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TIBPAL16R4-15CN

Texas Instruments

TIBPAL16R4-15CN by Texas Instruments

TIBPAL16R4-15CN by Texas Instruments is a TTL technology-based PAL-type PLD with 12 inputs, 8 dedicated inputs, and 4 I/O lines. It offers a propagation delay of 15 ns, max clock frequency of 50 MHz, and mixed output function. Ideal for applications requiring fast processing speeds and versatile input/output configurations in commercial extended temperature environments.

Median Price

$2.500

Lifecycle Status

Suppliers In-Stock

43

In-Stock Inventory

1k+

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Freelance Electronics

USA . 42 parts In-Stock

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TEDSS.com

USA . 8,995 parts In-Stock

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American Microsemiconductor Inc.

USA . 13 parts In-Stock

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Vyrian

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Prism Electronics

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Electronic Expediters

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Bristol Electronics

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Inventory MP

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PC Components Company LLC

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Holdelec - ElecDif-Pro

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ComSIT Distribution GmbH

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Mentor Electronics Marketing, LLC

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A2Z Electronics, Inc.

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LWI Electronics Inc

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Manotoh

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Infinite Electronics LLP

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Zilex Electronics Inc.

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NAC Semi

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ECAB

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First Choice Components Inc.

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Speed Components Ltd

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Pegasus Components GmbH

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Manoshevitz Elec. Sales

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LittleDiode

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GES GmbH

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AZTECH Wire

Italy . 248 parts In-Stock

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One Stop Electronics

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Parana Technologies

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DigiPath Technology Company

USA . 1,637 parts In-Stock

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$140.026

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IDEA Electronic Components Group

UK . 2,256 parts In-Stock

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$155.308

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$147.543

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ChromeModa Solutions

Germany . 1,602 parts In-Stock

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$127.353

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Microchip USA

USA . 8,108 parts In-Stock

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Corphita

USA . 2,973 parts In-Stock

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Lixinc

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A-Z Elektronik GmbH

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Authorized Procurement Solutions

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Perfect Parts

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Kepictronics

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Cyclops Electronics Ltd (Excess)

UK . 140 parts In-Stock

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A-Plus Industry Inc.

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Assy Fe

Spain . 84 parts In-Stock

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Glotronic Ltd.

UK . 64 parts In-Stock

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Speed Components Ltd (Excess)

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Overview

Unlock the potential of your electronic projects with the TIBPAL16R4-15CN by Texas Instruments. As a leader in the industry, Texas Instruments offers top-quality Programmable Logic Devices that deliver reliable performance for various applications. Whether you're working on automation, data processing, or control systems, this PLD provides fast propagation delay, versatile input/output functions, and a wide operating temperature range. Trust Texas Instruments to provide cutting-edge technology and unmatched value for your projects. Elevate your designs with the TIBPAL16R4-15CN today.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The use of PLASTIC/EPOXY material for the package body makes the device durable and resistant to external elements, ensuring reliable performance over time.

Propagation Delay: 15 ns

With a low propagation delay of 15 ns, this device offers fast signal processing, making it suitable for applications that require quick response times.

Maximum Supply Voltage: 5.25 V

The maximum supply voltage of 5.25 V provides a safe operating range for the device, preventing damage from overvoltage conditions.

Technology Used: TTL

The use of TTL technology ensures compatibility with existing TTL-based systems, making it easy to integrate this PLD into various applications.

No. of Inputs: 12

With 12 inputs, this PLD offers flexibility in design and can accommodate a wide range of input signals, making it versatile for different use cases.

Package Shape: RECTANGULAR

The rectangular package shape allows for easy integration and placement on a PCB, optimizing space efficiency and simplifying the overall design.

Form Of Terminal: THROUGH-HOLE

The through-hole terminal design provides secure mechanical support and reliable connections, ensuring stable operation even in harsh environments.

Architecture: PAL-TYPE

The PAL-type architecture offers flexibility in programming and custom logic implementation, making it suitable for a wide range of applications that require programmable logic.

Nominal Supply Voltage (V): 5

The nominal supply voltage of 5 V ensures compatibility with standard power sources, making it easy to integrate this PLD into existing systems.

Power Supplies (V): 5

Having a single power supply at 5 V simplifies the system design and reduces complexity, making it easier to implement this PLD in various applications.

No. of Terminals: 20

With 20 terminals, this PLD provides ample connectivity options and interfaces for different components, enhancing its versatility and compatibility with various systems.

Programmable IC Type: OT PLD

The OT PLD type allows for reconfiguration and reprogramming of logic functions, enabling customization and adaptability to different use cases and evolving requirements.

Package Style (Meter): IN-LINE

The in-line package style is space-efficient and suitable for compact designs, making this PLD suitable for applications where size constraints are a concern.

