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TMS27C510-12JE

Texas Instruments

TMS27C510-12JE by Texas Instruments

TMS27C510-12JE by Texas Instruments is a 64KX8 EPROM with 120 ns access time, operating at 5V. It features a 3-STATE output and operates in industrial temperature range. Commonly used for memory storage applications due to its high density and parallel interface.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,774 parts In-Stock

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4,774

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Digiode

USA . 1,594 parts In-Stock

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1,594

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Distributors (Availability)

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Parana Technologies

USA . 1,699 parts In-Stock

1+ parts

$4.741

100+ parts

-

1k+ parts

$5.239

10k+ parts

-

1,699

$4.741

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$5.239

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AZTECH Wire

Italy . 246 parts In-Stock

1+ parts

$4.916

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246

$4.916

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One Stop Electronics

USA . 873 parts In-Stock

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$5.000

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873

$5.000

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DigiPath Technology Company

USA . 277 parts In-Stock

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$5.220

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277

$5.220

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ChromeModa Solutions

Germany . 4,116 parts In-Stock

1+ parts

$5.327

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$4.368

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4,116

$5.327

$4.368

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IDEA Electronic Components Group

UK . 609 parts In-Stock

1+ parts

$5.327

100+ parts

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$4.794

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609

$5.327

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$4.794

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Corphita

USA . 4,847 parts In-Stock

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Overview

Experience top-of-the-line quality and reliability with the TMS27C510-12JE EPROM by Texas Instruments. Designed with precision and expertise, this product offers unmatched performance in a variety of applications. From industrial settings to consumer electronics, this EPROM delivers exceptional value, benefits, and advantages to customers seeking high-quality memory solutions. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material ensures durability and reliability of the EPROM, making it suitable for industrial applications.

Nominal Supply Voltage / Vsup (V): 5

Having a consistent supply voltage of 5V ensures stable performance of the EPROM.

Organization: 64KX8

The organization of 64KX8 allows for efficient storage and retrieval of data in parallel, enhancing the speed and performance of the EPROM.

Temperature Grade: INDUSTRIAL

With an industrial temperature grade, this EPROM can withstand harsh environmental conditions, making it suitable for a wide range of applications.

Technology: CMOS

The CMOS technology used in this EPROM provides low power consumption and high speed operation, making it energy-efficient and reliable.

Memory Density: 524288 bit

With a high memory density, this EPROM can store a large amount of data in a compact form factor, making it ideal for applications requiring extensive memory storage.

Maximum Access Time: 120 ns

The fast access time of 120 ns ensures quick retrieval of data, facilitating smooth operation and performance of the EPROM.

Technical Specifications

EPROM TMS27C510-12JE attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

120 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T32

Length:

41.91 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.91 mm

Maximum Standby Current:

.00025 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C510-12JE Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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