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5962-8764803XA

Texas Instruments

5962-8764803XA by Texas Instruments

Texas Instruments' 5962-8764803XA EPROM operates in asynchronous mode with 64KX8 organization and 524288 bit memory density. It features a MIL-STD-883 screening level, -55 to 125 °C temperature range, and common I/O type. Ideal for military applications requiring fast access time of 250 ns.

Median Price

$88.391

Lifecycle Status

Suppliers In-Stock

15

In-Stock Inventory

1k+

Distributors (In-Stock)

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Freelance Electronics

USA . 9 parts In-Stock

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$88.391

100+ parts

$92.811

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$87.507

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9

$88.391

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$87.507

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Vyrian

USA . 6,435 parts In-Stock

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Digiode

USA . 3,942 parts In-Stock

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Eagle Technology Solutions

USA . 110 parts In-Stock

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MRC Electronics

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Mil-Aero Solutions, Inc.

USA . 19 parts In-Stock

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Electro Mavin

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Beltway Electronics Company

USA . 8 parts In-Stock

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Inland Empire Components Inc.

USA . 8 parts In-Stock

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8

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Resion

USA . 5 parts In-Stock

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Sunrise Surplus Inc.

USA . 2 parts In-Stock

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Electronic Expediters

USA . 2 parts In-Stock

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Odyssey Electronics LTD

USA . 2 parts In-Stock

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Semi Source

USA . 1 parts In-Stock

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Manoshevitz Elec. Sales

Israel . 1 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 1,604 parts In-Stock

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$3.295

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$3.818

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1,604

$3.295

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DigiPath Technology Company

USA . 1,002 parts In-Stock

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$3.628

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$3.628

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ChromeModa Solutions

Germany . 5,859 parts In-Stock

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$3.702

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$3.036

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IDEA Electronic Components Group

UK . 155 parts In-Stock

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$3.702

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$3.332

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MARBEL Systems

Belgium . 1,496 parts In-Stock

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$4.615

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Texas Native Microelectronics

USA . 328 parts In-Stock

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$5.305

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$5.093

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$4.934

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$4.668

328

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$5.093

$4.934

$4.668

Kenton Components

USA . 2,302 parts In-Stock

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$6.366

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$5.602

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Semicontronic

India . 272 parts In-Stock

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$11.000

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$10.725

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$10.670

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Qasali Group International

UK . 25 parts In-Stock

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$14.324

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$13.321

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$12.605

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AZTECH Wire

Italy . 828 parts In-Stock

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$14.366

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One Stop Electronics

USA . 1,238 parts In-Stock

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$28.000

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Native Components

USA . 295 parts In-Stock

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$85.680

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$82.253

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Northwest PG Solutions

USA . 628 parts In-Stock

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$94.248

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RGB Technical Solutions

Ukraine . 5,747 parts In-Stock

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Corphita

USA . 4,819 parts In-Stock

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Supply Digital

USA . 2,095 parts In-Stock

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Overview

Discover the unparalleled quality and reliability of the 5962-8764803XA by Texas Instruments, a leading manufacturer in the industry. As an EPROM with MIL-STD-883 screening level, this ceramic, glass-sealed package offers customers unmatched performance and durability. Ideal for military applications, this 64KX8 memory IC provides a seamless user experience with its common input/output type and asynchronous operation mode. Trust Texas Instruments to deliver cutting-edge technology that exceeds expectations and unlocks endless possibilities for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of ceramic and glass-sealed material ensures high durability and resistance to environmental factors, making this product suitable for harsh operating conditions.

Screening Level: MIL-STD-883

Compliance with MIL-STD-883 standards ensures high reliability and quality of the product, making it suitable for military and aerospace applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent access to each memory location, providing flexibility and efficient data retrieval in various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V ensures compatibility with standard power sources and enhances the reliability of the product.

No. of Words: 65536 words

With a high number of words, this EPROM offers ample storage capacity for data and programs, making it suitable for complex applications.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high-speed operation, making this EPROM energy-efficient and reliable.

Technical Specifications

EPROM 5962-8764803XA attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

250 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

DIP

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Standby Current:

.000325 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

60 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Trade Compliance

5962-8764803XA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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