Dedicated Inputs:

14

No. of I/O Lines:

0

Maximum Clock Frequency:

30 MHz

Propagation Delay:

20 ns

Technology:

TTL

Architecture:

PLS-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Programmable Logic Sequencer

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

Chip Carrier

Package Code:

Package Shape:

Package Equivalence Code:

LDCC28,.5SQ

Width:

11.5062 mm

Length:

11.5062 mm

Maximum Seated Height:

4.57 mm

Terminal Characteristcs

Terminal Position:

Quad

Terminal Form:

No. of Terminals:

28

Terminal Pitch:

1.27 mm

Standards

JESD-30 Code:

S-PQCC-J28

Qualified:

No

Trade Compliance

TIB82S167BCFN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

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Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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