Active filters amplify desired signals while rejecting unwanted frequencies, and can be tailored to meet application-specific requirements in electronics.
Amplifiers boost signal strength, match impedance levels, and are essential in many circuit systems, including audio, broadcasting, and telecommunications.
Batteries store and provide electrical energy, come in various types and sizes for multiple uses, rechargeable or single-use.
Capacitors store electrical charge with metallic plates and a dielectric; types vary and can be combined for specific circuit characteristics.
Chip carriers and sockets provide an interface between components and PCBs, enabling easy replacement or upgrading without soldering.
Circuit protection devices prevent damage from overcurrent flow, including fuses, breakers, surge protectors, and voltage regulators.
Connector accessories and support devices aid connector function and longevity, including backshells, grips, clamps, and ties; must be compatible with connector type.
Connectors join electronic circuits to transfer signals and power, come in various sizes and shapes, and include support accessories.
Converters transform DC input to another voltage level, essential in electronic systems, renewable energy, and automotive electronics.
Crystals and resonators generate and stabilize frequency signals via piezoelectricity. They are used in timing, frequency control, and filters. Crystals are quartz and resonators are ceramic with a built-in capacitor.
Semiconductor diodes control current flow in one direction (uni-directionality) via low resistance. Useful for rectification, voltage regulation, detection, and digital logic.
Discover essential electronic components for your devices, including CPU accelerators, system cache controllers, computer processors, motherboards, and graphics computing systems. Enhance device performance and connectivity with reliable components engineered for seamless integration and optimal functionality.
Fiber optics use light pulses to transmit data over long distances. They have superior bandwidth capacity, low signal attenuation, and secure physical properties. They are essential in telecommunications networks today.
Filters enhance signal processing by selectively passing desired frequencies while suppressing unwanted ones. Filters can be passive (using capacitors, resistors, and inductors) or active (using transistors or amplifiers).
Flash devices are non-volatile storage solutions that offer fast read and write speeds, making them ideal for applications requiring high-speed data transfer. These devices utilize flash memory technology, providing reliable storage for data-intensive tasks such as gaming, multimedia, and enterprise-level applications.
General purpose ICs consist of multiple individual circuits or components (e.g., logic gates, amplifiers, oscillators, etc.) that are combined onto a single integrated circuit chip for a smaller physical footprint.
I/O and storage controllers are crucial components in computer systems, managing input/output operations and storage devices. These controllers facilitate efficient data transfer between peripherals, storage drives, and the central processing unit (CPU), enhancing system performance and enabling seamless connectivity.
Inductors store energy in magnetic fields, oppose sudden changes in current flow and prevent electrical surges. Common inductor applications include power supplies, signal filters, and oscillators.
Interface ICs allow efficient device connectivity with high-speed data transfer and low power consumption.They can be ASIC or FPGA types, and may perform additional functions such as sensing, storage, and conversion.
Logic ICs can be used for storage, memory, amplification, and multiplexing. They perform fundamental logical operations on digital input signals (1, 0, H, L) to generate a corresponding digital output signal.
Memory modules are essential components in electronic devices, storing data temporarily or permanently for processing and retrieval. From volatile RAM (Random Access Memory) to non-volatile ROM (Read-Only Memory), memory technologies vary in speed, capacity, and functionality, catering to diverse application requirements.
Memory ICs store digital data and retain the information even when the power is turned off. They come in various types, like RAM (Random Access Memory) for fast data access, and ROM (Read-Only Memory) for permanent data storage.
Miscellaneous semiconductor components are a diverse category of electronic components that combines elements from a mix of component devices.
Optoelectronic devices interact with light. This family of devices can emit light, detect light, generate current, and transmit light signals for long-distance communication.
Oscillators generate repetitive waveforms, such as sine, square, or triangle waves. They are commonly used to produce stable and precise frequencies for applications like clocks, signal generation, and communication systems.
