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M27C4001-10F1

STMicroelectronics

M27C4001-10F1 by STMicroelectronics

STMicroelectronics' M27C4001-10F1 EPROM features 512KX8 organization, 100 ns access time, and 524288 words. Ideal for commercial applications, it operates at a max temperature of 70°C with a supply voltage of 5V. The memory density is 4194304 bits in a CMOS technology package.

Median Price

$8.510

Lifecycle Status

Suppliers In-Stock

37

In-Stock Inventory

1k+

Distributors (In-Stock)

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Forefront Electronics and Design

USA . 13 parts In-Stock

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$4.900

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Nova Conductors

Japan . 550 parts In-Stock

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$5.481

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$5.481

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Component Electronics Inc.

Canada . 4 parts In-Stock

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$11.540

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$8.650

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$7.500

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4

$11.540

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American Microsemiconductor Inc.

USA . 213 parts In-Stock

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Sternenhof Electronics

Switzerland . 5,000 parts In-Stock

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Vyrian

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Anansix

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Corel Iberica Componentes, S.L.

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MRC Electronics

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LWI Electronics Inc

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Cyclops Electronics Ltd

UK . 763 parts In-Stock

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Digiode

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Component Sense

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ComSIT Distribution GmbH

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Freddi Giovanni

Italy . 216 parts In-Stock

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Q Components

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Prism Electronics

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ECAB

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M&R Communications

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J & M Industries LLC

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Sinequanon

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Atlantic Semiconductor

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Goldney Electronics S.L.

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LIBRA Elektronik GmbH

Germany . 15 parts In-Stock

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Speed Components Ltd

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Digital Electronic Gebert Verwaltungs UG

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Holdelec - ElecDif-Pro

France . 12 parts In-Stock

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Electronics Depot

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ABC Electronics Ltd.

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Mil-Aero Solutions, Inc.

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IDEA Electronic Components Group

UK . 419 parts In-Stock

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$3.124

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$2.812

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Aztec Data Supply Inc.

USA . 1,505 parts In-Stock

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$3.870

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$3.870

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Ampacity Inc.

Singapore . 133 parts In-Stock

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AZTECH Wire

Italy . 781 parts In-Stock

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$5.008

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Corohmni

South Africa . 320 parts In-Stock

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$5.238

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Continental Prestige Electronics

USA . 5,112 parts In-Stock

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$5.481

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$5.371

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$5.371

Netroflash

USA . 500 parts In-Stock

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$5.481

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$5.481

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MKK Technologies

India . 853 parts In-Stock

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$5.875

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$5.875

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DigiPath Technology Company

USA . 853 parts In-Stock

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$5.875

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$5.875

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Semicontronic

India . 1,435 parts In-Stock

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$7.000

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$6.825

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$6.790

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Microchip USA

USA . 180 parts In-Stock

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$65.529

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Authorized Procurement Solutions

USA . 53,474 parts In-Stock

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Infinite Electronics LLP (Excess)

. 7,031 parts In-Stock

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Formix International (Excess)

India . 6,998 parts In-Stock

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Lixinc

USA . 4,030 parts In-Stock

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Alle Elektronik GmbH

Germany . 3,139 parts In-Stock

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Corphita

USA . 2,725 parts In-Stock

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Perfect Parts

USA . 2,445 parts In-Stock

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Parana Technologies

USA . 1,761 parts In-Stock

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$3.736

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$3.736

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Assy Fe

Spain . 1,147 parts In-Stock

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Argo Parts USA

USA . 1,111 parts In-Stock

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A-Z Elektronik GmbH

Germany . 485 parts In-Stock

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Schahn Electronic Components

Germany . 480 parts In-Stock

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Speed Components Ltd (Excess)

Israel . 49 parts In-Stock

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Kepictronics

USA . 35 parts In-Stock

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A-Plus Industry Inc.

USA . 24 parts In-Stock

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Computer Components Inc. - USA

USA . 18 parts In-Stock

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Cyclops Electronics Ltd (Excess)

UK . 3 parts In-Stock

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Overview

Unlock the power of reliable and durable memory solutions with the M27C4001-10F1 EPROM by STMicroelectronics. Crafted with high-quality ceramic and metal-sealed materials, this versatile memory module offers seamless asynchronous operation and 512KX8 organization for optimal performance. Ideal for a wide range of applications, from industrial automation to consumer electronics, this EPROM delivers exceptional value and benefits with its 3-STATE output characteristics and low standby current. Trust STMicroelectronics for cutting-edge technology that enhances your products and elevates your designs.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Ceramic and metal-sealed cofired package body material provides excellent protection and durability for the EPROM, ensuring reliable performance even in harsh operating conditions.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for flexibility in accessing and writing data, offering smooth and efficient performance for various applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a 5V supply voltage ensures compatibility with standard electronics and provides stable power for the EPROM.

Technology: CMOS

CMOS technology offers low power consumption and high speed operation, making this EPROM energy efficient and fast in data processing.

Maximum Access Time: 100 ns

With a maximum access time of 100 ns, this EPROM can quickly retrieve data, improving overall system performance and responsiveness.

Technical Specifications

EPROM M27C4001-10F1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

100 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T32

JESD-609 Code:

e3

Length:

41.885 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

245

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C4001-10F1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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