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5962-8764802XA

Texas Instruments

5962-8764802XA by Texas Instruments

The Texas Instruments 5962-8764802XA EPROM operates at 5V with 64KX8 organization and 3-STATE output. It is MILITARY grade, CMOS technology UVPROM with 60mA max supply current. Ideal for applications requiring fast access time and high memory density in military-grade environments.

Median Price

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Lifecycle Status

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12

In-Stock Inventory

1k+

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Vyrian

USA . 2,972 parts In-Stock

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Digiode

USA . 2,177 parts In-Stock

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LWI Electronics Inc

India . 21 parts In-Stock

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ABC Electronics Ltd.

UK . 21 parts In-Stock

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Bristol Electronics

USA . 13 parts In-Stock

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Mil-Aero Solutions, Inc.

USA . 9 parts In-Stock

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Sinequanon

UK . 7 parts In-Stock

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Beltway Electronics Company

USA . 2 parts In-Stock

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R&J Components

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Electronic Expediters

USA . 2 parts In-Stock

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QIE Inc.

USA . 1 parts In-Stock

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North Shore Components

USA . 1 parts In-Stock

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MARBEL Systems

Belgium . 10 parts In-Stock

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$3.396

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10

$3.396

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Texas Native Microelectronics

USA . 2,387 parts In-Stock

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$3.904

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$3.748

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$3.631

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$3.436

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$3.904

$3.748

$3.631

$3.436

Parana Technologies

USA . 1,989 parts In-Stock

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$4.657

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$432.507

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$4.192

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Kenton Components

USA . 4,334 parts In-Stock

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$4.685

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$4.123

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Semicontronic

India . 1,156 parts In-Stock

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$5.000

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$4.875

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$4.850

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DigiPath Technology Company

USA . 1,208 parts In-Stock

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$5.128

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ChromeModa Solutions

Germany . 3,128 parts In-Stock

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$5.233

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$4.291

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IDEA Electronic Components Group

UK . 602 parts In-Stock

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$4.710

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Native Components

USA . 871 parts In-Stock

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$5.496

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One Stop Electronics

USA . 558 parts In-Stock

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Qasali Group International

UK . 503 parts In-Stock

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$9.276

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AZTECH Wire

Italy . 846 parts In-Stock

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Corphita

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Glotronic Ltd.

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Northwest PG Solutions

USA . 1,827 parts In-Stock

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Supply Digital

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Fulton Briggs Corp.

USA . 758 parts In-Stock

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A-Z Elektronik GmbH

Germany . 341 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the Texas Instruments 5962-8764802XA EPROM. Manufactured by a trusted industry leader, this ceramic, glass-sealed package offers military-grade screening levels and operates at temperatures ranging from -55°C to 125°C. With a 64KX8 organization and 3-STATE output characteristics, this product provides 524288 bits of memory in a compact 28-terminal design. Perfect for a wide range of applications, this EPROM delivers exceptional performance, making it an essential component for your next project. Choose Texas Instruments for superior technology you can rely on.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed package body material helps in providing better protection and durability to the EPROM, ensuring long-term reliability.

Screening Level: MIL-STD-883

The MIL-STD-883 screening level ensures that the EPROM has passed stringent military standards for performance and quality, making it suitable for use in mission-critical applications.

Nominal Supply Voltage: 5V

With a nominal supply voltage of 5V, this EPROM can easily integrate into existing systems without the need for additional voltage converters, making it a convenient choice for many applications.

Memory Density: 524288 bit

The high memory density of 524288 bits allows for storing a large amount of data in a compact form, making this EPROM suitable for applications requiring extensive data storage.

Maximum Operating Temperature: 125 °C

The EPROM's high maximum operating temperature of 125°C ensures reliable performance even in harsh environmental conditions, making it suitable for use in a wide range of applications.

Technical Specifications

EPROM 5962-8764802XA attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Standby Current:

.000325 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-8764802XA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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