Other Function Semiconductor components are a diverse category of semiconductor components that perform a range of specialized functions.
Passive component networks operate without a power source and support data transmission within system by performing filtering, energy storage, and/or signal coupling functions.
Peripheral ICs (Integrated Circuits) are designed to control and manage the peripheral devices connected to a computer or other electronic device.
Programmable Logic ICs are user-programmable devices that allow designers to create custom logic circuits. These cost saving ICs offer real-time data processing and maximum design flexibilty.
RF (Radio Frequency) and microwave devices are used in telecommunications, wireless communications, and electronic systems. These devices include amplifiers, attenuators, filters, mixers, oscillators, and antennas, and a host of other components.
Voltage regulators are used to ensure a constant output voltage despite power fluctuations and load changes. Linear and switching regulators are common types used to maintain voltage stability.
Relays are electromagnetic switches that are used to control the flow of electrical current in an electrical circuit. Relays are a safe means of providing isolation between a controlling circuit and a controlled circuit.
Resistors control the flow of electrical current in a circuit by introducing a set resistance. These passive components reduce current flow, adjust signal levels, and bias active elements in circuits.
Transducers convert energy from one form to another and are crucial in sensing, audio and control systems. They transform physical measures like temperature, pressure, or sound into electrical signals for circuits.
Storage drives are hardware devices used to store and retrieve digital data in computers and electronic devices. These drives come in various forms, including hard disk drives (HDDs), solid-state drives (SSDs), and hybrid drives, offering different levels of capacity, speed, and durability to suit specific storage needs.
Storage media encompass physical or digital mediums used for storing and preserving digital data. From optical discs and magnetic tapes to USB flash drives and memory cards, storage media come in diverse formats and capacities, offering flexibility and reliability for data storage and archival purposes.
Storage systems comprise hardware and software components designed to manage and store digital data efficiently. These systems range from simple standalone devices to complex network-attached storage (NAS) and storage area network (SAN) solutions, providing scalable storage capacity and data protection features for businesses and enterprises.
Switches control electrical current flow by making or breaking connections. These devices vary in design and application, from basic on/off switches to complex industrial automation systems.
Telecom integrated circuits (ICs) are specialized electronics for telecommunications, tailored to high data rates, low power use, and reliable long-distance transmission. These devices include amplifiers, filters, ADCs, DACs, and more-- and they are often integrated on one chip for specific telecom tasks.
Terminal blocks, or connection terminals, are modular blocks that bring together multiple electrical wires at one connection point. They offer a reliable, organized way to terminate cables.
Thermal management devices control heat in electronic systems, preventing overheating and ensuring optimal performance and reliability. Examples include heat sinks, fans, and thermal interface materials that dissipate or transfer heat away from components.
Transformers are devices that alter electrical voltage levels between circuits through electromagnetic induction. They are vital in power distribution, converting high-voltage electricity for transmission and lower voltage for safe usage.
Transistors are 3-layer semiconductor devices that regulate the flow of electrical current. They function as amplifiers, boosting weak signals, and as switches, controlling the flow of current between terminals.
Triggering devices initiate electronic processes or events in response to specific conditions. These devices support many automated tasks such as activating switches and signals, or turning on lights when motion is detected.
Video cards, also known as graphics cards or GPU (Graphics Processing Unit), are essential components in computers, responsible for rendering graphics and images on display devices. These cards feature dedicated processors and memory, delivering smooth and immersive visual experiences for gaming, multimedia, and professional applications.
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EPC2LI20N by Intel is a 20-terminal EPROM chip with synchronous operation and 3-STATE output. It operates at a voltage of 3.3V, suitable for industrial applications with a temperature range of -40 to 85°C. With a memory density of 1695680 bits, it is ideal for configuration memory in electronic devices.
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Assy Fe
PLASTIC/EPOXY - This material provides durability and protection for the EPROM.
YES - Allows for easy and convenient installation on circuit boards.
