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5962-8751501LX

STMicroelectronics

5962-8751501LX by STMicroelectronics

5962-8751501LX by STMicroelectronics is a military-grade EPROM with a 5V supply, featuring an asynchronous operation mode and a max access time of 45 ns. It offers an organization of 8Kx8 and operates in extreme temperatures from -55 °C to 125 °C. Ideal for reliable data storage in harsh environments, this UVPROM ensures durability and performance.

Median Price

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1k+

5962-8751501LX by STMicroelectronics
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Digiode

USA . 5,225 parts In-Stock

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Anansix

USA . 2,264 parts In-Stock

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Vyrian

USA . 1,150 parts In-Stock

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Native Components

USA . 10 parts In-Stock

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$1.667

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10

$1.667

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Northwest PG Solutions

USA . 187 parts In-Stock

1+ parts

$1.834

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187

$1.834

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IDEA Electronic Components Group

UK . 1,071 parts In-Stock

1+ parts

$4.381

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$3.943

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1,071

$4.381

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$3.943

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MKK Technologies

India . 1,814 parts In-Stock

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$8.238

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DigiPath Technology Company

USA . 1,814 parts In-Stock

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$8.238

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$8.238

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Corphita

USA . 3,734 parts In-Stock

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Parana Technologies

USA . 2,216 parts In-Stock

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$5.238

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Supply Digital

USA . 1,932 parts In-Stock

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Overview

Unlock unparalleled reliability with the 5962-8751501LX EPROM from STMicroelectronics, a trusted leader in cutting-edge technology. Crafted with precision in durable ceramic and glass-sealed packaging, this asynchronous memory solution thrives in extreme temperatures, ensuring optimal performance in military and aerospace applications. Experience exceptional value and peace of mind as you leverage superior quality for mission-critical systems. Elevate your projects today!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed body ensures durability and protection against environmental factors, making this EPROM suitable for harsh conditions.

Package Shape: RECTANGULAR

The rectangular shape is ideal for efficient spacing on printed circuit boards, allowing for optimized design and placement.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster access and flexibility in system design, making it easier to integrate into various applications.

Nominal Supply Voltage / Vsup: 5 V

The 5V nominal supply voltage is standard for most digital circuits, ensuring compatibility and ease of use.

No. of Terminals: 24

With 24 terminals, this EPROM provides ample connections for interfacing with multiple devices, enhancing its versatility.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window package style allows for UV exposure for programming, facilitating easy data updates and field reprogramming.

Maximum Operating Temperature: 125 °C

Designed to operate at high temperatures, this EPROM is well-suited for applications in extreme environments without performance degradation.

Organization: 8KX8

The 8Kx8 organization provides a balanced configuration of memory for both code and data, making it ideal for embedded applications.

Minimum Operating Temperature: -55 °C

Capable of functioning at low temperatures, this EPROM is a reliable choice for aerospace and military applications.

Terminal Position: DUAL

Dual terminal position enhances its mounting flexibility, allowing for efficient space utilization on circuit boards.

Maximum Seated Height: 5.08 mm

A compact seated height ensures compatibility with low-profile applications while maximizing space efficiency.

Width: 7.62 mm

The width is optimized for standard in-line packaging, facilitating easy handling and placement in electronic assemblies.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum supply voltage of 4.5V ensures stable operation in a variety of power supply situations, providing flexibility in design.

Length: 32.005 mm

The specific length aids in maintaining standard dimensions for compatibility with various sockets and circuit designs.

Temperature Grade: MILITARY

MILITARY-grade specifications guarantee reliability and performance in critical applications, making this EPROM suitable for defense use.

Technology: CMOS

With CMOS technology, this EPROM delivers low power consumption while ensuring high speed and reliability.

Parallel or Serial: PARALLEL

Parallel access allows for faster data retrieval, making this device suitable for high-performance systems.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide superior mechanical stability and are preferred for high-reliability applications.

No. of Words: 8192 words

A capacity of 8192 words supports various applications, enabling storage of more complex data and code.

Memory Width: 8

The 8-bit memory width allows for efficient data handling and processing, catering to standard microcontroller architectures.

Terminal Pitch: 2.54 mm

A 2.54 mm terminal pitch is standard, ensuring compatibility with most electronic components and circuit boards.

No. of Words Code: 8K

8K words of code storage offers sufficient space for a range of applications, making it versatile for various projects.

Maximum Supply Voltage (Vsup): 5.5 V

The maximum supply voltage ensures that this EPROM can handle slight voltage variances without risking damage.

Memory Density: 65536 bit

With a memory density of 65536 bits, this EPROM provides ample storage for applications requiring significant data handling capabilities.

Memory IC Type: UVPROM

As a UVPROM, this EPROM allows for easy erase-and-rewrite functionality, making it a good option for iterative design processes.

Maximum Access Time: 45 ns

The maximum access time of 45 ns ensures quick data retrieval, improving overall system performance.

Technical Specifications

EPROM 5962-8751501LX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-GDIP-T24

Length:

32.005 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8751501LX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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