Output Function: MIXED

The mixed output function allows for versatile signal processing and handling, making this PLD suitable for applications that require different types of output signals.

No. of Product Terms: 64

With 64 product terms, this PLD offers a high level of logic complexity and functionality, enabling the implementation of advanced logic operations and functions.

Minimum Supply Voltage: 4.75 V

The minimum supply voltage of 4.75 V provides a wide operating range and ensures reliable performance even under varying voltage conditions, enhancing the device's robustness.

Maximum Operating Temperature: 75 °C

With a maximum operating temperature of 75°C, this PLD can withstand high temperatures, making it suitable for applications that require extended operation in challenging environments.

Pitch Of Terminal: 2.54 mm

The 2.54 mm pitch of terminals allows for easy connection and integration with standard components and PCB layouts, ensuring compatibility and ease of use.

Organization: 8 DEDICATED INPUTS, 4 I/O

The organization of 8 dedicated inputs and 4 I/O lines provides a balanced and versatile configuration for handling input and output signals, making this PLD suitable for various logic functions.

No. of Dedicated Inputs: 8

With 8 dedicated inputs, this PLD offers sufficient input options for connecting external signals and sensors, allowing for flexible logic implementation and processing.

Minimum Operating Temperature: 0 °C

The minimum operating temperature of 0°C ensures reliable performance even in cold environments, making this PLD suitable for a wide range of operating conditions.

Finishing Of Terminal Used: NICKEL PALLADIUM GOLD

The use of nickel, palladium, and gold finishing on the terminals provides corrosion resistance and ensures long-term reliability of connections, enhancing the durability of this PLD.

Position Of Terminal: DUAL

The dual position of terminals allows for flexible mounting and orientation options, making it easier to integrate this PLD into different PCB layouts and systems.

Maximum Seated Height: 5.08 mm

With a maximum seated height of 5.08 mm, this PLD is compact and space-efficient, making it suitable for applications with tight height constraints or limited mounting space.

Width: 7.62 mm

The width of 7.62 mm makes this PLD compact and suitable for space-constrained designs, providing flexibility and versatility in integrating the device into various systems.

Maximum Clock Frequency: 50 MHz

The maximum clock frequency of 50 MHz allows for high-speed operation and efficient signal processing, making this PLD suitable for applications that require fast logic operations and response times.

No. of Outputs: 8

With 8 outputs, this PLD can drive multiple output signals simultaneously, enabling versatile signal processing and control capabilities for different applications.

Length: 25.4 mm

The length of 25.4 mm provides a compact form factor for this PLD, making it suitable for applications where space is limited and compact designs are required.

No. of I/O Lines: 4

Having 4 I/O lines offers a balanced number of input and output options, allowing for versatile signal processing and control functions, making this PLD suitable for various applications.

Grading Of Temperature: COMMERCIAL EXTENDED

The commercial extended temperature grading ensures reliable performance over a wide temperature range, making this PLD suitable for commercial applications in various operating conditions.

Technical Specifications

Programmable Logic Devices (PLD) TIBPAL16R4-15CN attributes and parameters. Explore more Programmable Logic Devices (PLD) devices from Texas Instruments

IC Features

Programmable IC Type:

Organization:

8 Dedicated Inputs, 4 I/O

No. of Outputs:

8

Output Function:

Mixed

No. of Inputs:

12

No. of Product Terms:

64

No. of Dedicated Inputs:

8

No. of I/O Lines:

4

Maximum Clock Frequency:

50 MHz

Propagation Delay:

15 ns

Technology:

TTL

Architecture:

PAL-TYPE

Sub-Category:

Programmable Logic Devices

Additional Features:

Power-Up Reset

Power Characteristics

Nominal Supply Voltage:

5

Minimum Supply Voltage:

4.75 V

Maximum Supply Voltage:

5.25 V

Power Supplies (V):

5 V

Temperature and Environmental Ratings

Maximum Operating Temperature:

75 °C (167 °F)

Minimum Operating Temperature:

0 °C (32 °F)

Temprature Grade:

Packaging and Physical Characteristics

Package Body Material:

Plastic/Epoxy

Package Style (Meter):

In-Line

Package Code:

DIP

Package Shape:

Package Equivalence Code:

DIP20,.3

Width:

7.62 mm

Length:

25.4 mm

Maximum Seated Height:

5.08 mm

Terminal Characteristcs

Terminal Position:

Dual

Terminal Form:

No. of Terminals:

20

Terminal Pitch:

2.54 mm

Terminal Finish:

Nickel Palladium Gold

Standards

JESD-30 Code:

R-PDIP-T20

JESD-609 Code:

e4

Qualified:

No

Trade Compliance

TIBPAL16R4-15CN Programmable ICs trade compliance attributes, and parameters.

HTS

8542.39.00.01

SB

8542.39.00.00

PCN

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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