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5962-87515023C

STMicroelectronics

5962-87515023C by STMicroelectronics

5962-87515023C by STMicroelectronics is a military-grade EPROM with a 5V supply, featuring an asynchronous operation mode and a max access time of 55 ns. It has a memory density of 65536 bits organized as 8Kx8. Ideal for high-reliability applications in harsh environments.

Median Price

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Lifecycle Status

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4

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1k+

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Anansix

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Digiode

USA . 634 parts In-Stock

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Vyrian

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Prism Electronics

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IDEA Electronic Components Group

UK . 208 parts In-Stock

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$3.269

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$2.942

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MKK Technologies

India . 1,098 parts In-Stock

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DigiPath Technology Company

USA . 1,098 parts In-Stock

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Corphita

USA . 4,488 parts In-Stock

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Northwest PG Solutions

USA . 1,690 parts In-Stock

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Native Components

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Supply Digital

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Parana Technologies

USA . 273 parts In-Stock

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Perfect Parts

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Overview

Elevate your projects with the 5962-87515023C EPROM from STMicroelectronics, a trusted leader in semiconductor innovation. Crafted with precision and built to withstand rigorous military standards, this asynchronous memory solution ensures reliability even in extreme conditions. Its gold-finished terminals and robust ceramic package enhance performance, making it ideal for aerospace, defense, and industrial applications. Experience unmatched quality and peace of mind as you power your designs with excellence.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed co-fired package provides excellent durability and thermal stability, making it suitable for harsh environments.

Surface Mount: YES

Surface mount capability allows for efficient space utilization on circuit boards, facilitating compact designs.

Screening Level: 38535Q/M; 38534H; 883B

High-level screening ensures reliability and quality, meeting rigorous military and aerospace specifications.

Package Shape: SQUARE

A square package shape offers uniformity in layout and improves integration into PCB designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies design and interfacing, providing flexibility in various applications.

Input/Output Type: COMMON

Common I/O type enhances compatibility with a wide range of existing systems and interfaces.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V allows for standard power supply integration in most digital circuits.

Power Supplies (V): 5

Single supply requirement simplifies design and reduces component count in electronic systems.

No. of Terminals: 28

The 28 terminals provide ample connection points for versatile applications, accommodating various configurations.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier with a window allows for easy optical access, essential for UV programming functionalities.

Maximum Operating Temperature: 125 °C

High maximum operating temperature rating ensures performance stability in demanding thermal environments.

Organization: 8KX8

The 8Kx8 organization balances density and accessibility, optimizing performance and data retrieval.

Output Characteristics: 3-STATE

3-state output is ideal for bus systems, enabling multiple devices to share communication lines without conflict.

Minimum Operating Temperature: -55 °C

Wide temperature range, with a low minimum operating temperature, makes this product suitable for extreme environments.

Terminal Finish: Gold (Au)

Gold terminal finish provides excellent corrosion resistance and ensures reliable electrical connections over time.

Terminal Position: QUAD

Quad terminal position facilitates easy access and enhances routing options on PCBs.

Maximum Seated Height: 3.3 mm

Low seated height contributes to a smaller overall profile in the design, accommodating space-constrained applications.

Width: 11.455 mm

Standard width makes it easy to incorporate into existing PCB designs while allowing efficient space usage.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures compatibility with various power supplies, enhancing design flexibility.

Length: 11.455 mm

Uniform dimensions facilitate seamless integration with other components on the PCB.

Temperature Grade: MILITARY

Military-grade temperature classification ensures the product can withstand rigorous conditions, enhancing reliability.

Technology: CMOS

CMOS technology supports low power consumption and high-speed operation, making it ideal for modern electronic applications.

Parallel or Serial: PARALLEL

Parallel access allows for faster data retrieval, improving overall system performance in high-speed applications.

Terminal Form: NO LEAD

No lead terminal form enhances the reliability of connections and is friendly for automated assembly processes.

No. of Words: 8192 words

With 8192 words of storage, this product offers sufficient capacity for various application needs.

Memory Width: 8

An 8-bit memory width is ideal for common data formats, streamlining interfaces and design complexity.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch allows for compatibility with various PCB designs and component density requirements.

No. of Words Code: 8K

The 8K words code provides adequate memory for most embedded applications, ensuring efficient performance.

Maximum Supply Voltage (Vsup): 5.5 V

Max supply voltage of 5.5V accommodates variations in power supply, ensuring stable operation.

Memory Density: 65536 bit

High memory density supports complex applications and larger datasets, useful in various digital circuits.

Memory IC Type: UVPROM

As a UVPROM type, the device offers reprogrammability, enhancing versatility and longevity in applications.

Maximum Access Time: 55 ns

Fast maximum access time of 55 ns facilitates high-speed data processing, making it suitable for performance-critical applications.

Technical Specifications

EPROM 5962-87515023C attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

Input/Output Type:

COMMON

JESD-30 Code:

S-CQCC-N28

JESD-609 Code:

e4

Length:

11.455 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

3.3 mm

Sub-Category:

EPROMs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Gold (Au)

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.455 mm

Trade Compliance

5962-87515023C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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