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TMS27C210-250JL

Texas Instruments

TMS27C210-250JL by Texas Instruments

TMS27C210-250JL by Texas Instruments is a 64KX16 EPROM with 250 ns access time, 5V supply voltage, and 40 mA supply current. It is used in commercial applications for storing data in parallel format with a memory density of 1048576 bits.

Median Price

-

Lifecycle Status

Suppliers In-Stock

4

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Vyrian

USA . 4,091 parts In-Stock

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Digiode

USA . 1,917 parts In-Stock

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1,917

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Resion

USA . 27 parts In-Stock

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Q Components

USA . 2 parts In-Stock

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Distributors (Availability)

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Parana Technologies

USA . 990 parts In-Stock

1+ parts

$2.851

100+ parts

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$3.341

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990

$2.851

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$3.341

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One Stop Electronics

USA . 1,269 parts In-Stock

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$3.000

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1,269

$3.000

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ChromeModa Solutions

Germany . 2,708 parts In-Stock

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$3.203

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$2.626

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$3.203

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IDEA Electronic Components Group

UK . 2,265 parts In-Stock

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$3.203

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$2.883

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$2.883

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AZTECH Wire

Italy . 328 parts In-Stock

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$12.436

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Corphita

USA . 629 parts In-Stock

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DigiPath Technology Company

USA . 429 parts In-Stock

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$2.888

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Overview

Unlock the power of cutting-edge technology with the TMS27C210-250JL EPROM by Texas Instruments. Known for their superior quality and reliability, Texas Instruments delivers unmatched performance in memory solutions. Ideal for a wide range of applications, this EPROM offers fast access times and low power consumption, making it a cost-effective choice for your project needs. Trust Texas Instruments to provide the innovative solutions you need to stay ahead in today's competitive market.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

This material combination ensures durability and protection for the EPROM, making it reliable for long-term use.

Memory Density: 1048576 bit

With a high memory density, this EPROM can store a large amount of data efficiently.

Input/Output Type: COMMON

Having a common input/output type simplifies connectivity and integration with other devices.

Operating Mode: ASYNCHRONOUS

The asynchronous operation mode allows for flexible and independent data access, enhancing overall performance.

Maximum Operating Temperature: 70 °C

The EPROM can operate effectively at high temperatures, ensuring reliability in various environments.

Technology: CMOS

CMOS technology offers low power consumption and high noise immunity, making this EPROM energy-efficient and reliable.

Technical Specifications

EPROM TMS27C210-250JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

250 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T40

Length:

52.07 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

16

No. of Functions:

1

No. of Terminals:

40

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX16

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP40,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.907 mm

Maximum Standby Current:

.00025 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C210-250JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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