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TMS27128T-25JL

Texas Instruments

TMS27128T-25JL by Texas Instruments

TMS27128T-25JL by Texas Instruments is a 16KX8 EPROM with 131072 bit memory density and 250 ns max access time. It operates at temperatures b/w 0 to 70 °C, suitable for commercial applications requiring fast data retrieval in a 28-terminal IN-LINE package.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 7,749 parts In-Stock

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7,749

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Digiode

USA . 524 parts In-Stock

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524

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 407 parts In-Stock

1+ parts

$4.184

100+ parts

-

1k+ parts

$4.626

10k+ parts

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407

$4.184

-

$4.626

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ChromeModa Solutions

Germany . 5,448 parts In-Stock

1+ parts

$4.701

100+ parts

$3.855

1k+ parts

-

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5,448

$4.701

$3.855

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IDEA Electronic Components Group

UK . 974 parts In-Stock

1+ parts

$4.701

100+ parts

-

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$4.231

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974

$4.701

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$4.231

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AZTECH Wire

Italy . 564 parts In-Stock

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$6.807

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564

$6.807

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One Stop Electronics

USA . 538 parts In-Stock

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$12.000

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538

$12.000

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Corphita

USA . 4,908 parts In-Stock

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4,908

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DigiPath Technology Company

USA . 130 parts In-Stock

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$4.238

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130

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$4.238

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Overview

Unlock the power of innovation with the TMS27128T-25JL EPROM by Texas Instruments. Known for their superior quality and reliability, Texas Instruments EPROMs are trusted by professionals worldwide. The TMS27128T-25JL offers a wide range of applications in various industries, providing exceptional value and benefits to customers. With its advanced technology and high memory density, this EPROM delivers fast access times and seamless performance. Trust Texas Instruments for all your EPROM needs and experience the difference in quality and excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic packages provide excellent protection against moisture and temperature variations, ensuring long-term reliability and durability of the EPROM.

Input/Output Type: COMMON

Common input/output type simplifies integration into existing systems and makes it compatible with a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

A 5V supply voltage is common in many electronic systems, providing compatibility and ease of integration.

Organization: 16KX8

With an organization of 16KX8, this EPROM offers a large capacity for storing data efficiently and effectively.

Technology: MOS

MOS technology offers high speed and low power consumption, making this EPROM an energy-efficient choice for various applications.

Maximum Access Time: 250 ns

With a fast maximum access time of 250 ns, this EPROM provides quick data retrieval and processing capabilities, ideal for high-performance systems.

Technical Specifications

EPROM TMS27128T-25JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

250 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T28

Memory Density:

131072 bit

Memory Width:

8

No. of Terminals:

28

No. of Words:

16384 words

No. of Words Code:

16K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

16KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Power Supplies (V):

5

Qualification:

Not Qualified

Sub-Category:

EPROMs

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Trade Compliance

TMS27128T-25JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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