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M27C1024-90F7

STMicroelectronics

M27C1024-90F7 by STMicroelectronics

M27C1024-90F7 by STMicroelectronics is a 1Mb UVPROM with a 5V supply, featuring asynchronous operation and a max access time of 80 ns. It operates in extreme temperatures from -40 °C to 105°C, making it ideal for industrial applications. Its ceramic, glass-sealed package ensures durability in demanding environments.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Digiode

USA . 4,393 parts In-Stock

1+ parts

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4,393

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Vyrian

USA . 3,246 parts In-Stock

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3,246

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Anansix

USA . 280 parts In-Stock

1+ parts

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280

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,068 parts In-Stock

1+ parts

$5.054

100+ parts

-

1k+ parts

$4.549

10k+ parts

-

2,068

$5.054

-

$4.549

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MKK Technologies

India . 135 parts In-Stock

1+ parts

$9.505

100+ parts

-

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135

$9.505

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DigiPath Technology Company

USA . 135 parts In-Stock

1+ parts

$9.505

100+ parts

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135

$9.505

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Corphita

USA . 4,364 parts In-Stock

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4,364

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Parana Technologies

USA . 1,690 parts In-Stock

1+ parts

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100+ parts

$6.043

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1,690

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$6.043

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Overview

Unlock innovation with the M27C1024-90F7 EPROM from STMicroelectronics, a trusted name in advanced semiconductor solutions. Crafted from durable ceramic and glass-sealed materials, this high-quality memory chip excels in reliability and performance, even in extreme environments. Ideal for automotive, industrial, and consumer applications, it offers fast access times and exceptional durability, ensuring your projects thrive with efficiency and longevity. Experience the difference that STMicroelectronics brings to your designs!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

This material provides excellent durability and protection from environmental factors, making the EPROM suitable for industrial applications.

Package Shape: RECTANGULAR

The rectangular shape allows for efficient space utilization on circuit boards, facilitating easier integration into various designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation enables faster access and control, providing better performance in applications requiring quick data retrieval.

Input/Output Type: COMMON

Common I/O type ensures compatibility with a wide range of devices, simplifying the design process and enhancing flexibility.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard voltage makes it easy to use with most common power supplies and systems.

Power Supplies (V): 5

Single power supply needs reduce complexity and cost in circuit design.

No. of Terminals: 40

A higher number of terminals can accommodate more connections and features, enhancing functionality.

Package Style (Meter): IN-LINE, WINDOW

An in-line package with a window allows for easy erasure and reprogramming, making it convenient for development and testing.

Maximum Operating Temperature: 105 °C

This temperature rating ensures reliable operation in high-temperature environments, suitable for industrial applications.

Organization: 64KX16

The 64Kx16 organization provides a balanced memory arrangement, offering both operational efficiency and flexibility for various applications.

Output Characteristics: 3-STATE

3-state outputs allow for better bus management, enabling multiple devices to share the same data line without conflicts.

Minimum Operating Temperature: -40 °C

A wide temperature range ensures reliable performance in extreme environments, making it ideal for industrial use.

Terminal Finish: MATTE TIN

Matte tin finish improves solderability and thermal performance, enhancing the reliability of connections.

Terminal Position: DUAL

Dual terminal position provides flexibility in PCB layout, facilitating easier integration into diverse designs.

Maximum Seated Height: 5.97 mm

A compact height helps to minimize space on the PCB, allowing more components to be integrated into a smaller area.

Width: 15.24 mm

A standard width makes it compatible with existing socket designs, simplifying replacement and integration.

Minimum Supply Voltage (Vsup): 4.5 V

Lower minimum voltage requirement caters to energy-efficient designs while maintaining stable operation.

Length: 52.195 mm

The length fits common standard PCB layouts, enhancing compatibility with existing designs.

Temperature Grade: INDUSTRIAL

Industrial-grade components ensure robust performance and longevity in demanding applications.

Technology: CMOS

CMOS technology offers low power consumption, making it energy-efficient for prolonged applications.

Parallel or Serial: PARALLEL

Parallel operation allows for faster data transfer rates, improving overall system performance.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide mechanical stability and are easier to handle during assembly.

Maximum Supply Current: 35 mA

Moderate supply current requirements help in designing low-power systems while ensuring robust operation.

No. of Words: 65536 words

The 64K words memory capacity is suitable for a wide range of applications, providing ample space for data storage.

Memory Width: 16

A memory width of 16 bits allows for more efficient data processing, facilitating high-performance applications.

Terminal Pitch: 2.54 mm

Standard terminal pitch facilitates easy assembly and soldering, reducing production intricacies.

No. of Words Code: 64K

The straightforward configuration of 64K words makes address decoding simple for circuit designers.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5 V ensures safe operating conditions while still being compatible with standard systems.

Memory Density: 1048576 bit

High memory density provides significant data storage capability, meeting varying application demands.

Memory IC Type: UVPROM

The UVPROM type allows for reusability through erasure by UV light, enhancing the product's versatility for prototyping.

Maximum Standby Current: 0.0001 Amp

Very low standby current ensures minimal power consumption when the device is inactive, crucial for battery-operated systems.

Maximum Access Time: 80 ns

Fast access time of 80 ns ensures quick data retrieval, making the device suitable for high-speed applications.

Technical Specifications

EPROM M27C1024-90F7 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

80 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T40

JESD-609 Code:

e3

Length:

52.195 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

40

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

105 Cel

Minimum Operating Temperature:

-40 Cel

Organization:

64KX16

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.97 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C1024-90F7 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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