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M27C4001-45XF1

STMicroelectronics

M27C4001-45XF1 by STMicroelectronics

STMicroelectronics M27C4001-45XF1 EPROM features 512KX8 organization, 45 ns access time, and 5V nominal voltage. Ideal for commercial applications requiring reliable non-volatile memory with a memory density of 4Mbit.

Median Price

$5.700

Lifecycle Status

Suppliers In-Stock

10

In-Stock Inventory

1k+

Distributors (In-Stock)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

Bristol Electronics

USA . 1,920 parts In-Stock

1+ parts

$5.700

100+ parts

$2.679

1k+ parts

$2.451

10k+ parts

-

1,920

$5.700

$2.679

$2.451

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Vyrian

USA . 5,134 parts In-Stock

1+ parts

-

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5,134

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Anansix

USA . 2,782 parts In-Stock

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2,782

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Digiode

USA . 1,921 parts In-Stock

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1,921

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Microfarads

USA . 1,851 parts In-Stock

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1,851

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Flex Direct, LLC

USA . 400 parts In-Stock

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400

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Lantek

USA . 68 parts In-Stock

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68

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EMSNET

USA . 8 parts In-Stock

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8

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LWI Electronics Inc

India . 4 parts In-Stock

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4

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Electronics Depot

USA . 4 parts In-Stock

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4

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Distributors (Availability)

Supplier In-Stock 1+ parts 100+ parts 1k+ parts 10k+ parts

IDEA Electronic Components Group

UK . 1,294 parts In-Stock

1+ parts

$4.507

100+ parts

-

1k+ parts

$4.056

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1,294

$4.507

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$4.056

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MKK Technologies

India . 667 parts In-Stock

1+ parts

$8.475

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667

$8.475

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DigiPath Technology Company

USA . 667 parts In-Stock

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$8.475

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667

$8.475

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Microchip USA

USA . 223 parts In-Stock

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$10.378

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223

$10.378

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AZTECH Wire

Italy . 556 parts In-Stock

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$10.830

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556

$10.830

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RC Electronics

USA . 11,880 parts In-Stock

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Corphita

USA . 4,873 parts In-Stock

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Kepictronics

USA . 2,897 parts In-Stock

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A-Z Elektronik GmbH

Germany . 2,018 parts In-Stock

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Alle Elektronik GmbH

Germany . 1,602 parts In-Stock

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1,602

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Parana Technologies

USA . 862 parts In-Stock

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$5.389

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862

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GreenTree Electronics

Israel . 68 parts In-Stock

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Perfect Parts

USA . 9 parts In-Stock

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Overview

Unlock the power of innovation with the M27C4001-45XF1 from STMicroelectronics. As a leading manufacturer in the industry, STMicroelectronics delivers top-quality EPROM products that boast reliability and durability. Ideal for a wide range of applications, this EPROM offers customers seamless integration and optimal performance. Experience the value and benefits of this cutting-edge technology, tailored to meet your specific needs. Elevate your projects with the M27C4001-45XF1 and stay ahead of the curve in today's competitive market.

Feature Benefit Bullets

Package Body Material: CERAMIC, METAL-SEALED COFIRED

The ceramic and metal-sealed co-fired package body material ensures durability and reliability for the EPROM, making it suitable for various industrial applications.

Nominal Supply Voltage / Vsup (V): 5

Operating at a nominal supply voltage of 5V provides stable and consistent power to the EPROM, ensuring reliable performance.

Organization: 512KX8

With an organization of 512KX8, this EPROM offers a high memory capacity and efficient data storage capabilities.

Technology: CMOS

Utilizing CMOS technology ensures low power consumption and high noise immunity, making this EPROM energy-efficient and reliable.

Maximum Access Time: 45 ns

The maximum access time of 45 ns allows for fast read and write operations, improving overall performance and efficiency of the EPROM.

Technical Specifications

EPROM M27C4001-45XF1 attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

Input/Output Type:

COMMON

JESD-30 Code:

R-CDIP-T32

JESD-609 Code:

e3

Length:

41.885 mm

Memory Density:

4194304 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

32

No. of Words:

524288 words

No. of Words Code:

512K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

70 Cel

Minimum Operating Temperature:

0 Cel

Organization:

512KX8

Output Characteristics:

3-STATE

Package Body Material:

CERAMIC, METAL-SEALED COFIRED

Package Code:

Package Equivalence Code:

DIP32,.6

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Power Supplies (V):

5

Qualification:

Not Qualified

Maximum Seated Height:

5.72 mm

Maximum Standby Current:

.0001 Amp

Sub-Category:

EPROMs

Maximum Supply Current:

30 mA

Maximum Supply Voltage (Vsup):

5.25 V

Minimum Supply Voltage (Vsup):

4.75 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Finish:

MATTE TIN

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

15.24 mm

Trade Compliance

M27C4001-45XF1 Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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