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M27C512-70XF1

STMicroelectronics

M27C512-70XF1 by STMicroelectronics

M27C512-70XF1 by STMicroelectronics is a 64KX8 EPROM with 70 ns access time, operating at 5V. It features a CMOS technology, 3-STATE output characteristics, and through-hole terminal form. Ideal for applications requiring non-volatile memory storage in commercial temperature environments.

Median Price

$9.200

Lifecycle Status

Suppliers In-Stock

14

In-Stock Inventory

1k+

Distributors (In-Stock)

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Component Electronics Inc.

Canada . 2 parts In-Stock

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$6.150

100+ parts

$4.620

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$4.000

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2

$6.150

$4.620

$4.000

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Forefront Electronics and Design

USA . 5 parts In-Stock

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$12.250

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5

$12.250

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Vyrian

USA . 7,688 parts In-Stock

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7,688

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Digiode

USA . 4,538 parts In-Stock

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Anansix

USA . 1,673 parts In-Stock

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Vectronix, Inc

USA . 209 parts In-Stock

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Nova Conductors

Japan . 50 parts In-Stock

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50

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Ashlea Components Ltd

UK . 21 parts In-Stock

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LWI Electronics Inc

India . 13 parts In-Stock

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MRC Electronics

USA . 13 parts In-Stock

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13

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ComSIT Distribution GmbH

Germany . 11 parts In-Stock

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ComSIT USA

USA . 11 parts In-Stock

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NexGen Digital

USA . 3 parts In-Stock

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Electronic Expediters

USA . 2 parts In-Stock

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Distributors (Availability)

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Aztec Data Supply Inc.

USA . 3,173 parts In-Stock

1+ parts

$2.220

100+ parts

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3,173

$2.220

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Corohmni

South Africa . 130 parts In-Stock

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$2.258

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130

$2.258

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IDEA Electronic Components Group

UK . 2,361 parts In-Stock

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$2.666

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$2.400

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2,361

$2.666

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$2.400

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MKK Technologies

India . 171 parts In-Stock

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$5.014

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171

$5.014

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DigiPath Technology Company

USA . 171 parts In-Stock

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$5.014

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Microchip USA

USA . 304 parts In-Stock

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$5.205

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304

$5.205

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Semicontronic

India . 1,018 parts In-Stock

1+ parts

$6.000

100+ parts

$5.850

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$5.820

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1,018

$6.000

$5.850

$5.820

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AZTECH Wire

Italy . 459 parts In-Stock

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$8.986

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459

$8.986

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Ampacity Inc.

Singapore . 776 parts In-Stock

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$29.000

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776

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Lixinc

USA . 11,742 parts In-Stock

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Continental Prestige Electronics

USA . 6,802 parts In-Stock

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Alle Elektronik GmbH

Germany . 4,342 parts In-Stock

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Argo Parts USA

USA . 3,848 parts In-Stock

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Assy Fe

Spain . 2,000 parts In-Stock

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Corphita

USA . 461 parts In-Stock

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Kepictronics

USA . 313 parts In-Stock

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Parana Technologies

USA . 300 parts In-Stock

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$3.188

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Bastille Electronics

Australia . 40 parts In-Stock

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Perfect Parts

USA . 3 parts In-Stock

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Overview

Enhance your electronic projects with the M27C512-70XF1 EPROM from STMicroelectronics. Crafted with precision and quality, this ceramic, glass-sealed memory chip offers reliable performance and a wide range of applications. With a reputation for excellence, STMicroelectronics ensures that this EPROM meets the highest industry standards. Unlock endless possibilities with its 64Kx8 organization and 3-STATE output characteristics. Trust in the value and benefits that this product brings to your designs, whether you're a hobbyist or a seasoned professional. Elevate your creations with the M27C512-70XF1 EPROM today!

Feature Benefit Bullets

Package Body Material:

CERAMIC, GLASS-SEALED - Provides durability and protection, ideal for rugged environments.

Package Shape:

RECTANGULAR - Allows for easy integration into circuit boards and systems.

Operating Mode:

ASYNCHRONOUS - Enables flexible and independent operation, enhancing versatility.

Input/Output Type:

COMMON - Simplifies connectivity and compatibility with other components.

Nominal Supply Voltage / Vsup (V):

5 - Standard voltage for reliable and stable performance.

No. of Terminals:

28 - Sufficient terminals for efficient data transfer and communication.

Package Style (Meter):

IN-LINE, WINDOW - Offers a compact design and easy visibility for monitoring.

Maximum Operating Temperature:

70 °C - Ensures reliable functionality in various operating conditions.

Organization:

64KX8 - Provides ample memory capacity for storing data and programs.

Output Characteristics:

3-STATE - Allows for multiple output states, improving flexibility in operation.

Minimum Operating Temperature:

0 °C - Ensures functionality even in low-temperature environments.

Terminal Position:

DUAL - Facilitates easy installation and connection within systems.

Maximum Seated Height:

5.72 mm - Compact size for space-saving installation in tight spaces.

Width:

15.24 mm - Slim profile for efficient use of space on circuit boards.

Minimum Supply Voltage (Vsup):

4.75 V - Allows for operation at lower voltages for energy efficiency.

Length:

36.92 mm - Provides a balanced form factor for easy integration into systems.

Temperature Grade:

COMMERCIAL - Suitable for standard commercial applications.

Technology:

CMOS - Offers low power consumption and high-speed operation.

Parallel or Serial:

PARALLEL - Enables fast data transfer and processing for efficient performance.

Terminal Form:

THROUGH-HOLE - Ensures secure and reliable connections within systems.

Maximum Supply Current:

30 mA - Efficient power usage for cost-effective operation.

No. of Words:

65536 words - Large memory capacity for storing a vast amount of data.

Memory Width:

8 - Provides sufficient data width for processing and storing information.

Terminal Pitch:

2.54 mm - Standard spacing for easy installation and connection in systems.

No. of Words Code:

64K - Easily identifiable code for quick reference and compatibility.

Maximum Supply Voltage (Vsup):

5.5 V - Safe voltage limit for preventing damage to the product.

Memory Density:

524288 bit - High-density memory for storing large amounts of data.

Memory IC Type:

UVPROM - Offers reliable and non-volatile memory storage technology.

Maximum Standby Current:

0.0001 Amp - Ultra-low standby current for energy-efficient operation.

Maximum Access Time:

70 ns - Fast access time for quick data retrieval and processing.

Technical Specifications

EPROM M27C512-70XF1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

70 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-GDIP-T28

JESD-609 Code:

e0

Length:

36.92 mm

Memory Density:

524288 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

28

No. of Words:

65536 words

No. of Words Code:

64K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

64KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Equivalence Code:

DIP28,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Peak Reflow Temperature (C):

NOT SPECIFIED

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Maximum Time At Peak Reflow Temperature (s):

NOT SPECIFIED

Width:

15.24 mm

Trade Compliance

M27C512-70XF1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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