Loading...

M27C64A-15F6

STMicroelectronics

M27C64A-15F6 by STMicroelectronics

M27C64A-15F6 by STMicroelectronics is an 8KX8 EPROM with 150ns access time, operating at 5V. It features a CMOS technology, 3-STATE output characteristics, and supports parallel programming. Ideal for industrial applications requiring reliable non-volatile memory storage in a compact IN-LINE package.

Median Price

$8.280

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Mobius Materials

USA . 136 parts In-Stock

1+ parts

$8.280

100+ parts

$6.610

1k+ parts

-

10k+ parts

-

136

$8.280

$6.610

-

-

Vyrian

USA . 3,039 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

3,039

-

-

-

-

Digiode

USA . 1,301 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,301

-

-

-

-

Anansix

USA . 167 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

167

-

-

-

-

Nova Conductors

Japan . 56 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

56

-

-

-

-

Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Corohmni

South Africa . 36 parts In-Stock

1+ parts

$4.439

100+ parts

-

1k+ parts

-

10k+ parts

-

36

$4.439

-

-

-

IDEA Electronic Components Group

UK . 1,465 parts In-Stock

1+ parts

$4.939

100+ parts

-

1k+ parts

$4.446

10k+ parts

-

1,465

$4.939

-

$4.446

-

MKK Technologies

India . 2,117 parts In-Stock

1+ parts

$9.288

100+ parts

-

1k+ parts

-

10k+ parts

-

2,117

$9.288

-

-

-

DigiPath Technology Company

USA . 2,117 parts In-Stock

1+ parts

$9.288

100+ parts

-

1k+ parts

-

10k+ parts

-

2,117

$9.288

-

-

-

Ampacity Inc.

Singapore . 1,113 parts In-Stock

1+ parts

$22.000

100+ parts

-

1k+ parts

-

10k+ parts

-

1,113

$22.000

-

-

-

Argo Parts USA

USA . 4,748 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

4,748

-

-

-

-

Parana Technologies

USA . 1,512 parts In-Stock

1+ parts

-

100+ parts

$5.906

1k+ parts

-

10k+ parts

-

1,512

-

$5.906

-

-

Aranea Global

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

1,000

-

-

-

-

Corphita

USA . 732 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

732

-

-

-

-

Continental Prestige Electronics

USA . 698 parts In-Stock

1+ parts

-

100+ parts

-

1k+ parts

-

10k+ parts

-

698

-

-

-

-

Overview

Unlock the power of reliable data storage with the M27C64A-15F6 EPROM from STMicroelectronics. With its high-quality ceramic, metal-sealed co-fired package and advanced CMOS technology, this memory IC offers industrial-grade performance for a wide range of applications. Whether you need to store program codes or configuration data, this 8Kx8 memory device provides fast access times and low standby current, ensuring efficient operation. Trust STMicroelectronics for top-notch quality and experience the benefits of seamless data storage solutions with the M27C64A-15F6 EPROM.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This durable package body material ensures the EPROM's components are well protected, making it a reliable choice for long-term use.

Operating Mode: ASYNCHRONOUS

The asynchronous operating mode allows for efficient and independent control of operations, offering flexibility and ease of use.

Nominal Supply Voltage / Vsup (V): 5

With a nominal supply voltage of 5V, this EPROM is compatible with standard power supplies, making it easy to integrate into existing systems.

No. of Terminals: 28

Having 28 terminals provides ample connectivity options, allowing for versatile applications and connections to other devices.

Memory Density: 65536 bit

The high memory density of 65536 bits ensures ample storage capacity for data, making it suitable for storing a large amount of information.

Technical Specifications

EPROM M27C64A-15F6 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T28

JESD-609 Code:

e3

Length:

36.92 mm

Memory Density:

65536 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

8192 words

No. of Words Code:

8K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

85 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

8KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Not Qualified

Maximum Seated Height:

5.97 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C64A-15F6 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

Category top products 20

Authentic purchasing experiences

Partstack™ will investigate all reported instances of potential suspect/counterfeit part listings.

Similar products 20