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TIBPAL16R8-25CN

Texas Instruments

TIBPAL16R8-25CN by Texas Instruments

TIBPAL16R8-25CN by Texas Instruments is a PAL-TYPE PLD with 20ns propagation delay, 5.25V max supply voltage, and 30MHz clock frequency. Ideal for applications requiring fast logic operations in commercial extended temperature environments.

Median Price

$1.270

Lifecycle Status

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42

In-Stock Inventory

1k+

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Rochester

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$1.020

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Element14

Singapore . 138 parts In-Stock

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Freelance Electronics

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TEDSS.com

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American Microsemiconductor Inc.

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ComSIT Distribution GmbH

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Vyrian

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Prism Electronics

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Legend Electronics Inc.

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Holdelec - ElecDif-Pro

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Bristol Electronics

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A2Z Electronics, Inc.

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Inland Empire Components Inc.

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Mentor Electronics Marketing, LLC

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Microfarads

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PC Components Company LLC

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Mil-Aero Solutions, Inc.

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ECAB

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Sunrise Surplus Inc.

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

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First Choice Components Inc.

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Elcom Components

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Contempo Components LLC

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MISTER SPROCKETS

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Electronics Depot

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Fibra_Brandt Electronic GMBH

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Electronic Expediters

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Semi Source

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Zilex Electronics Inc.

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LittleDiode

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4 Star Electronics, Inc.

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Atlantic Semiconductor

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AZTECH Wire

Italy . 250 parts In-Stock

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$9.334

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One Stop Electronics

USA . 474 parts In-Stock

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Parana Technologies

USA . 487 parts In-Stock

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DigiPath Technology Company

USA . 126 parts In-Stock

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$51.520

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$47.398

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ChromeModa Solutions

Germany . 3,341 parts In-Stock

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$43.108

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IDEA Electronic Components Group

UK . 1,668 parts In-Stock

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$52.571

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$49.942

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$47.314

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Kepictronics

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Infinite Electronics LLP (Excess)

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Corphita

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Assy Fe

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Speed Components Ltd (Excess)

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Microchip USA

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Cyclops Electronics Ltd (Excess)

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Overview

Unlock endless possibilities with the TIBPAL16R8-25CN by Texas Instruments! As a leader in the industry, Texas Instruments brings you top-notch quality and reliability in the form of Programmable Logic Devices (PLD). This versatile device offers unmatched performance for a wide range of applications. From enhancing system functionality to optimizing circuit design, the TIBPAL16R8-25CN delivers value and efficiency like no other. Trust Texas Instruments to power your innovations and take your projects to new heights!

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

Provides durability and protection for the internal components, ensuring longevity of the product.

Propagation Delay: 20 ns

Fast propagation delay allows for quick processing of signals, making this product suitable for applications requiring high-speed data processing.

Maximum Supply Voltage: 5.25 V

Wide range of supply voltage allows for compatibility with various power sources, increasing flexibility in usage.

Screening Level: MIL-STD-883

Meets military standards for reliability and quality, ensuring high performance in demanding environments.

Technology Used: TTL

TTL technology offers low power consumption and high noise immunity, making this product energy-efficient and reliable.

No. of Inputs: 8

Sufficient number of inputs for versatile interfacing with external devices or sensors.

Package Shape: RECTANGULAR

Compact rectangular shape allows for space-efficient integration into various electronic systems.

Form Of Terminal: THROUGH-HOLE

Through-hole terminals provide secure and reliable connections, ensuring stable performance in harsh operating conditions.

Nominal Supply Voltage (V): 5

Standard supply voltage ensures compatibility with common power sources, simplifying integration into existing systems.

Power Supplies (V): 5

Consistent power supply voltage ensures stable performance and reliable operation of the product.

No. of Terminals: 20

Adequate number of terminals for versatile connectivity options, enabling flexible configuration in different applications.

Programmable IC Type: OT PLD

Programmable IC allows for customization and adaptation to specific application requirements.

Package Style (Meter): IN-LINE

In-line package style facilitates easy installation and maintenance in a linear layout.

Output Function: REGISTERED

Registered output function ensures synchronized and reliable signal transmission, enhancing system performance.

No. of Product Terms: 64

Large number of product terms provide flexibility in logic design and implementation.

Minimum Supply Voltage: 4.75 V

Low minimum supply voltage enables operation in low-power scenarios without compromising performance.

Maximum Operating Temperature: 75 °C

High operating temperature range allows for reliable operation in varying environmental conditions.

Pitch Of Terminal: 2.54 mm

Standard terminal pitch for easy integration and compatibility with common electronic components.

Organization: 8 DEDICATED INPUTS, 0 I/O

Dedicated inputs streamline the signal processing flow, improving efficiency and reducing complexity.

No. of Dedicated Inputs: 8

Sufficient dedicated inputs for specific functionalities, enhancing design flexibility and performance optimization.

Minimum Operating Temperature: 0 °C

Low minimum operating temperature ensures reliable performance even in cold environments.

Finishing Of Terminal Used: NICKEL PALLADIUM GOLD

Nickel palladium gold finishing enhances terminal conductivity and corrosion resistance, ensuring long-term reliability.

Position Of Terminal: DUAL

Dual terminal position allows for secure connection and stability in mounting.

Maximum Seated Height: 5.08 mm

Low maximum seated height enables compact design and easy integration into space-constrained systems.

Width: 7.62 mm

Narrow width facilitates installation in tight spaces and allows for dense packaging in electronic assemblies.

Maximum Clock Frequency: 30 MHz

High maximum clock frequency supports fast data processing and efficient operation at high speeds.

No. of Outputs: 8

Adequate number of outputs for signal distribution and processing, enhancing the functionality of the product.

Length: 25.4 mm

Moderate length allows for versatile placement and easy integration into various electronic systems.

Grading Of Temperature: COMMERCIAL EXTENDED

Commercial extended temperature grading ensures reliable performance across a wide range of operating conditions.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R8-25CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 0 I/O

No. of Outputs:

8

Output Function:

Registered

No. of Inputs:

8

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

0

Maximum Clock Frequency:

30 MHz

Propagation Delay:

20 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

25.4 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Qualified:

No

Screening Level:

MIL-STD-883

Trade Compliance

TIBPAL16R8-25CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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