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5962-8765004LX

STMicroelectronics

5962-8765004LX by STMicroelectronics

5962-8765004LX by STMicroelectronics is a military-grade EPROM with a 5V supply, featuring asynchronous operation and a max access time of 45 ns. Its ceramic, glass-sealed package ensures durability in harsh environments. Ideal for aerospace and defense applications, it offers reliable data storage with 2048 words capacity.

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1k+

5962-8765004LX by STMicroelectronics
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Digiode

USA . 3,391 parts In-Stock

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Anansix

USA . 2,523 parts In-Stock

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Vyrian

USA . 233 parts In-Stock

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IDEA Electronic Components Group

UK . 1,951 parts In-Stock

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$3.719

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-

1k+ parts

$3.347

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1,951

$3.719

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$3.347

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MKK Technologies

India . 1,983 parts In-Stock

1+ parts

$6.993

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$6.993

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DigiPath Technology Company

USA . 1,983 parts In-Stock

1+ parts

$6.993

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1,983

$6.993

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Northwest PG Solutions

USA . 1,509 parts In-Stock

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1,509

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Native Components

USA . 530 parts In-Stock

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Parana Technologies

USA . 478 parts In-Stock

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$4.446

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$4.446

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Corphita

USA . 91 parts In-Stock

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Overview

Elevate your electronic designs with the 5962-8765004LX EPROM from STMicroelectronics, a trusted leader in high-performance semiconductors. Engineered for reliability and resilience, this military-grade memory solution excels in extreme environments, making it ideal for aerospace, defense, and industrial applications. Experience unparalleled data integrity and faster access times, ensuring your projects perform flawlessly under demanding conditions—it's the smart choice for quality-conscious engineers!

Feature Benefit Bullets

Package Body Material: CERAMIC, GLASS-SEALED

The glass-sealed ceramic package provides enhanced durability and protects the memory chip from environmental factors, making it suitable for demanding applications.

Package Shape: RECTANGULAR

The rectangular shape offers efficient use of PCB space, which is beneficial for compact designs.

Operating Mode: ASYNCHRONOUS

Asynchronous operation allows for faster access times, improving performance in applications requiring quick data retrieval.

Nominal Supply Voltage / Vsup: 5 V

A standard supply voltage of 5V makes integration straightforward with common digital circuits.

No. of Terminals: 24

With 24 terminals, this chip provides ample connection points for various input-output configurations.

Package Style (Meter): IN-LINE, WINDOW

The in-line, window style design allows for easy viewing of the chip's status and enhances accessibility for programming.

Maximum Operating Temperature: 125 °C

This high temperature threshold ensures reliable operation in harsh environments, perfect for military and industrial applications.

Organization: 2KX8

The memory organization of 2K x 8 allows for efficient data structuring and quick access to the stored information.

Minimum Operating Temperature: -55 °C

The -55 °C minimum operating temperature makes this product suitable for extreme conditions, suitable for military and aerospace applications.

Terminal Position: DUAL

Dual terminal positioning allows for flexibility in circuit design and enhances soldering options.

Maximum Seated Height: 5.08 mm

The compact seated height is ideal for space-constrained designs and helps to reduce overall system size.

Width: 7.62 mm

A manageable width allows for easy integration into standard PCBs without requiring extensive modifications.

Minimum Supply Voltage (Vsup): 4.5 V

A minimum supply voltage of 4.5V enables operation under various power supply conditions, enhancing versatility.

Length: 32.005 mm

The specific length ensures compatibility with a range of existing designs and products by maintaining standard dimensions.

Temperature Grade: MILITARY

The military grade ensures higher reliability and longevity in critical applications, meeting stringent defense standards.

Technology: CMOS

CMOS technology offers low power consumption while providing high-speed operation, making it energy efficient.

Parallel or Serial: PARALLEL

Parallel interface allows for multiple bits to be handled simultaneously, providing faster data transfer rates.

