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5962-8606305YC

STMicroelectronics

5962-8606305YC by STMicroelectronics

5962-8606305YC by STMicroelectronics is a military-grade EPROM with a 32Kx8 organization and operates asynchronously. It features a max temp of 125 °C, 150 ns access time, and requires a supply voltage of 5V. Ideal for high-reliability applications in harsh environments.

Median Price

$209.520

Lifecycle Status

Suppliers In-Stock

5

In-Stock Inventory

1k+

Distributors (Authorized)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Arrow

USA . 3 parts In-Stock

1+ parts

$209.520

100+ parts

-

1k+ parts

-

10k+ parts

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3

$209.520

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Distributors (In-Stock)

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Bristol Electronics

USA . 3 parts In-Stock

1+ parts

$42.000

100+ parts

-

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3

$42.000

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Digiode

USA . 4,157 parts In-Stock

1+ parts

$199.044

100+ parts

-

1k+ parts

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4,157

$199.044

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Vyrian

USA . 7,558 parts In-Stock

1+ parts

-

100+ parts

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7,558

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Anansix

USA . 1,779 parts In-Stock

1+ parts

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1,779

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 2,066 parts In-Stock

1+ parts

$3.537

100+ parts

-

1k+ parts

$3.184

10k+ parts

-

2,066

$3.537

-

$3.184

-

MKK Technologies

India . 1,313 parts In-Stock

1+ parts

$6.652

100+ parts

-

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1,313

$6.652

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DigiPath Technology Company

USA . 1,313 parts In-Stock

1+ parts

$6.652

100+ parts

-

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1,313

$6.652

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Corphita

USA . 1,726 parts In-Stock

1+ parts

$188.568

100+ parts

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1,726

$188.568

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Parana Technologies

USA . 1,397 parts In-Stock

1+ parts

-

100+ parts

$4.230

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1,397

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$4.230

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Native Components

USA . 1,000 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.219

10k+ parts

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1,000

-

-

$4.219

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Northwest PG Solutions

USA . 863 parts In-Stock

1+ parts

-

100+ parts

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1k+ parts

$4.263

10k+ parts

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863

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-

$4.263

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Overview

Unlock unparalleled performance with the 5962-8606305YC EPROM from STMicroelectronics. Renowned for quality and reliability, STMicroelectronics delivers a military-grade solution tailored for critical applications. With its robust ceramic package and exceptional temperature resilience, this asynchronous device ensures data integrity in demanding environments. Experience peace of mind and superior efficiency, enhancing your projects with a trusted leader in semiconductor technology.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The durable ceramic construction offers robust protection against environmental factors, making this EPROM suitable for demanding applications.

Surface Mount: YES

Surface mount capability allows for compact designs and easier integration into modern PCBs, enhancing manufacturability.

Screening Level: 38535Q/M; 38534H; 883B

This screening ensures high reliability and performance, particularly critical in military and aerospace applications.

Package Shape: RECTANGULAR

The rectangular shape facilitates efficient space utilization on circuit boards, aiding in system design flexibility.

Operating Mode: ASYNCHRONOUS

Asynchronous operation simplifies design and reduces timing constraints, improving overall system performance.

Input/Output Type: COMMON

A common I/O type makes integration easier with a wide range of devices, improving compatibility.

Nominal Supply Voltage / Vsup (V): 5

The standard 5V supply voltage is compatible with many existing systems, reducing the need for additional voltage regulation.

Power Supplies (V): 5

Utilizing a single 5V power supply simplifies design and reduces power consumption in systems.

No. of Terminals: 32

Having 32 terminals allows for enhanced connectivity options, facilitating various implementation scenarios.

Package Style (Meter): CHIP CARRIER, WINDOW

The chip carrier design with a window allows for easy programming and monitoring, enhancing ease of use.

Maximum Operating Temperature: 125 °C

Withstands high temperatures, which is crucial for reliability in extreme environments.

Organization: 32KX8

The 32Kx8 organization provides sufficient memory for a variety of applications, ensuring versatility.

Output Characteristics: 3-STATE

3-state outputs allow for efficient bus sharing among multiple devices, enhancing design flexibility.

Minimum Operating Temperature: -55 °C

Designed to function in low-temperature environments, this part is ideal for military and aerospace applications.

Terminal Finish: Gold (Au)

Gold terminals provide excellent conductivity and corrosion resistance, ensuring long-term reliability.

Terminal Position: QUAD

Quad position allows for better layout options on PCBs, making routing easier.

Maximum Seated Height: 3.556 mm

A low profile aids in space-constrained designs, while maintaining good electrical performance.

Width: 11.43 mm

Compact width enables efficient usage of board space, crucial for modern electronic devices.

Minimum Supply Voltage (Vsup): 4.5 V

Flexibility in operating voltage enables a wider range of application uses, accommodating various designs.

Length: 13.97 mm

The length is well-suited for high-density applications, aiding in compact PCB layouts.

Programming Voltage (V): 12.5

A dedicated programming voltage allows for efficient UV erasure and programming of the device.

Temperature Grade: MILITARY

Designed to meet military specifications ensures the product is reliable and robust under harsh conditions.

Technology: CMOS

CMOS technology enables low power consumption while maintaining high-speed performance.

Parallel or Serial: PARALLEL

Parallel access speeds up data retrieval, making it ideal for applications requiring rapid data processing.

Terminal Form: NO LEAD

No lead form is ideal for modern surface mount designs, promoting reduced lead inductance and enhanced performance.

Maximum Supply Current: 50 mA

A 50 mA maximum supply current strikes a good balance between performance and power efficiency.

No. of Words: 32768 words

Offers substantial memory capacity for diverse applications, from small systems to more complex devices.

Memory Width: 8

An 8-bit memory width aligns with many standard applications, making it versatile for various uses.

Terminal Pitch: 1.27 mm

The 1.27 mm pitch is compatible with modern manufacturing practices, facilitating easy assembly.

No. of Words Code: 32K

32K words of memory allows for effective data storage capabilities in a compact form factor.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum voltage tolerance of 5.5 V allows for flexibility in design without risking damage to the device.

Memory Density: 262144 bit

The high memory density enables more data storage in a smaller package, meeting the needs of advanced applications.

Memory IC Type: UVPROM

UVPROM technology allows for easy reprogramming, offering flexibility for firmware updates and design changes.

Maximum Standby Current: 0.0003 Amp

Extremely low standby current enhances overall energy efficiency, making it suitable for battery-powered devices.

Maximum Access Time: 150 ns

Fast access time of 150 ns ensures quick data retrieval, vital for high-speed applications.

Technical Specifications

EPROM 5962-8606305YC attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

150 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CQCC-N32

JESD-609 Code:

e4

Length:

13.97 mm

Memory Density:

262144 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

32768 words

No. of Words Code:

32K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

32KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

LCC32,.45X.55

Package Shape:

Package Style (Meter):

CHIP CARRIER, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Programming Voltage (V):

12.5

Qualification:

Not Qualified

Screening Level:

38535Q/M;38534H;883B

Maximum Seated Height:

3.556 mm

Maximum Standby Current:

.0003 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

50 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

YES

Technology:

CMOS

Temperature Grade:

Terminal Finish:

Gold (Au)

Terminal Form:

NO LEAD

Terminal Pitch:

1.27 mm

Terminal Position:

QUAD

Width:

11.43 mm

Trade Compliance

5962-8606305YC Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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