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5962-8961403MYX

STMicroelectronics

5962-8961403MYX by STMicroelectronics

5962-8961403MYX by STMicroelectronics is a military-grade EPROM with a 128Kx8 organization, operating asynchronously at a nominal voltage of 5V. It features a ceramic, metal-sealed package and supports temperatures from -55 °C to 125 °C. Ideal for reliable data storage in harsh environments.

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5962-8961403MYX by STMicroelectronics
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Digiode

USA . 3,441 parts In-Stock

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Vyrian

USA . 2,165 parts In-Stock

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Anansix

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748

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IDEA Electronic Components Group

UK . 1,081 parts In-Stock

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$3.158

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1,081

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$3.158

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MKK Technologies

India . 113 parts In-Stock

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$6.598

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DigiPath Technology Company

USA . 113 parts In-Stock

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113

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Semicontronic

India . 1,181 parts In-Stock

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$10.000

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$9.750

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$9.700

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$10.000

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$9.700

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Northwest PG Solutions

USA . 2,280 parts In-Stock

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Corphita

USA . 1,352 parts In-Stock

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Parana Technologies

USA . 1,246 parts In-Stock

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$4.195

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Native Components

USA . 948 parts In-Stock

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Supply Digital

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Overview

Unlock unparalleled performance with the 5962-8961403MYX EPROM from STMicroelectronics. Renowned for their commitment to quality and innovation, STMicroelectronics ensures this robust device meets military-grade specifications, making it ideal for critical applications in aerospace, defense, and industrial sectors. Experience exceptional reliability and durability, even in extreme conditions, empowering your designs while delivering unmatched value and peace of mind.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic and metal-sealed construction ensures excellent protection against environmental factors, enhancing the reliability and longevity of the EPROM.

Surface Mount: YES

Surface mount technology allows for lower profile designs and facilitates automated assembly, making this EPROM suitable for compact applications.

Screening Level: MIL-STD-883

Complying with military standards indicates this product undergoes rigorous testing, ensuring it meets high reliability requirements for critical applications.

Package Shape: RECTANGULAR

The rectangular shape optimizes space on PCB layouts, making it easier to integrate into a variety of electronic designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster data access without the need for clock signals, resulting in improved performance in data retrieval.

Nominal Supply Voltage / Vsup: 5V

Operating at a standard 5V supply makes it compatible with most digital circuits and systems, simplifying design considerations.

No. of Terminals: 32

The 32 terminals provide ample connectivity options for various applications, enhancing flexibility in circuit design.

Package Style (Meter): CHIP CARRIER, WINDOW

Chip carrier packaging with a window allows for easy access to the EPROM for programming, making it convenient for development and testing.

Maximum Operating Temperature: 125 °C

The high maximum operating temperature ensures reliability in extreme environments, making it suitable for military and aerospace applications.

Organization: 128KX8

This organization format provides a balance of storage capacity and ease of access, making it ideal for numerous applications requiring moderate memory.

Minimum Operating Temperature: -55 °C

The ability to operate in very low temperatures makes this EPROM suitable for use in harsh and extreme climates.

Terminal Finish: TIN LEAD

The tin-lead finish enhances solderability and ensures a reliable connection, which is critical for maintaining performance in electronic assemblies.

Terminal Position: QUAD

Quad terminal positioning facilitates better distribution of signals and power, contributing to overall circuit performance.

Maximum Seated Height: 2.92 mm

The low seated height allows for low-profile designs, making it a great choice for space-constrained applications.

Width: 11.4 mm

A compact width helps in fitting the EPROM into tighter design requirements while ensuring efficient use of PCB space.

Minimum Supply Voltage (Vsup): 4.5V

With a minimum supply voltage lower than standard, it offers flexibility in power supply design and energy efficiency.

Length: 13.95 mm

The manageable length aids in fitting into various form factors, ensuring versatility in implementation.

Temperature Grade: MILITARY

Rated for military applications, this EPROM is built to withstand rigorous conditions, ensuring performance and reliability where it matters most.

Technology: CMOS

CMOS technology enhances power efficiency and performance, making this EPROM a suitable choice for portable and battery-operated devices.

Parallel or Serial: PARALLEL

Parallel access allows for faster data transfer rates compared to serial interfaces, improving overall system performance.

Terminal Form: NO LEAD

No-lead terminals facilitate compact designs and are environmentally friendly, aligning with modern manufacturing practices.

No. of Words: 131072 words

With a substantial number of words, it provides ample memory for applications requiring moderate storage capacity.

Memory Width: 8 bits

An 8-bit memory width offers a good balance between performance and storage capacity, suitable for a wide range of applications.

Terminal Pitch: 1.27 mm

The 1.27 mm terminal pitch supports tighter component packing and is commonly used in many electronic designs, enhancing interoperability.

No. of Words Code: 128K

This designation indicates the memory's capacity, fitting well for applications needing efficient data storage and retrieval.

Maximum Supply Voltage (Vsup): 5.5V

A higher maximum supply voltage tolerance provides design flexibility and compatibility with varying power supply conditions.

Memory Density: 1048576 bit

High memory density means more data can be stored in a small footprint, making it ideal for memory-intensive applications.

Memory IC Type: UVPROM

As a UVPROM, this EPROM can be erased and reprogrammed using UV light, allowing for reuse in multiple applications.

Maximum Access Time: 200 ns

A fast access time of 200 ns ensures quick data retrieval, beneficial for applications where speed is critical.

Technical Specifications

EPROM 5962-8961403MYX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

200 ns

JESD-30 Code:

R-CQCC-N32

JESD-609 Code:

e0

Length:

13.95 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

128KX8

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Screening Level:

MIL-STD-883

Maximum Seated Height:

2.92 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.4 mm

Trade Compliance

5962-8961403MYX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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