Terminal Form: THROUGH-HOLE

Through-hole terminal form enhances the stability of the chip on the PCB, making it easier to handle in rugged applications.

No. of Words: 2048 words

Supporting 2048 words of data ensures adequate memory capacity for a variety of applications.

Memory Width: 8

An 8-bit memory width aligns with common data paths in microcontroller applications, easing compatibility.

Terminal Pitch: 2.54 mm

A terminal pitch of 2.54 mm makes this chip compatible with standard PCB designs and simplifies assembly.

No. of Words Code: 2K

Having 2K words makes it suitable for simple applications, offering a balance between capacity and cost.

Maximum Supply Voltage (Vsup): 5.5 V

A maximum supply voltage of 5.5V allows safe operating margins for protection against voltage spikes.

Memory Density: 16384 bit

The 16Kbit memory density provides a suitable amount of storage for various applications, from simple embedded systems to more complex solutions.

Memory IC Type: UVPROM

This UVPROM type allows for reprogramming through ultraviolet light, providing flexibility in firmware updates.

Maximum Access Time: 45 ns

With a maximum access time of 45 ns, it ensures fast read operations, enhancing overall system performance.

Technical Specifications

EPROM 5962-8765004LX attributes and parameters. Explore more EPROM devices from STMicroelectronics

Specs

Maximum Access Time:

45 ns

JESD-30 Code:

R-GDIP-T24

Length:

32.005 mm

Memory Density:

16384 bit

Memory IC Type:

Memory Width:

8

No. of Functions:

1

No. of Terminals:

24

No. of Words:

2048 words

No. of Words Code:

2K

Operating Mode:

ASYNCHRONOUS

Maximum Operating Temperature:

125 Cel

Minimum Operating Temperature:

-55 Cel

Organization:

2KX8

Package Body Material:

CERAMIC, GLASS-SEALED

Package Code:

Package Shape:

Package Style (Meter):

IN-LINE, WINDOW

Parallel or Serial:

PARALLEL

Qualification:

Not Qualified

Maximum Seated Height:

5.08 mm

Maximum Supply Voltage (Vsup):

5.5 V

Minimum Supply Voltage (Vsup):

4.5 V

Nominal Supply Voltage / Vsup (V):

5

Surface Mount:

NO

Technology:

CMOS

Temperature Grade:

Terminal Form:

THROUGH-HOLE

Terminal Pitch:

2.54 mm

Terminal Position:

DUAL

Width:

7.62 mm

Trade Compliance

5962-8765004LX Memory ICs trade compliance attributes, and parameters.

ECCN

EAR99

ECCN Governance

EAR

HTS

8542.32.00.61

SB

8542.32.00.60

Manufacturer Highlights

STMicroelectronics

STMicroelectronics is a global leader in the semiconductor manufacturing industry, with over 35 years of experience providing innovative and advanced technologies for customers around the world. Headquartered in Netherlands, STMicroelectronics has more than 51,323 employees worldwide and operates across 32 countries all over Europe, Asia-Pacific and the Americas. The company’s portfolio includes integrated circuits, discrete components, application-specific standard products, and computer chipsets. STMicroelectronics serves a wide range of industries such as automotive, consumer markets, healthcare and industrial applications.