SQUARE - Helps in optimizing space utilization in electronic designs.
SYNCHRONOUS - Ensures efficient and synchronized operation of the EPROM.
3.3 - Suitable for a wide range of applications requiring this voltage.
3.3/5 - Flexibility in power options for different circuit requirements.
20 - Provides ample connectivity options for system integration.
CHIP CARRIER - Enhances thermal performance and mechanical stability.
85 °C - Allows for reliable operation in various environmental conditions.
1695680X1 - High capacity for storing and retrieving data efficiently.
3-STATE - Offers versatility in controlling the output signals.
40 °C - Suitable for operation in extreme cold conditions.
MATTE TIN - Ensures good electrical conductivity and corrosion resistance.
QUAD - Facilitates easy connections to other components on the circuit board.
4.572 mm - Helps in designing compact and slim electronic devices.
8.9662 mm - Enables integration in space-constrained layouts.
3 V - Ensures compatibility with low voltage power sources.
8.9662 mm - Compact size for easy fitting into electronic assemblies.
3.3 - Required voltage for programming the EPROM effectively.
INDUSTRIAL - Suitable for industrial applications with harsh operating conditions.
CMOS - Offers low power consumption and high speed performance.
SERIAL - Enables efficient data transfer for programming and reading data.
J BEND - Facilitates easy soldering and robust mechanical connections.
50 mA - Adequate current for reliable operation of the EPROM.
1695680 words - High memory capacity for storing data.
1.27 mm - Allows for precise and secure connections on the circuit board.
1695680 - Easy identification of memory capacity for programming purposes.
3 - Suitable for handling and storage in typical manufacturing environments.
3.6 V - Allows for safe operation within specified voltage limits.
1695680 bit - High memory density for storing large amounts of data.
CONFIGURATION MEMORY - Ideal for storing configuration data for electronic systems.
0.0001 Amp - Low standby current consumption for energy efficiency.
EPROM EPC2LI20N attributes and parameters. Explore more EPROM devices from Intel
Additional Features:
JESD-30 Code:
JESD-609 Code:
Length:
Memory Density:
Memory IC Type:
Memory Width:
Moisture Sensitivity Level (MSL):
No. of Functions:
No. of Terminals:
No. of Words:
No. of Words Code:
Operating Mode:
Maximum Operating Temperature:
Minimum Operating Temperature:
Organization:
Output Characteristics:
Package Body Material:
Package Code:
Package Equivalence Code:
Package Shape:
Package Style (Meter):
Parallel or Serial:
Power Supplies (V):
Programming Voltage (V):
Qualification:
Maximum Seated Height:
Maximum Standby Current:
Sub-Category:
Maximum Supply Current:
Maximum Supply Voltage (Vsup):
Minimum Supply Voltage (Vsup):
Nominal Supply Voltage / Vsup (V):
Surface Mount:
Technology:
Temperature Grade:
Terminal Finish:
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Terminal Pitch:
Terminal Position:
Width:
EPC2LI20N Memory ICs trade compliance attributes, and parameters.
ECCN
EAR99
ECCN Governance
EAR
HTS
8542.32.00.61
SB
8542.32.00.60
NSN
5962-01-580-4544, 5962015804544
NIIN
015804544
Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.
LM358N
Motorola
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: THROUGH-HOLE; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR;
2N2222A
NXP Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Collector Current (IC): .8 A; Maximum Operating Temperature: 150 Cel;
FSMLF327
Fox Electronics
FSMLF327 by Fox Electronics is a crystal oscillator with 20 ppm frequency tolerance, 144% stability, and 50000 ohm series resistance. Ideal for applications requiring precise timing such as communication systems, industrial automation, and consumer electronics. Operating temperature range from -40 to 85 °C.
