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5962-8961403QXX

Texas Instruments

5962-8961403QXX by Texas Instruments

The Texas Instruments 5962-8961403QXX is a MILITARY-grade EPROM with 128KX8 organization, CMOS technology, and 131072 words. It operates at temperatures from -55 to 125 °C and has a max access time of 200 ns. Ideal for military applications requiring reliable non-volatile memory storage in harsh environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 8,384 parts In-Stock

1+ parts

-

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8,384

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Digiode

USA . 3,136 parts In-Stock

1+ parts

-

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3,136

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Native Components

USA . 618 parts In-Stock

1+ parts

$0.813

100+ parts

-

1k+ parts

-

10k+ parts

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618

$0.813

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Northwest PG Solutions

USA . 602 parts In-Stock

1+ parts

$0.895

100+ parts

-

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602

$0.895

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Parana Technologies

USA . 1,907 parts In-Stock

1+ parts

$2.159

100+ parts

-

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$2.672

10k+ parts

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1,907

$2.159

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$2.672

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DigiPath Technology Company

USA . 320 parts In-Stock

1+ parts

$2.377

100+ parts

$2.187

1k+ parts

-

10k+ parts

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320

$2.377

$2.187

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ChromeModa Solutions

Germany . 6,818 parts In-Stock

1+ parts

$2.426

100+ parts

$1.989

1k+ parts

-

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6,818

$2.426

$1.989

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IDEA Electronic Components Group

UK . 905 parts In-Stock

1+ parts

$2.426

100+ parts

-

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$2.183

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905

$2.426

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$2.183

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One Stop Electronics

USA . 1,435 parts In-Stock

1+ parts

$11.000

100+ parts

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1,435

$11.000

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AZTECH Wire

Italy . 320 parts In-Stock

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$17.009

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320

$17.009

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Corphita

USA . 3,179 parts In-Stock

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3,179

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Overview

Unlock a world of possibilities with the 5962-8961403QXX EPROM by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers cutting-edge technology in every product. This EPROM offers military-grade performance with a wide operating temperature range, making it ideal for harsh environments. With its fast access time and high memory density, this EPROM is perfect for applications where speed and reliability are crucial. Trust Texas Instruments to provide you with the best EPROM solutions on the market.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The use of ceramic and metal-sealed cofired package body material ensures high durability and reliability, making this product suitable for harsh operating environments.

Screening Level: MIL-PRF-38535 Class Q

Meeting MIL-PRF-38535 Class Q screening level standards ensures a high level of quality and reliability in performance, making this product ideal for military and aerospace applications.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for flexible and independent operation, providing efficient performance and compatibility with various systems.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V offers compatibility with standard power systems, making integration into existing setups easy and convenient.

Maximum Operating Temperature: 125 °C

With a high maximum operating temperature of 125°C, this product can withstand elevated temperatures, ensuring reliable performance in a wide range of environmental conditions.

Organization: 128KX8

The 128KX8 organization provides a high memory capacity and efficient data organization, enabling the product to store and retrieve information effectively for various applications.

Technology: CMOS

Using CMOS technology offers low power consumption and high speed operation, making this product energy-efficient and suitable for applications that require quick data access.

Maximum Access Time: 200 ns

The maximum access time of 200 ns ensures fast data retrieval and processing, enhancing the overall performance of the product in time-sensitive applications.

Technical Specifications

EPROM 5962-8961403QXX attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

JESD-30 Code:

R-CDIP-T32

JESD-609 Code:

e0

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

128KX8

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Screening Level:

MIL-PRF-38535 Class Q

Maximum Seated Height:

7.493 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

TIN LEAD

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

5962-8961403QXX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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