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TMS27C010-20JL

Texas Instruments

TMS27C010-20JL by Texas Instruments

TMS27C010-20JL by Texas Instruments is a 128KX8 EPROM with 3-STATE output, operating at 5V. It has a max access time of 200ns and memory density of 1048576 bit. Commonly used in commercial applications for parallel data storage due to its CMOS technology and through-hole terminal form.

Median Price

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Lifecycle Status

Suppliers In-Stock

7

In-Stock Inventory

1k+

Distributors (In-Stock)

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Digiode

USA . 4,273 parts In-Stock

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Vyrian

USA . 2,557 parts In-Stock

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MRC Electronics

USA . 34 parts In-Stock

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Q Components

USA . 12 parts In-Stock

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LIBRA Elektronik GmbH

Germany . 9 parts In-Stock

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LWI Electronics Inc

India . 7 parts In-Stock

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Prism Electronics

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Parana Technologies

USA . 1,077 parts In-Stock

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$2.821

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$3.308

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DigiPath Technology Company

USA . 2,011 parts In-Stock

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$3.107

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$2.858

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IDEA Electronic Components Group

UK . 1,451 parts In-Stock

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$3.170

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$2.853

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ChromeModa Solutions

Germany . 442 parts In-Stock

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$3.170

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$2.599

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One Stop Electronics

USA . 688 parts In-Stock

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AZTECH Wire

Italy . 639 parts In-Stock

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Corphita

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Speed Components Ltd (Excess)

Israel . 10 parts In-Stock

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Overview

Unlock endless possibilities with the TMS27C010-20JL EPROM by Texas Instruments. Crafted with precision and expertise, this high-quality memory IC offers reliable performance in a variety of applications. From consumer electronics to industrial machinery, this versatile device provides a seamless user experience. Experience enhanced efficiency and reliability with Texas Instruments' cutting-edge technology. Elevate your projects with the TMS27C010-20JL EPROM today.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic material provides excellent heat dissipation, while the metal-sealed cofired construction ensures durability and reliability.

Nominal Supply Voltage / Vsup (V): 5

The 5V supply voltage is a common and stable voltage for electronic components, making it easy to integrate this EPROM into existing systems.

No. of Terminals: 32

With 32 terminals, this EPROM offers a sufficient number of connection points for versatile applications.

Memory Density: 1048576 bit

The high memory density of 1,048,576 bits allows for storing a large amount of data efficiently.

Maximum Access Time: 200 ns

The fast access time of 200 nanoseconds ensures quick retrieval of data, making this EPROM suitable for high-speed applications.

Technical Specifications

EPROM TMS27C010-20JL attributes and parameters. Explore more EPROM devices from Texas Instruments

Specs

Maximum Access Time:

200 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T32

Length:

41.91 mm

Memory Density:

1048576 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

131072 words

No. of Words Code:

128K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

128KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

4.907 mm

Maximum Standby Current:

.00025 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

40 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

TMS27C010-20JL Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

Texas Instruments

Texas Instruments Inc. (TI) is one of the world's leading semiconductor companies and a global leader in analog and digital signal processing technology. The company has had a major impact on the electronics industry for over 80 years, manufacturing integrated circuits (ICs), software and subsystems that leverage high-performance computing capabilities. It offers an extensive portfolio of solutions for a wide range of industries, from aerospace to medical devices and consumer products to communication systems. Over its long history, TI has become synonymous with quality, reliability and innovation. Today, TI is one of the largest semiconductor companies in the world with operations in more than 30 countries across six continents.

The material and information contained is this video is for educational and general information purposes. All rights remain with respective rightsholders. Fair Use Statement

Management team

President, CEO

Haviv Ilan

Chairman

Richard K. Templeton

Senior VP, CFO

Rafael R. Lizardi

Manufacturer fab locations 15

Fab name Location Fab Initiation Wafer Capacity

M - Fab

Fabrication

Fab Initiation

1997

USA

South Portland

Wafer Capacity

32,000

1997

32,000

D - FAB

Fabrication

Fab Initiation

1966

USA

Dallas

Wafer Capacity

42,000

1966

42,000

D MOS - 6

Fabrication

Fab Initiation

2002

USA

Dallas

Wafer Capacity

25,000

2002

25,000

D MOS - 5

Fabrication

Fab Initiation

1995

USA

Dallas

Wafer Capacity

75,000

1995

75,000

Miho - 8

Fabrication

Fab Initiation

1980

Japan

Inashiki

Wafer Capacity

43,000

1980

43,000

S FAB 1

Fabrication

Fab Initiation

1966

USA

Sherman

Wafer Capacity

91,000

1966

91,000

F - FAB

Fabrication

Fab Initiation

2001

Germany

Freising

Wafer Capacity

37,000

2001

37,000

R Fab 1

Fabrication

Fab Initiation

2010

USA

Richardson

Wafer Capacity

40,000

2010

40,000

D HC Line

Fabrication

Fab Initiation

1999

USA

Dallas

Wafer Capacity

2,000

1999

2,000

JV3

Fabrication

Fab Initiation

2001

Japan

Aizu Wakamatsu

Wafer Capacity

45,000

2001

45,000

C - FAB

Fabrication

Fab Initiation

2007

China

Chengdu

Wafer Capacity

30,000

2007

30,000

L - Fab

Fabrication

Fab Initiation

2015

USA

Lehi

Wafer Capacity

70,000

2015

70,000

R - Fab 2

Fabrication

Fab Initiation

2022

USA

Richardson

Wafer Capacity

2022

S - FAB 2

Fabrication

Fab Initiation

2025

USA

Sherman

Wafer Capacity

2025

S - FAB 3

Fabrication

Fab Initiation

2028

USA

Sherman

Wafer Capacity

2028

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