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M27C1024-90XF1

STMicroelectronics

M27C1024-90XF1 by STMicroelectronics

M27C1024-90XF1 by STMicroelectronics is a 64Kx16 UVPROM with a max access time of 80 ns, ideal for asynchronous applications. It operates at a nominal voltage of 5V and features a ceramic, glass-sealed package. This reliable memory solution supports commercial temperature ranges from 0 °C to 70°C.

Median Price

-

Lifecycle Status

Suppliers In-Stock

3

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,680 parts In-Stock

1+ parts

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4,680

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Digiode

USA . 4,412 parts In-Stock

1+ parts

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4,412

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Anansix

USA . 665 parts In-Stock

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665

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,389 parts In-Stock

1+ parts

$3.611

100+ parts

-

1k+ parts

$3.250

10k+ parts

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1,389

$3.611

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$3.250

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MKK Technologies

India . 1,564 parts In-Stock

1+ parts

$6.790

100+ parts

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1,564

$6.790

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DigiPath Technology Company

USA . 1,564 parts In-Stock

1+ parts

$6.790

100+ parts

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1,564

$6.790

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Corphita

USA . 4,900 parts In-Stock

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4,900

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Parana Technologies

USA . 2,331 parts In-Stock

1+ parts

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100+ parts

$4.318

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2,331

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$4.318

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Overview

Unlock unparalleled reliability with the M27C1024-90XF1 EPROM from STMicroelectronics, a leader in innovative semiconductor solutions. Crafted with precision, this device ensures exceptional performance across various applications, from industrial to consumer electronics. Its robust ceramic, glass-sealed design guarantees durability, while its asynchronous operation enhances efficiency. Experience peace of mind knowing you're backed by ST's commitment to quality, offering you unmatched value and long-lasting benefits for your projects.

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The ceramic, glass-sealed package offers robust protection against environmental factors, ensuring the reliability and longevity of the EPROM.

Package Shape: RECTANGULAR

The rectangular shape is optimal for PCB layout, allowing efficient use of space and easy integration into various applications.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster access times and simpler interfacing with other components, improving overall system performance.

Input/Output Type: COMMON

Common I/O type facilitates easier connections and integration with other devices, streamlining the design process.

Nominal Supply Voltage / Vsup (V): 5

Operating at a standard 5V supply voltage ensures compatibility with a wide range of systems, reducing design complexity.

Power Supplies (V): 5

Single power supply requirement simplifies power management in systems, enhancing reliability and ease of use.

No. of Terminals: 40

With 40 terminals, this device can support a rich set of functionalities and interfaces, making it versatile for various applications.

Package Style (Meter): IN-LINE, WINDOW

The windowed design allows for UV exposure, enabling reprogramming of the EPROM, which is advantageous in development and prototyping.

Maximum Operating Temperature: 70 °C

The operational temperature range up to 70 °C ensures the device can perform reliably in a variety of environments.

Organization: 64KX16

This memory organization provides a large capacity and wide data width, making it suitable for applications requiring significant data storage.

Output Characteristics: 3-STATE

3-state output allows for flexible data bus sharing in multi-device systems, enhancing design scalability and efficiency.

Minimum Operating Temperature: 0 °C

Operating from 0 °C allows the device to function in mildly cold environments, increasing its applicability.

Terminal Finish: MATTE TIN

Matte tin finish provides good solderability, ensuring reliable connections during assembly and manufacturing.

Terminal Position: DUAL

Dual terminal positioning facilitates easier soldering and handling during PCB assembly.

Maximum Seated Height: 5.97 mm

Compact height allows the device to fit into tight spaces on PCB layouts without compromising on performance.

Width: 15.24 mm

Optimal width balances footprint and performance, making it suitable for applications with space constraints.

Minimum Supply Voltage (Vsup): 4.75 V

This flexibility in supply voltage allows for better power management options in various applications.

Length: 52.195 mm

The length is designed for compatibility with standard PCB layouts, ensuring ease of integration.

Temperature Grade: COMMERCIAL

Rated for commercial temperature use, making it suitable for a wide range of applications without special conditions.

Technology: CMOS

CMOS technology provides low power consumption and high noise immunity, enhancing system efficiency.

Parallel or Serial: PARALLEL

Parallel interface enables faster data transfer rates, making it suitable for high-performance applications.

Terminal Form: THROUGH-HOLE

Through-hole terminals provide strong mechanical and electrical connections, ideal for durable designs.

Maximum Supply Current: 35 mA

Low maximum supply current helps in conserving power, making it ideal for energy-sensitive applications.

No. of Words: 65536 words

With 65536 words, the memory capacity is ample for a variety of applications, allowing for extensive data storage.

Memory Width: 16

A 16-bit memory width enhances data handling capabilities, improving throughput for applications needing wide data processing.

Terminal Pitch: 2.54 mm

Standard terminal pitch ensures easy compatibility with existing PCB designs and simplifies assembly.

No. of Words Code: 64K

64K words capacity indicates substantial data storage potential, suitable for complex applications.

Maximum Supply Voltage (Vsup): 5.25 V

The ability to operate at a slightly higher voltage allows for more flexible power supply use and lower risk of under-voltage conditions.

Memory Density: 1048576 bit

High memory density provides significant storage in a compact form, making it optimal for space-constrained designs.

Memory IC Type: UVPROM

As a UVPROM, this EPROM can be easily erased and reprogrammed, highly suitable for development and iterative design processes.

Maximum Standby Current: 0.0001 Amp

Extremely low standby current minimizes power consumption when the device is not active, perfect for battery-powered applications.

Maximum Access Time: 80 ns

Fast access time of 80 ns supports high-speed operation, making it suitable for performance-critical applications.

Technical Specifications

EPROM M27C1024-90XF1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

80 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T40

JESD-609 Code:

e3

Length:

52.195 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

40

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX16

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.97 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

35 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C1024-90XF1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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