Management team

President, CEO

Jean-Marc Chery

President, CFO, Finance, Purchasing,Enterprise Risk Management & Resilience

Lorenzo Grandi

President, Sales & Marketing

Jerome Roux

Manufacturer fab locations 33

Fab name Location Fab Initiation Wafer Capacity

Castelletto

Fabrication

Fab Initiation

1968

Italy

Castelletto

Wafer Capacity

1968

SGFAB AMK 6

Fabrication

Fab Initiation

2000

Singapore

Singapore

Wafer Capacity

29,000

2000

29,000

AG200

Fabrication

Fab Initiation

2000

Italy

Agrate Brianza

Wafer Capacity

14,000

2000

14,000

RST 8

Fabrication

Fab Initiation

2000

France

Rousset

Wafer Capacity

35,000

2000

35,000

Crolles 1

Fabrication

Fab Initiation

1993

France

Crolles

Wafer Capacity

30,000

1993

30,000

Crolles 2-ext. mod 5

Fabrication

Fab Initiation

-

France

Crolles

Wafer Capacity

-

Crolles 2-ext. mod 2

Fabrication

Fab Initiation

2022

France

Crolles

Wafer Capacity

2022

Crolles 2-ext. mod 3

Fabrication

Fab Initiation

2023

France

Crolles

Wafer Capacity

2023

Crolles 2

Fabrication

Fab Initiation

2004

France

Crolles

Wafer Capacity

28,000

2004

28,000

AG200

Fabrication

Fab Initiation

1985

Italy

Agrate Brianza

Wafer Capacity

14,000

1985

14,000

SiC Fab

Fabrication

Fab Initiation

2006

Sweden

Norrköping

Wafer Capacity

10,000

2006

10,000

Fab 3

Fabrication

Fab Initiation

2005

France

Tours

Wafer Capacity

2,000

2005

2,000

Fab 1 & Fab 2

Fabrication

Fab Initiation

1978

France

Tours

Wafer Capacity

55,000

1978

55,000

Fab 2

Fabrication

Fab Initiation

1997

Italy

Catania

Wafer Capacity

30,000

1997

30,000

SGFAB-AMK 6E

Fabrication

Fab Initiation

2003

Singapore

Singapore

Wafer Capacity

145,000

2003

145,000

SGFAB-AMJ 9

Fabrication

Fab Initiation

1984

Singapore

Singapore

Wafer Capacity

152,000

1984

152,000

AG300 (R3)

Fabrication

Fab Initiation

2022

Italy

Agrate Brianza

Wafer Capacity

2022

Fab 2

Fabrication

Fab Initiation

1980

Italy

Catania

Wafer Capacity

25,000

1980

25,000

AG200

Fabrication

Fab Initiation

1987

Italy

Agrate Brianza

Wafer Capacity

34,000

1987

34,000

AG300

Fabrication

Fab Initiation

2024

Italy

Agrate Brianza

Wafer Capacity

2024

Crolles 2-ext. mod 1

Fabrication

Fab Initiation

2020

France

Crolles

Wafer Capacity

2,000

2020

2,000

Fab 1 6-inch fab

Fabrication

Fab Initiation

2013

Italy

Catania

Wafer Capacity

11,000

2013

11,000

SiC 6-inch line

Fabrication

Fab Initiation

2021

Singapore

Singapore

Wafer Capacity

2021

Fab 1 6-inch fab

Fabrication

Fab Initiation

2020

Italy

Catania

Wafer Capacity

2,500

2020

2,500

200mm GaN

Fabrication

Fab Initiation

2021

France

Tours

Wafer Capacity

2,500

2021

2,500

Fab 2

Fabrication

Fab Initiation

2018

Italy

Catania

Wafer Capacity

14,000

2018

14,000

SGFAB-AMK 8

Fabrication

Fab Initiation

2001

Singapore

Singapore

Wafer Capacity

30,000

2001

30,000

Crolles 2- JV Fab

Fabrication

Fab Initiation

2024

France

Crolles

Wafer Capacity

2024

SGFAB-AMK 6

Fabrication

Fab Initiation

2016

Singapore

Singapore

Wafer Capacity

38,125

2016

38,125

SGFAB-AMK 2E

Fabrication

Fab Initiation

2010

Singapore

Singapore

Wafer Capacity

20,000

2010

20,000

Silicon Carbide A.B.

Fabrication

Fab Initiation

2021

Sweden

Norrköping

Wafer Capacity

2021

SiC wafer/EPI Fab

Fabrication

Fab Initiation

2023

Italy

Catania

Wafer Capacity

2023

SiC Device Fab

Fabrication

Fab Initiation

2025

Italy

Catania

Wafer Capacity

2025

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