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TMS27C256-17JL4

Texas Instruments

TMS27C256-17JL4 by Texas Instruments

TMS27C256-17JL4 by Texas Instruments is a 32KX8 EPROM with 170ns access time, 262144-bit memory density, and operates at 5V. It is used in commercial applications for storing data securely due to its UVPROM technology and through-hole terminal form.

Median Price

-

Lifecycle Status

Suppliers In-Stock

2

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,106 parts In-Stock

1+ parts

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4,106

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Vyrian

USA . 3,256 parts In-Stock

1+ parts

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3,256

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Parana Technologies

USA . 1,541 parts In-Stock

1+ parts

$4.341

100+ parts

-

1k+ parts

$4.759

10k+ parts

-

1,541

$4.341

-

$4.759

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DigiPath Technology Company

USA . 1,340 parts In-Stock

1+ parts

$4.779

100+ parts

$4.397

1k+ parts

-

10k+ parts

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1,340

$4.779

$4.397

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IDEA Electronic Components Group

UK . 1,946 parts In-Stock

1+ parts

$4.877

100+ parts

-

1k+ parts

$4.389

10k+ parts

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1,946

$4.877

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$4.389

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ChromeModa Solutions

Germany . 179 parts In-Stock

1+ parts

$4.877

100+ parts

$3.999

1k+ parts

-

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179

$4.877

$3.999

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One Stop Electronics

USA . 920 parts In-Stock

1+ parts

$11.000

100+ parts

-

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920

$11.000

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AZTECH Wire

Italy . 842 parts In-Stock

1+ parts

$12.515

100+ parts

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842

$12.515

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Corphita

USA . 2,857 parts In-Stock

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2,857

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Overview

Unlock endless possibilities with the TMS27C256-17JL4 EPROM from Texas Instruments. Designed with precision and reliability in mind, this innovative memory IC offers exceptional performance for a wide range of applications. Whether you're developing consumer electronics, automotive systems, or industrial equipment, this high-quality product delivers unmatched value and benefits. Trust Texas Instruments to provide cutting-edge technology that meets your needs and exceeds your expectations. Elevate your projects with the TMS27C256-17JL4 EPROM and experience the difference today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

Provides excellent protection and durability, making the EPROM suitable for harsh operating environments.

Nominal Supply Voltage / Vsup (V): 5

Standard 5V supply voltage ensures compatibility with many systems and simplifies integration.

Organization: 32KX8

Offers a large memory capacity of 32K words with 8 bits wide, suitable for storing significant amounts of data.

Technology: CMOS

CMOS technology ensures low power consumption and reliable performance in various applications.

Maximum Access Time: 170 ns

Fast access time ensures quick retrieval and processing of data, improving overall system performance.

Technical Specifications

EPROM TMS27C256-17JL4 attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

170 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T28

Length:

36.83 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Programming Voltage (V):

13

Qualification:

Not Qualified

Maximum Seated Height:

4.91 mm

Maximum Standby Current:

.00025 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C256-17JL4 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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