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TMS27C291-3JL

Texas Instruments

TMS27C291-3JL by Texas Instruments

TMS27C291-3JL by Texas Instruments is a 2KX8 EPROM with 35ns access time, 3-state output, and operates at 5V. It is used in commercial applications for memory storage due to its 2048 words capacity and CMOS technology.

Median Price

$8.675

Lifecycle Status

Suppliers In-Stock

9

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Rochester

USA . 5,774 parts In-Stock

1+ parts

-

100+ parts

$6.940

1k+ parts

$6.210

10k+ parts

$5.840

5,774

-

$6.940

$6.210

$5.840

DigiKey

USA . 5,774 parts In-Stock

1+ parts

-

100+ parts

$9.130

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5,774

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$9.130

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Verical

USA . 4,963 parts In-Stock

1+ parts

-

100+ parts

$8.675

1k+ parts

$7.763

10k+ parts

$7.300

4,963

-

$8.675

$7.763

$7.300

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 2,136 parts In-Stock

1+ parts

$7.324

100+ parts

-

1k+ parts

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2,136

$7.324

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Vyrian

USA . 3,155 parts In-Stock

1+ parts

$7.710

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3,155

$7.710

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Bristol Electronics

USA . 150 parts In-Stock

1+ parts

$9.375

100+ parts

$5.625

1k+ parts

$5.391

10k+ parts

-

150

$9.375

$5.625

$5.391

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DigiKey Marketplace

USA . 5,807 parts In-Stock

1+ parts

-

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5,807

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Microfarads

USA . 145 parts In-Stock

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145

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 15 parts In-Stock

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15

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,652 parts In-Stock

1+ parts

$3.303

100+ parts

-

1k+ parts

$3.826

10k+ parts

-

1,652

$3.303

-

$3.826

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ChromeModa Solutions

Germany . 6,923 parts In-Stock

1+ parts

$3.711

100+ parts

$3.043

1k+ parts

-

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6,923

$3.711

$3.043

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IDEA Electronic Components Group

UK . 188 parts In-Stock

1+ parts

$3.711

100+ parts

-

1k+ parts

$3.340

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188

$3.711

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$3.340

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Corphita

USA . 4,213 parts In-Stock

1+ parts

$6.939

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4,213

$6.939

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DigiPath Technology Company

USA . 277 parts In-Stock

1+ parts

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100+ parts

$3.346

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277

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$3.346

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Overview

Unlock the power of reliable data storage with the TMS27C291-3JL EPROM by Texas Instruments. Crafted with precision using ceramic and metal-sealed cofired materials, this memory device offers seamless operation in various applications. With a 2Kx8 organization and 3-state output characteristics, this EPROM provides high performance and versatility. Trust in Texas Instruments' reputation for quality and innovation, and discover the value and benefits that the TMS27C291-3JL can bring to your projects. Experience efficient data access and storage like never before with this exceptional EPROM from Texas Instruments.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material provides durability and reliability, making the product suitable for rugged environments.

Nominal Supply Voltage / Vsup (V): 5

The supply voltage of 5V ensures compatibility with standard power sources and ease of use.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for independent control over reading and writing, improving flexibility in data access.

Organization: 2KX8

The organization of 2KX8 ensures efficient storage and retrieval of data in a structured manner.

Technology: CMOS

The CMOS technology offers low power consumption and high speed, making the product energy efficient and fast.

Maximum Access Time: 35 ns

The fast access time of 35 ns ensures quick data retrieval and processing, enhancing overall system performance.

Technical Specifications

EPROM TMS27C291-3JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

35 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T24

Length:

31.75 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

2KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP24,.3

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Programming Voltage (V):

13.5

Qualification:

Not Qualified

Maximum Seated Height:

4.907 mm

Maximum Standby Current:

.075 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

75 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

7.62 mm

Trade Compliance

TMS27C291-3JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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