CRG0805F10R
Tyco Electronics Components
FIXED RESISTOR; Mounting Type: SURFACE MOUNT; Resistance: 10 ohm; Rated Power Dissipation (P): .125 W; Maximum Operating Temperature: 125 Cel; Tolerance: 1 %;
M85049/85-08W02
Amphenol
CIRCULAR CONN ACCESSORY; Shell Sizes: 8; 9; IEC Conformity: NO; MIL-Connector Accessory Name: BAND LOCK ADAPTER; MIL Conformity: YES; DIN Conformity: NO;
FDN306P
Onsemi
FDN306P by Onsemi is a P-CHANNEL FET with 12V DS Breakdown Voltage, ideal for SWITCHING applications. It features SINGLE configuration with BUILT-IN DIODE and GULL WING terminals. Operating in ENHANCEMENT MODE, it has a max ID of 2.6A and 0.04 ohm RDS(on), suitable for small outline packages at temperatures ranging from -55 to 150°C.
SS14
SPC TECHNOLOGY/ MULTICOMP
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: C BEND; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
BAV99
Eic Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: GULL WING; No. of Terminals: 3; Surface Mount: YES; Package Shape: RECTANGULAR;
Bytesonic Electronics
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Maximum Collector Current (IC): .6 A; No. of Elements: 1;
1N4148WS
Taiwan Semiconductor
RECTIFIER DIODE; Terminal Position: DUAL; Terminal Form: FLAT; No. of Terminals: 2; Surface Mount: YES; Package Shape: RECTANGULAR;
LL4148
Micronas Semiconductor Holding Ag
RECTIFIER DIODE; Surface Mount: YES; No. of Phases: 1; Maximum Repetitive Peak Reverse Voltage: 100 V; Maximum Output Current: .2 A; Maximum Forward Voltage (VF): 1.2 V;
ROHM
M39029/58-360
Carlisle Interconnect Technologies
GENERAL CONN ACCESSORY; Associated Military - Specifications: MIL-C-55302/69, MIL-C-38999; Maximum Operating Temperature: 200 Cel; MIL-Connector Accessory: CONTACT; Terminal Type: CRIMP; MIL Conformity: YES;
1N4148
Jgd Semiconductors
RECTIFIER DIODE; Surface Mount: NO; Maximum Operating Temperature: 175 Cel; Maximum Reverse Recovery Time: .004 us; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V;
BSS138
Zetex Plc
N-CHANNEL; Configuration: SINGLE; Surface Mount: YES; Maximum Power Dissipation (Abs): .36 W; Package Style (Meter): SMALL OUTLINE; Maximum Operating Temperature: 150 Cel;
Good-ark Electronics
RECTIFIER DIODE; Surface Mount: NO; No. of Elements: 1; Maximum Non Repetitive Peak Forward Current: .5 A; Maximum Forward Voltage (VF): 1 V; No. of Phases: 1;
Raytheon Semiconductor
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 250 MHz; Minimum DC Current Gain (hFE): 100; Maximum Turn On Time (ton): 35 ns;
Semiconductors
NPN; Configuration: SINGLE; Surface Mount: NO; Nominal Transition Frequency (fT): 300 MHz; Maximum Power Dissipation (Abs): .5 W; Maximum Collector Current (IC): .8 A;
LM358MX
OPERATIONAL AMPLIFIER; Temperature Grade: COMMERCIAL; Terminal Form: GULL WING; No. of Terminals: 8; Package Code: SOP; Package Shape: RECTANGULAR;
TMS27C010A-20JL
Texas Instruments
TMS27C010A-20JL by Texas Instruments is a 128KX8 EPROM with 200ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and through-hole terminal form. Commonly used in commercial applications for storing data securely due to its high memory density of 1048576 bit.
TMS27C240-12JE4
TMS27C240-12JE4 by Texas Instruments is a 256KX16 EPROM with 120ns access time, 3-state output, and operates at -40 to 85 °C. It is used in industrial applications for storing data parallelly with a memory density of 4194304 bit.
