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5962-8606306XA

STMicroelectronics

5962-8606306XA by STMicroelectronics

5962-8606306XA by STMicroelectronics is a military-grade UVPROM with a 32Kx8 organization, operating asynchronously at a nominal voltage of 5V. It features a max access time of 120 ns and operates within -55 °C to 125°C. Ideal for reliable data storage in harsh environments.

Median Price

$54.641

Lifecycle Status

Suppliers In-Stock

8

In-Stock Inventory

1k+

Distributors (Authorized)

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Flip Electronics (Authorized)

USA . 20 parts In-Stock

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Freelance Electronics

USA . 9 parts In-Stock

1+ parts

$54.641

100+ parts

$336.134

1k+ parts

$316.926

10k+ parts

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9

$54.641

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$316.926

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Vyrian

USA . 5,527 parts In-Stock

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Digiode

USA . 3,007 parts In-Stock

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Anansix

USA . 2,756 parts In-Stock

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Electronic Expediters

USA . 50 parts In-Stock

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Flip Electronics

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Inland Empire Components Inc.

USA . 3 parts In-Stock

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IDEA Electronic Components Group

UK . 771 parts In-Stock

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$4.272

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-

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$3.845

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771

$4.272

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$3.845

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MKK Technologies

India . 1,658 parts In-Stock

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$8.034

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$8.034

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DigiPath Technology Company

USA . 1,658 parts In-Stock

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$8.034

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$8.034

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Corphita

USA . 5,739 parts In-Stock

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Authorized Procurement Solutions

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Supply Digital

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Native Components

USA . 742 parts In-Stock

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742

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Parana Technologies

USA . 105 parts In-Stock

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$5.108

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Kepictronics

USA . 87 parts In-Stock

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Northwest PG Solutions

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Overview

Unlock unparalleled reliability with the 5962-8606306XA EPROM from STMicroelectronics, a leader in high-quality semiconductor solutions. Designed for demanding military applications, this robust ceramic package guarantees exceptional performance under extreme conditions. With its asynchronous operation and efficient power management, it ensures seamless data storage and retrieval, empowering your systems with unmatched speed and durability. Trust STMicroelectronics for innovation that drives success!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The use of premium ceramic and glass-sealed materials provides enhanced durability and reliability, making the product suitable for harsh environments.

Screening Level: 38535Q/M; 38534H; 883B

Meets stringent military screening levels, ensuring high quality and reliability for critical applications.

Package Shape: RECTANGULAR

Rectangular package shape facilitates easy integration into various circuit designs and optimizes space utilization.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for simpler interface designs and faster response times, ideal for performance-critical applications.

Input/Output Type: COMMON

Common I/O type enhances compatibility with various systems, making integration straightforward.

Nominal Supply Voltage / Vsup: 5 V

Standard 5 V supply voltage ensures compatibility with most electronic systems and reduces design complexity.

Power Supplies (V): 5

Single supply voltage simplifies power management and reduces the number of external components needed.

No. of Terminals: 28

28 terminals provide sufficient connections for various functionalities, allowing for more complex circuit designs.

Package Style (Meter): IN-LINE, WINDOW

In-line package style with a window allows for easy access and efficient programming of the device.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes the product suitable for use in demanding environments and applications.

Organization: 32KX8

The 32Kx8 organization provides a large memory capacity, enabling storage of substantial amounts of data.

Output Characteristics: 3-STATE

3-state output enables multiple devices to share the same data bus, reducing the overall complexity of the circuit.

Minimum Operating Temperature: -55 °C

Low minimum operating temperature expands the range of applications, particularly in extreme environments.

Terminal Finish: TIN LEAD

Tin lead finish ensures good solderability and is standard for reliable connections in electronic assemblies.

Terminal Position: DUAL

Dual terminal position provides flexibility in board layout and design, optimizing space usage.

Maximum Seated Height: 5.588 mm

Compact seated height allows for easier accommodation in a variety of enclosures and PCBs.

Width: 15.24 mm

Standard width facilitates easy integration into existing designs and layouts.

Minimum Supply Voltage (Vsup): 4.5 V

The low minimum supply voltage increases the versatility in different power supply situations.

Length: 37.1475 mm

Standard length aids in straightforward replacement and design innovation.

Programming Voltage (V): 12.5

The programmable voltage of 12.5V allows for fast and efficient programming of the device.

Temperature Grade: MILITARY

Military temperature grade ensures that the product can withstand extreme operating conditions.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it suitable for battery-operated applications.

Parallel or Serial: PARALLEL

Parallel operation enables faster data access and write times, improving overall performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide robust mechanical support and excellent reliability in demanding applications.

Maximum Supply Current: 65 mA

Generous maximum supply current enables robust performance under peak load conditions.

No. of Words: 32768 words

A high word count allows for significant data storage, optimizing the product for various applications.

Memory Width: 8

8-bit memory width aligns with common microprocessor architectures, facilitating easier data processing.

Terminal Pitch: 2.54 mm

Standard 2.54 mm pitch simplifies soldering and increases compatibility with various PCB designs.

No. of Words Code: 32K

Support for 32K words code enables versatile software solutions and applications.

Maximum Supply Voltage (Vsup): 5.5 V

The operational flexibility with a maximum supply voltage of 5.5 V allows compatibility with a variety of systems.

Memory Density: 262144 bit

With a high memory density, the product supports extensive data management and storage needs.

Memory IC Type: UVPROM

UVPROM type allows for reprogrammability and easy modification of stored data without needing physical replacement.

Maximum Standby Current: 0.0003 Amp

Low maximum standby current reduces overall power consumption, enhancing energy efficiency.

Maximum Access Time: 120 ns

Fast access time of 120 ns supports high-speed data processing and retrieval in time-sensitive applications.

Technical Specifications

EPROM 5962-8606306XA attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

120 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

Length:

37.1475 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

5.588 mm

Maximum Standby Current:

.0003 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

65 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-8606306XA Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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