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5962-87515023B

STMicroelectronics

5962-87515023B by STMicroelectronics

5962-87515023B by STMicroelectronics is a military-grade EPROM with a ceramic, metal-sealed package. It operates asynchronously at 5V, features an 8Kx8 organization, and withstands temperatures from -55 °C to 125°C. Ideal for reliable data storage in harsh environments.

Median Price

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Lifecycle Status

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3

In-Stock Inventory

1k+

5962-87515023B by STMicroelectronics
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Digiode

USA . 4,805 parts In-Stock

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4,805

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Anansix

USA . 2,499 parts In-Stock

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2,499

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Vyrian

USA . 156 parts In-Stock

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156

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IDEA Electronic Components Group

UK . 662 parts In-Stock

1+ parts

$5.263

100+ parts

-

1k+ parts

$4.737

10k+ parts

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662

$5.263

-

$4.737

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MKK Technologies

India . 1,868 parts In-Stock

1+ parts

$9.897

100+ parts

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1,868

$9.897

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DigiPath Technology Company

USA . 1,868 parts In-Stock

1+ parts

$9.897

100+ parts

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1,868

$9.897

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Native Components

USA . 221 parts In-Stock

1+ parts

$92.100

100+ parts

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$88.416

221

$92.100

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$88.416

Northwest PG Solutions

USA . 318 parts In-Stock

1+ parts

$101.310

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318

$101.310

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Corphita

USA . 3,836 parts In-Stock

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3,836

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Parana Technologies

USA . 1,069 parts In-Stock

1+ parts

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$6.293

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1,069

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$6.293

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Overview

Unlock unparalleled performance and reliability with the 5962-87515023B EPROM from STMicroelectronics. Crafted under stringent military standards, this advanced memory solution excels in harsh environments, ensuring your applications remain robust and efficient. With its ceramic, metal-sealed design, it guarantees durability while delivering fast access times. Ideal for aerospace, defense, and industrial automation, this device empowers customers to innovate confidently!

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic, metal-sealed co-fired package enhances durability and reliability, making it suitable for military and harsh environments.

Surface Mount: YES

Being surface mount compatible allows for easier integration into modern PCB designs, saving space and improving performance.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on circuit boards, allowing for efficient use of layout area.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables quicker data access, beneficial for applications requiring fast data retrieval.

Nominal Supply Voltage / Vsup: 5V

A standard voltage level ensures compatibility with a wide range of electronic systems.

No. of Terminals: 28

With 28 terminals, there are sufficient connections for versatile applications, ensuring flexibility in design.

Package Style (Meter): CHIP CARRIER

The chip carrier style supports efficient thermal management and improved electrical performance.

Maximum Operating Temperature: 125 °C

High temperature tolerance makes this EPROM suitable for applications in extreme conditions.

Organization: 8KX8

This organization allows for efficient storage and retrieval of data in a structured manner.

Minimum Operating Temperature: -55 °C

The low-temperature operation range ensures the product functions reliably in cold environments.

Terminal Finish: TIN LEAD

Tin-lead finish provides excellent solderability and good corrosion resistance, enhancing product longevity.

Terminal Position: QUAD

Quad terminal positioning allows for versatile mounting options, making it easier to fit in various designs.

Minimum Supply Voltage (Vsup): 4.5V

The minimum supply voltage ensures flexibility in power supply design options.

Temperature Grade: MILITARY

MILITARY grade components guarantee robust performance in critical applications, ensuring high reliability.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making it a reliable choice.

Parallel or Serial: PARALLEL

Parallel access allows for faster data processing and transfer rates, which is ideal for many applications.

Terminal Form: NO LEAD

No lead design minimizes size while complying with RoHS regulations, making it environmentally friendly.

No. of Words: 8192 words

Ample storage capacity of 8192 words supports a variety of applications, ensuring adequate memory for data.

Memory Width: 8

An 8-bit memory width ensures compatibility with standardized data formats used in many systems.

No. of Words Code: 8K

The 8K word code provides sufficient memory resources for a range of applications, balancing performance and cost.

Maximum Supply Voltage (Vsup): 5.5V

Supports a maximum supply voltage that allows for stability and protection against voltage fluctuations.

Memory Density: 65536 bit

High memory density allows storage of significant amounts of data in a compact form.

Memory IC Type: UVPROM

UVPROM technology allows for reprogramming, providing flexibility for product updates and modifications.

Maximum Access Time: 55 ns

Fast access time of 55 ns ensures efficient operation, suitable for high-speed applications.

Technical Specifications

EPROM 5962-87515023B attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

55 ns

JESD-30 Code:

R-CQCC-N28

JESD-609 Code:

e0

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Shape:

Package Style (Meter):

CHIP CARRIER

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Position:

QUAD

Trade Compliance

5962-87515023B Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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