M27C1001-45XF1
STMicroelectronics
M27C1001-45XF1 by STMicroelectronics is a 128KX8 EPROM with 45 ns access time, operating at 5V. It features a CMOS technology, through-hole terminal form, and 3-STATE output characteristics. Ideal for applications requiring fast memory access in commercial temperature environments.
TMS27C240-8JE
TMS27C240-8JE by Texas Instruments is a 256KX16 EPROM with 80ns access time, operating at 5V. It features a 3-STATE output and supports parallel operation. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
SMJ27C256-25J
SMJ27C256-25J by Texas Instruments is a 32KX8 EPROM with 3-STATE output, operating at -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and offers a memory density of 262144 bit. Ideal for military-grade applications requiring fast access times within the CMOS technology framework.
EPC2TC32
Altera
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Parallel or Serial: SERIAL;
TMS27C512-30JL4
TMS27C512-30JL4 by Texas Instruments is a 64KX8 EPROM with 300 ns access time, operating at 5V. It features a CMOS technology, 3-STATE output characteristics, and through-hole terminal form. Ideal for applications requiring fast memory access in commercial temperature environments.
TMS27C128JL
TMS27C128JL by Texas Instruments is a 16KX8 EPROM with 250ns access time, 3-STATE output, and 5V nominal voltage. It is used in commercial applications requiring reliable non-volatile memory storage with a memory density of 131072 bits.
TMS27C128-2JE4
TMS27C128-2JE4 by Texas Instruments is a 16KX8 EPROM with 3-STATE output, operating at 5V. It has an access time of 200ns and memory density of 131072 bits. Commonly used in industrial applications for parallel programming due to its CMOS technology and through-hole terminal form.
EPC1PI8
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 8; Package Code: DIP; Package Shape: RECTANGULAR; Package Body Material: PLASTIC/EPOXY;
TMS27C256-15JE4
TMS27C256-15JE4 by Texas Instruments is a 32KX8 EPROM with 150 ns access time, 3-STATE output, and operates at -40 to 85 °C. It is used in industrial applications for storing data securely due to its UVPROM memory technology and common I/O type.
AM27C512-255DC
Rochester Electronics
AM27C512-255DC by Rochester Electronics is a 64KX8 EPROM with 250ns access time, operating at 5V. It has a memory density of 524288 bits and uses CMOS technology. Ideal for commercial applications requiring reliable non-volatile memory storage in a ceramic, metal-sealed co-fired package.
SMJ27C010A-20J
SMJ27C010A-20J by Texas Instruments is a 128KX8 EPROM with 3-STATE output, operating at -55 to 125 °C. It has a supply voltage range of 4.5V to 5.5V and offers fast access time of 200 ns. Ideal for military-grade applications requiring reliable non-volatile memory storage in a compact IN-LINE package.
SMJ27C210-15JM
SMJ27C210-15JM by Texas Instruments is a 64KX16 EPROM with 150ns access time, operating at -55 to 125 °C. It has a supply voltage of 4.5-5.5V and features CMOS technology for military-grade applications requiring high memory density and parallel operation.
TMS27C128-120JL
UVPROM; Temperature Grade: COMMERCIAL; No. of Terminals: 28; Package Code: DIP; Package Shape: RECTANGULAR; Maximum Seated Height: 4.907 mm;
TMS27C040-100JE4
TMS27C040-100JE4 by Texas Instruments is a 512KX8 EPROM with 100 ns access time, operating at 5V. It features 3-STATE output and INDUSTRIAL temperature grade. Ideal for applications requiring fast parallel memory access in industrial environments.
TMS27C512-15JE4
TMS27C512-15JE4 by Texas Instruments is a 64KX8 EPROM with 150ns access time, operating at 5V. It features a CMOS technology, 3-STATE output, and INDUSTRIAL temperature grade. Ideal for applications requiring reliable non-volatile memory storage in industrial environments.
