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5962-8764801XX

Texas Instruments

5962-8764801XX by Texas Instruments

The Texas Instruments 5962-8764801XX EPROM features a 64KX8 organization, CMOS technology, and operates in parallel mode. With a supply voltage range of 4.5V to 5.5V, it is ideal for military-grade applications requiring high memory density and fast access times within a temperature range of -55°C to 125°C.

Median Price

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Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

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Vyrian

USA . 3,391 parts In-Stock

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3,391

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Digiode

USA . 2,177 parts In-Stock

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2,177

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Distributors (Availability)

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MARBEL Systems

Belgium . 80 parts In-Stock

1+ parts

$1.946

100+ parts

-

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80

$1.946

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Texas Native Microelectronics

USA . 3,153 parts In-Stock

1+ parts

$2.237

100+ parts

$2.148

1k+ parts

$2.080

10k+ parts

$1.969

3,153

$2.237

$2.148

$2.080

$1.969

Kenton Components

USA . 6,999 parts In-Stock

1+ parts

$2.684

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-

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$2.362

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$2.684

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$2.362

Parana Technologies

USA . 1,138 parts In-Stock

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$3.668

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-

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$4.175

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1,138

$3.668

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$4.175

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DigiPath Technology Company

USA . 502 parts In-Stock

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$4.039

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502

$4.039

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ChromeModa Solutions

Germany . 6,644 parts In-Stock

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$4.121

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$3.379

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$4.121

$3.379

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IDEA Electronic Components Group

UK . 327 parts In-Stock

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$4.121

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$3.709

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$4.121

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Qasali Group International

UK . 1,289 parts In-Stock

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$6.040

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$5.617

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$5.315

1,289

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$5.315

AZTECH Wire

Italy . 879 parts In-Stock

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$9.465

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879

$9.465

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Native Components

USA . 182 parts In-Stock

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$19.408

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Northwest PG Solutions

USA . 156 parts In-Stock

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$21.349

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$19.214

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One Stop Electronics

USA . 1,117 parts In-Stock

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$23.000

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$23.000

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Semicontronic

India . 616 parts In-Stock

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$23.000

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$22.425

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$22.310

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616

$23.000

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$22.310

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RGB Technical Solutions

Ukraine . 6,094 parts In-Stock

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Supply Digital

USA . 1,325 parts In-Stock

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Corphita

USA . 658 parts In-Stock

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Overview

Experience unparalleled quality and reliability with the 5962-8764801XX by Texas Instruments, a top-tier manufacturer known for cutting-edge EPROM technology. Ideal for military-grade applications, this ceramic, glass-sealed memory IC offers a seamless integration with its 64KX8 organization and lightning-fast access time of 150 ns. With a wide operating temperature range and dual-terminal finish, this EPROM ensures peak performance in even the harshest environments. Trust Texas Instruments to deliver superior products that exceed your expectations. Unlock the potential of your projects with the 5962-8764801XX today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic and glass-sealed body material provides durability and protection for the EPROM, ensuring reliable performance in various environments.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for independent operation of the EPROM, making it versatile and suitable for a wide range of applications.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage ensures stable power delivery to the EPROM, enhancing its overall performance and reliability.

Organization: 64KX8

The 64KX8 organization provides a large memory capacity and efficient data storage, making the EPROM suitable for storing a high volume of information.

Temperature Grade: MILITARY

The military-grade temperature rating ensures that the EPROM can withstand harsh environmental conditions and operate reliably in demanding applications.

Memory IC Type: UVPROM

The UVPROM memory IC type offers erasable and programmable memory capabilities, allowing for flexibility in data storage and retrieval.

Maximum Access Time: 150 ns

The fast maximum access time of 150 ns ensures quick data retrieval and processing, making the EPROM ideal for applications requiring high-speed operation.

Technical Specifications

EPROM 5962-8764801XX attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

150 ns

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

Length:

37.1475 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

64KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.588 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-8764801XX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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