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5962-87515033C

STMicroelectronics

5962-87515033C by STMicroelectronics

5962-87515033C by STMicroelectronics is a military-grade EPROM with a max operating temp of 125 °C and asynchronous mode. It features a 5V supply, 8Kx8 organization, and operates in parallel. Ideal for reliable data storage in harsh environments.

Median Price

-

Lifecycle Status

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3

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 1,861 parts In-Stock

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Anansix

USA . 1,077 parts In-Stock

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Vyrian

USA . 213 parts In-Stock

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IDEA Electronic Components Group

UK . 929 parts In-Stock

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$5.352

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$4.816

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929

$5.352

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Native Components

USA . 101 parts In-Stock

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$8.985

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Northwest PG Solutions

USA . 241 parts In-Stock

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$9.883

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$8.895

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241

$9.883

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MKK Technologies

India . 2,288 parts In-Stock

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$10.063

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$10.063

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DigiPath Technology Company

USA . 2,288 parts In-Stock

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$10.063

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Corphita

USA . 4,799 parts In-Stock

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Supply Digital

USA . 1,084 parts In-Stock

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Parana Technologies

USA . 176 parts In-Stock

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$6.399

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Overview

Unlock unparalleled performance and reliability with the 5962-87515033C EPROM from STMicroelectronics. Crafted with precision in a robust ceramic, metal-sealed package, this military-grade memory solution excels in harsh environments, ensuring data integrity where it matters most. With its asynchronous operation and 28 terminals, it’s ideal for a wide array of applications— from aerospace to defense. Trust in STMicroelectronics’ legacy of innovation and quality to empower your next project with cutting-edge technology and dependable results.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed co-fired construction ensures superior reliability and protection against environmental factors.

Surface Mount: YES

Surface mount technology allows for high-density assembly, making this product compatible with modern manufacturing processes.

Screening Level: 38535Q/M;38534H;883B

Compliance with multiple military screening levels guarantees high performance and reliability in demanding applications.

Package Shape: SQUARE

The square package shape facilitates easy integration into various circuit board designs, optimizing space usage.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexible timing requirements, making this EPROM suitable for diverse applications.

Input/Output Type: COMMON

The common I/O type simplifies connectivity, providing ease of use in various circuit designs.

Nominal Supply Voltage / Vsup (V): 5

The standard 5V operation makes this EPROM easily compatible with a wide range of electronic systems.

Power Supplies (V): 5

Single voltage supply simplifies design and reduces the need for additional components in the circuit.

No. of Terminals: 28

A total of 28 terminals provides ample connection points for efficient data handling and control.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier package with a window allows for easy observation and verification, enhancing manufacturability.

Maximum Operating Temperature: 125 °C

High maximum operating temperature makes this EPROM reliable for use in extreme environments.

Organization: 8KX8

This organization signifies efficient memory structure, suitable for high-performance data storage.

Output Characteristics: 3-STATE

3-state outputs enable multiple devices to connect without interference, enhancing circuit flexibility.

Minimum Operating Temperature: -55 °C

A wide temperature range (-55 °C to 125°C) ensures this EPROM operates reliably in harsh conditions.

Terminal Finish: Gold (Au)

Gold terminals provide excellent conductivity and resistance to oxidation, ensuring long-term reliability.

Terminal Position: QUAD

Quad terminal positioning enables compact layouts and reduces PCB space requirements.

Maximum Seated Height: 3.3 mm

Low seated height allows for low-profile designs, making it suitable for compact electronic devices.

Width: 11.455 mm

The compact width contributes to efficient use of board space in various applications.

Minimum Supply Voltage (Vsup): 4.5 V

The minimum voltage requirement of 4.5V allows for flexibility in power supply choices.

Length: 11.455 mm

The matching length with the width creates a square shape, which is optimal for mounting.

Temperature Grade: MILITARY

MIL-STD compliant temperature grade signifies high quality and reliability for military applications.

Technology: CMOS

CMOS technology allows for low power consumption while maintaining high-speed performance.

Parallel or Serial: PARALLEL

Parallel interfacing enables faster data transfer rates, improving overall system performance.

Terminal Form: NO LEAD

No lead design enhances reliability and is environmentally friendly, aligning with modern design standards.

No. of Words: 8192 words

A capacity of 8192 words provides sufficient storage for moderately-sized applications.

Memory Width: 8

Memory width of 8 bits allows for efficient data storage and processing in a variety of applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch allows for easy soldering and maintenance while conserving PCB space.

No. of Words Code: 8K

Code capacity of 8K supports various applications that require reliable non-volatile memory.

Maximum Supply Voltage (Vsup): 5.5 V

Supports a range of supply voltages, allowing for compatibility with various designs and power systems.

Memory Density: 65536 bit

With a density of 65536 bits, this EPROM efficiently stores large amounts of data.

Memory IC Type: UVPROM

As a UVPROM type, it provides easy erasure and reprogramming capabilities, which is ideal for iterative designs.

Maximum Access Time: 70 ns

Quick access time of 70 ns enhances the speed and performance of data retrieval in high-speed applications.

Technical Specifications

EPROM 5962-87515033C attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

S-CQCC-N28

JESD-609 Code:

e4

Length:

11.455 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC28,.45SQ

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

3.3 mm

Sub-Category:

EPROMs

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Gold (Au)

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.455 mm

Trade Compliance

5962-87515033C Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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