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EPC2TC32N

Intel

EPC2TC32N by Intel

Intel's EPC2TC32N EPROM operates in synchronous mode at 3.3V, with 32 terminals and a flatpack, thin profile package style. It features a memory density of 1695680 bits and is ideal for configuration memory applications due to its serial technology and 3-state output characteristics.

Median Price

$39.530

Lifecycle Status

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21

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1k+

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Arrow

USA . 19,027 parts In-Stock

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$54.520

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$24.540

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$17.850

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$16.360

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$16.360

Verical

USA . 19,027 parts In-Stock

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$24.540

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$17.850

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Nova Conductors

Japan . 50 parts In-Stock

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TME

Poland . 4 parts In-Stock

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Digiode

USA . 1,087 parts In-Stock

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Vyrian

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J2 Sourcing AB

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Chip Stock

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Component Sense

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Touchstone Systems

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Euro-Tech

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Bristol Electronics

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Atlantic Semiconductor

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Velocity Electronics

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Inventory MP

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Rebound Electronics

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Semtec, LLC

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ACDS - Activité Composants Distribution Service

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ComSIT Distribution GmbH

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Prism Electronics

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Legend Electronics Inc.

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MARBEL Systems

Belgium . 4,103 parts In-Stock

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$3.821

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Kenton Components

USA . 639 parts In-Stock

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$5.270

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$4.638

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Texas Native Microelectronics

USA . 5,234 parts In-Stock

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$5.417

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$5.200

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$5.038

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$4.767

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$4.767

Modulus Dynamics

Lithuania . 6,166 parts In-Stock

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$5.708

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$5.708

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Qasali Group International

UK . 3,125 parts In-Stock

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$14.626

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$13.602

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$12.871

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Ampacity Inc.

Singapore . 18,959 parts In-Stock

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$20.860

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Semicontronic

India . 18,917 parts In-Stock

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$20.338

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One Stop Electronics

USA . 18,894 parts In-Stock

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Advanced Electronics

New Zealand . 750 parts In-Stock

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Corohmni

South Africa . 125 parts In-Stock

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$21.738

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Continental Prestige Electronics

USA . 6,306 parts In-Stock

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$25.944

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Netroflash

USA . 500 parts In-Stock

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$25.944

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$24.646

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Corphita

USA . 1,071 parts In-Stock

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$49.068

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Microchip USA

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Perfect Parts

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Lixinc

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S.R.D Solutions

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A-Z Elektronik GmbH

Germany . 6,197 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,131 parts In-Stock

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Supply Digital

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Argo Parts USA

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GreenTree Electronics

Israel . 1,000 parts In-Stock

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Vigor

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Kepictronics

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Futuretech Components

Singapore . 253 parts In-Stock

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Lucentia Tech

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Speed Components Ltd (Excess)

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Cyclops Electronics Ltd (Excess)

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Overview

Experience the reliability and innovation of Intel with the EPC2TC32N EPROM. As a leading manufacturer in the industry, Intel delivers top-quality products that meet the highest standards. The EPC2TC32N is ideal for a wide range of applications, offering customers exceptional value and performance. Discover the benefits of this product and elevate your projects to new heights with Intel's cutting-edge technology.

Feature Benefit Bullets

Package Body Material: PLASTIC/EPOXY

The plastic/epoxy material used for the package body ensures durability and protection for the internal components of the EPROM.

Surface Mount: YES

The surface mount feature allows for easy installation and space-saving on PCBs, making it convenient for assembly.

Nominal Supply Voltage / Vsup (V): 3.3

The 3.3V nominal supply voltage ensures compatibility with various systems and power sources, providing reliable operation.

Memory Density: 1695680 bit

With a high memory density of 1695680 bits, this EPROM offers ample storage capacity for storing configuration data or other critical information.

Technology: CMOS

Using CMOS technology ensures low power consumption and high noise immunity, making the EPROM energy-efficient and reliable in different operating conditions.

Parallel or Serial: SERIAL

The serial interface offers efficient data transfer and programming, simplifying the communication process between the EPROM and the host system.

Technical Specifications

EPROM EPC2TC32N attributes and parameters. Explore more EPROM devices from Intel

Specs

Additional Features:

IT ALSO REQUIRES 5V NOMINAL SUPPLY

JESD-30 Code:

S-PQFP-G32

JESD-609 Code:

e3

Length:

7 mm

Memory Density:

1695680 bit

Memory IC Type:

Memory Width:

1

Moisture Sensitivity Level (MSL):

3

No. of Functions:

1

No. of Terminals:

32

No. of Words:

1695680 words

No. of Words Code:

1695680

Operating Mode:

SYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

1695680X1

Output Characteristics:

3-STATE

Package Body Material:

PLASTIC/EPOXY

Package Code:

Package Equivalence Code:

TQFP32,.35SQ,32

Package Shape:

Package Style (Meter):

FLATPACK, THIN PROFILE

Parallel or Serial:

SERIAL

Peak Reflow Temperature (C):

260

Power Supplies (V):

3.3/5

Programming Voltage (V):

3.3

Qualification:

Not Qualified

Maximum Seated Height:

1.2 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

Flash Memories

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

3.6 V

Minimum Supply Voltage (Vsup):

3 V

Nominal Supply Voltage / Vsup (V):

3.3

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

GULL WING

Terminal Pitch:

.8 mm

Terminal Position:

QUAD

Maximum Time At Peak Reflow Temperature (s):

30

Width:

7 mm

Trade Compliance

EPC2TC32N Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

NSN

5962-01-626-2507, 5962016262507

NIIN

016262507

Manufacturer Highlights

Intel

Intel Corporation (commonly known as Intel) is an American multinational corporation and technology company headquartered in Santa Clara, California. It is one of the world's largest semiconductor chip manufacturer by revenue, and is one of the developers of the x86 series of instruction sets found in most personal computers (PCs). Incorporated in Delaware, Intel ranked No. 45 in the 2020 Fortune 500 list of the largest United States corporations by total revenue for nearly a decade, from 2007 to 2016 fiscal years. Intel supplies microprocessors for computer system manufacturers such as Acer, Lenovo, HP, and Dell. Intel also manufactures motherboard chipsets, network interface controllers and integrated circuits, flash memory, graphics chips, embedded processors and other devices related to communications and computing. Intel (integrated and electronics) was founded on July 18, 1968, by semiconductor pioneers Gordon Moore (of Moore's law) and Robert Noyce (1927–1990), and is associated with the executive leadership and vision of Andrew Grove. Intel was a key component of the rise of Silicon Valley as a high-tech center. Noyce was a key inventor of the integrated circuit (microchip). Intel was an early developer of SRAM and DRAM memory chips, which represented the majority of its business until 1981. Although Intel created the world's first commercial microprocessor chip in 1971, it was not until the success of the personal computer (PC) that this became its primary business.

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