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TMS2532A-35JL

Texas Instruments

TMS2532A-35JL by Texas Instruments

TMS2532A-35JL by Texas Instruments is a 4KX8 EPROM with 32768 bit memory density and 350 ns access time. It has a temperature range of 0-70 °C, suitable for commercial applications requiring fast data retrieval in a compact IN-LINE package style.

Median Price

$9.750

Lifecycle Status

Suppliers In-Stock

11

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 60 parts In-Stock

1+ parts

$9.750

100+ parts

$6.094

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60

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$6.094

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Vyrian

USA . 5,490 parts In-Stock

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Digiode

USA . 4,266 parts In-Stock

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Q Components

USA . 955 parts In-Stock

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Standard Data Resources

USA . 505 parts In-Stock

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505

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Corel Iberica Componentes, S.L.

Spain . 302 parts In-Stock

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J & M Industries LLC

USA . 89 parts In-Stock

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ECAB

Sweden . 10 parts In-Stock

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Electronic Expediters

USA . 9 parts In-Stock

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Specialty Parts & Electronic Components, Inc. (S.P.E.C.)

USA . 9 parts In-Stock

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LittleDiode

UK . 3 parts In-Stock

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 571 parts In-Stock

1+ parts

$2.547

100+ parts

-

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$3.035

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571

$2.547

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$3.035

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DigiPath Technology Company

USA . 1,185 parts In-Stock

1+ parts

$2.805

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$2.580

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$2.805

$2.580

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IDEA Electronic Components Group

UK . 2,224 parts In-Stock

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$2.862

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$2.576

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2,224

$2.862

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ChromeModa Solutions

Germany . 1,251 parts In-Stock

1+ parts

$2.862

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$2.347

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$2.862

$2.347

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AZTECH Wire

Italy . 420 parts In-Stock

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$13.481

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One Stop Electronics

USA . 1,057 parts In-Stock

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$14.000

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1,057

$14.000

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Corphita

USA . 3,975 parts In-Stock

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3,975

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Overview

Unlock the power of reliable data storage with the TMS2532A-35JL EPROM by Texas Instruments. Known for their top-notch quality and cutting-edge technology, Texas Instruments delivers unparalleled performance in the field of memory solutions. Ideal for a wide range of applications, this EPROM offers customers a seamless experience with its fast access time, high memory density, and 3-state output characteristics. Trust Texas Instruments to provide you with a durable and efficient solution that will elevate your projects to the next level.

Feature Benefit Bullets

Package Body Material: CERAMIC

Ceramic package materials provide excellent thermal properties, making this EPROM more durable and reliable in various operating conditions.

Input/Output Type: COMMON

Common input/output type allows for simple interfacing with other components and systems, making integration easier.

Maximum Operating Temperature: 70 °C

With a maximum operating temperature of 70°C, this EPROM can function efficiently in a wide range of environmental conditions.

Organization: 4KX8

The 4KX8 organization provides a good balance between memory capacity and data access speed, suitable for many general purpose applications.

Output Characteristics: 3-STATE

3-STATE output characteristics allow for efficient bus sharing and multi-device communication, enhancing flexibility in system design.

Technology: MOS

MOS technology offers low power consumption and high-speed operation, making this EPROM energy-efficient and responsive.

Technical Specifications

EPROM TMS2532A-35JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

350 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-XDIP-T24

Memory Density:

32768 bit

Memory Width:

8

No. of Terminals:

24

No. of Words:

4096 words

No. of Words Code:

4K

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

4KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC

Package Code:

DIP

Package Equivalence Code:

DIP24,.6

Package Shape:

Package Style (Meter):

IN-LINE

Peak Reflow Temperature (C):

NOT SPECIFIED

Qualification:

Not Qualified

Sub-Category:

EPROMs

Surface Mount:

NO

Technology:

MOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

TMS2532A-35JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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