M27C1001-15XF6X
M27C1001-15XF6X EPROM by STMicroelectronics features 128KX8 organization, 120 ns access time, and 1048576 bit memory density. It is commonly used in industrial applications requiring reliable non-volatile memory storage with a parallel interface.
TMS27C210A-250JE4
TMS27C210A-250JE4 by Texas Instruments is a 64KX16 EPROM with 250 ns access time, 5V supply voltage, and 3-STATE output. It is used in industrial applications for storing data in parallel format with a memory density of 1048576 bit.
TMS2732A-30JL
TMS2732A-30JL by Texas Instruments is a 4KX8 EPROM with 32768 bit memory density. It operates at 5V, has a programming voltage of 21V, and features a max access time of 300ns. Commonly used in commercial applications requiring fast memory access and reliable data storage.
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EPC2TI32N
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Power Supplies (V): 3.3/5;
Intel
EPC2TI32N by Intel is a 32-terminal EPROM with synchronous operation and 3-STATE output. It features a supply voltage of 3.3V, industrial temperature grade, and serial technology. Ideal for configuration memory applications due to its high memory density of 1695680 bits and compact flatpack design.
EPC2LC20N
EPC2LC20N by Altera is a synchronous EPROM with a 3.3V nominal supply voltage and 1695680-bit memory density. It operates in commercial temperature grade and has a quad terminal position. Its top application is configuration memory.
EPC2LC20N by Intel is a 20-terminal EPROM chip with synchronous operation, 3-STATE output, and 1695680-bit memory density. It is used for configuration memory applications in commercial-grade devices, featuring a max supply voltage of 3.6V and operating temperature range of 0-70°C.
EPC2LI20N
The EPC2LI20N by Altera is a synchronous EPROM with 20 terminals and a package shape of a square. It operates at a nominal supply voltage of 3.3V and has a maximum operating temperature of 85°C. Its memory density is 1695680 bits, and it is suitable for industrial applications.
EPC2LI20
The EPC2LI20 by Altera is a SYNCHRONOUS EPROM with a memory density of 1695680 bit. It operates at a nominal supply voltage of 3.3V and has a maximum standby current of 0.0001 Amp. This chip is commonly used for configuration memory in industrial applications.
EPC2LI20 by Intel is a 20-terminal EPROM chip carrier with synchronous operation at 3.3V, featuring 1695680-bit memory density for configuration memory applications. It has a max operating temperature of 85°C and supports both serial and parallel programming modes, making it suitable for various electronic devices requiring non-volatile memory storage.
EPC2TC32N
Intel's EPC2TC32N EPROM operates in synchronous mode at 3.3V, with 32 terminals and a flatpack, thin profile package style. It features a memory density of 1695680 bits and is ideal for configuration memory applications due to its serial technology and 3-state output characteristics.
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Programming Voltage (V): 3.3;
EPC2TI32
The EPC2TI32 by Altera is a synchronous EPROM with a package shape of a square. It operates at a nominal supply voltage of 3.3V and has 32 terminals. This memory IC type has a memory density of 1695680 bits and is suitable for industrial temperature grades. The EPC2TI32 is commonly used in configuration memory applications.
CONFIGURATION MEMORY; Temperature Grade: INDUSTRIAL; No. of Terminals: 32; Package Code: TQFP; Package Shape: SQUARE; Organization: 1695680X1;
EPC2LC20
CONFIGURATION MEMORY; Temperature Grade: COMMERCIAL; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Seated Height: 4.572 mm;
CONFIGURATION MEMORY; No. of Terminals: 20; Package Code: QCCJ; Package Shape: SQUARE; Maximum Operating Temperature: 70 Cel; Package Body Material: PLASTIC/EPOXY;
EPC2TC32 by Intel is a 32-terminal EPROM with 3.3V nominal voltage, operating in synchronous mode. It features a flatpack, thin profile package style and GULL WING terminal form. Ideal for configuration memory applications due to its 1695680 bit memory density and serial operation at a max temperature of 70°C.
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